Week In Review: Design, Low Power
By Jesse Allen - 06 Jul, 2018 - Comments: 0

CAST debuted an IP subsystem implementing the latest IEEE standards for Time Sensitive Networking (TSN) over Ethernet. The TSN_CTRL Subsystem combines three IP cores, a time synchronizer, traffic shaper, and Ethernet MAC. It implements a hardware subsystem that operates without software assistance once programmed. The IP communicates timing information to the system, and allows the system to de... » read more

Design Reuse Vs. Abstraction
By Ann Mutschler - 05 Jul, 2018 - Comments: 1

Chip designers have been constantly searching for a hardware description language abstraction level higher than RTL for a few decades. But not everyone is moving in that direction, and there appear to be enough options available through design reuse to forestall that shift for many chipmakers. Pushing to new levels of abstraction is frequent topic of discussion in the design world, particula... » read more

Verification As A Flow (Part 1)
By Brian Bailey - 05 Jul, 2018 - Comments: 2

Semiconductor Engineering sat down to discuss the transformation of verification from a tool to a flow with Vladislav Palfy, global manager application engineering for OneSpin Solutions; Dave Kelf, chief marketing officer for Breker Verification Systems; Mark Olen, product marketing group manager for Mentor, A Siemens Business; Larry Melling, product management director, System & Verificati... » read more

Blog Review: July 4
By Jesse Allen - 04 Jul, 2018 - Comments: 0

Applied Materials' Sundeep Bajikar argues that to get the full benefits of AI, new computing architectures are needed – and that will require new breakthroughs in materials engineering to get beyond classic 2D scaling. Cadence's Tom Wong considers to what extent chip dis-integration is happening and how the industry can cope with the escalating costs of new process nodes and higher-speed i... » read more

China IP Battle Takes New Turn
By Mark LaPedus - 03 Jul, 2018 - Comments: 0

Micron Technology appears to have suffered a legal setback in its suit against Taiwan’s United Microelectronics Corp. (UMC) in China. On Tuesday, UMC announced that the Fuzhou Intermediate People's Court of the People's Republic of China (PRC) issued a preliminary injunction against Micron Semiconductor (Xi'an) and Micron Semiconductor (Shanghai), enjoining Micron from offering to sell, an... » read more

Manufacturing Bits: July 3
By Mark LaPedus - 03 Jul, 2018 - Comments: 0

X-ray holography Using a technique called X-ray holography, a group of researchers have uncovered the phase transitions of vanadium dioxide. X-ray holography is a promising high-resolution metrology technique. Vanadium dioxide is one of many materials that can exhibit metal or insulator properties depending on the temperature. Vanadium dioxide can switch from an insulating to a metallic pha... » read more

Machine Learning’s Limits
By Ed Sperling - 03 Jul, 2018 - Comments: 0

Semiconductor Engineering sat down with Rob Aitken, an Arm fellow; Raik Brinkmann, CEO of OneSpin Solutions; Patrick Soheili, vice president of business and corporate development at eSilicon; and Chris Rowen, CEO of Babblelabs. What follows are excerpts of that conversation. To view part one, click here. SE: How much of what goes wrong in machine learning depends on the algorithm being wrong... » read more

System Bits: July 3
By Ann Mutschler - 03 Jul, 2018 - Comments: 0

Machine learning network for personalized autism therapy MIT Media Lab researchers have developed a personalized deep learning network for therapy use with children with autism spectrum conditions. They reminded these children often have trouble recognizing the emotional states of people around them, such as distinguishing a happy face from a fearful face. To help with this, some therapists... » read more

Power/Performance Bits: July 3
By Jesse Allen - 03 Jul, 2018 - Comments: 0

Graphene foam devices Scientists at Rice University developed a method for building conductive, three-dimensional objects out of graphene foam, which they say could offer new possibilities for energy storage and flexible electronic sensor applications. The same lab initially created laser-induced graphene, or LIG, in 2014. The process involves heating inexpensive polyimide plastic sheets wi... » read more

ISO 26262 Statistics
By Ed Sperling - 02 Jul, 2018 - Comments: 0

Jorg Gosse, functional safety product manager at OneSpin Solutions, talks about the statistics behind the standards, what is considered good enough, and how those numbers vary across different standards. https://youtu.be/cNTFN3kQ-OM » read more

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