Big Trouble At 3nm
By Mark LaPedus - 21 Jun, 2018 - Comments: 0

As chipmakers begin to ramp up 10nm/7nm technologies in the market, vendors are also gearing up for the development of a next-generation transistor type at 3nm. Some have announced specific plans at 3nm, but the transition to this node is expected to be a long and bumpy one, filled with a slew of technical and cost challenges. For example, the design cost for a 3nm chip could exceed an eye-p... » read more

Defining Edge Memory Requirements
By Ann Mutschler - 20 Jun, 2018 - Comments: 0

Defining edge computing memory requirements is a growing problem for chipmakers vying for a piece of this market, because it varies by platform, by application, and even by use case. Edge computing plays a role in artificial intelligence, automotive, IoT, data centers, as well as wearables, and each has significantly different memory requirements. So it's important to have memory requirement... » read more

CMOS-Embedded STT-MRAM Arrays In 2xnm Nodes For GP-MCU Applications
By GlobalFoundries - 20 Jun, 2018 - Comments: 0

Perpendicular Spin-Transfer Torque (STT) MRAM is a promising technology in terms of read/write speed, low power consumption and non-volatility, but there has not been a demonstration of high density manufacturability at small geometries. In this paper we present an unprecedented demonstration of a robust STT-MRAM technology designed in a 2x nm CMOS- embedded 40 Mb array. Key features are full a... » read more

Blog Review: June 20
By Jesse Allen - 20 Jun, 2018 - Comments: 0

Mentor's Randy Allen digs into OpenACC, a collection of directives and routines to help a compiler uncover and schedule parallelism, plus an examination of the GCC implementation's performance. Cadence's Paul McLellan takes a look at the shifting opinions on FD-SOI vs. finFET as Dan Hutcheson of VLSI Research finds most see the two as complementary technologies in his latest survey. Synop... » read more

High-Volume Manufacturing Device Overlay Process Control
By KLA - 20 Jun, 2018 - Comments: 0

By Honggoo Leea, Sangjun Hana, Jaeson Wooa, DongYoung Leea, ChangRock Songa, Hoyoung Heob, Irina Brinsterb, DongSub Choic, John C. Robinsonb aSK Hynix, 2091, Gyeongchung-daero, Bubal-eub, Icheon-si, Gyeonggi-do, 467-701, Korea bKLA-Tencor Corp., 8834 N. Capital of Texas Hwy, Austin, TX 78759 cKLA-Tencor Korea, Starplaza bldg.., 53 Metapolis-ro, Hwasung City, Gyeonggi-do, Korea Abstract ... » read more

Manufacturing Bits: June 19
By Mark LaPedus - 19 Jun, 2018 - Comments: 0

Cellulose nanopaper The Qingdao Institute of Bioenergy and Bioprocess Technology (QIBEBT) of the Chinese Academy of Sciences in China has developed a new type of cellulose nanopaper (CNP). CNP is a renewable material with good mechanical and optical properties. Potentially, CNP could be used in several applications, such as electronic devices, visual display substrates, batteries and barrie... » read more

Power/Performance Bits: June 19
By Jesse Allen - 19 Jun, 2018 - Comments: 0

Tandem solar reaches 25.2% efficiency In the push for ever-more efficient solar panels, researchers are turning to tandem, or double-junction, photovoltaics. Tandem solar panels use two different types of solar cell capable of absorbing different wavelengths of light stacked on top of each other to maximize the conversion of light rays into electrical power. Recently, two groups have reache... » read more

System Bits: June 19
By Ann Mutschler - 19 Jun, 2018 - Comments: 0

ML algorithm 3D scan comparison up to 1,000 times faster To address the issue of medical image registration that typically takes two hours or more to meticulously align each of potentially a million pixels in the combined scans, MIT researchers have created a machine-learning algorithm they say can register brain scans and other 3D images more than 1,000 times more quickly using novel learning... » read more

It Takes A Village To Get A Design Done
By Ciarán Dunne - 18 Jun, 2018 - Comments: 0

No one lacks for brilliant ideas these days. In fact, it’s a golden age of innovation. But where the pace of innovation can slow is getting that idea to market. Take for example, the case of one of S3 Semiconductors' customers.. It recently developed a custom chip solution for a company in the oil and gas industry that was creating complex valve controllers that sensed pressure and tempera... » read more

IoT Wireless Battles Ahead
By Brian Bailey - 18 Jun, 2018 - Comments: 0

"The good thing about standards is that there are so many to choose from." – Andrew S. Tanebaum The extended version of that quote adds "furthermore, if you do not like any of them, you can just wait for next year's model." That could not be truer when it comes to IoT and wireless connectivity. Every standards group is rushing to create new versions of existing standards that use less p... » read more

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