Enabling Ethernet Time-Sensitive Networking With Automotive-Certified IP


Automotive systems are becoming more sophisticated as they combine ADAS applications from emergency braking, collision avoidance, lane departure warning to fully autonomous driving, making predictable latency and guaranteed bandwidth in the automotive network critical. These applications require a high volume of data from different parts of the car for processing and decision making. Due to the... » read more

CEO Outlook On Chip Industry (Part 3)


Semiconductor Engineering sat down with Wally Rhines, president and CEO of Mentor, a Siemens Business; Simon Segars, CEO of Arm; Grant Pierce, CEO of Sonics; and Dean Drako, CEO of IC Manage. What follows are excerpts of that conversation. To view part one, click here. Part two is here. L-R: Dean Drako, Grant Pierce, Wally Rhines, Simon Segars. Photo: Paul Cohen/ESD Alliance SE: Securit... » read more

Three Steps To Low Power Coverage Closure


By Awashesh Kumar and Madhur Bhargava Low-power design and verification is becoming more complex. Yet it is critical that all power elements are verified, and it is even more important to verify the complex interactions between these elements at a high abstraction level. However, power-aware coverage closure is difficult to attain and complex by nature. Existing low-power coverage methodo... » read more

Can Machine Learning Chips Help Develop Better Tools With Machine Learning?


As we continue to be bombarded with AI- and machine learning-themed presentations at industry conferences, an ex-colleague told me that he is sick of seeing an outline of the human head with a processor in place of the brain. If you are a chip architect trying to build one of these data-centric architecture chips for machine learning or AI (as opposed to the compute-centric chips, which you pro... » read more

The Week In Review: Manufacturing


Chipmakers and OEMs Tesla Motors has been struggling to get its new electric car, the Model 3, out the door. And it recently implemented a layoff amid ongoing losses. But the struggling car maker could be in the midst of a rebound. “Based on our checks, we believe the perceived quality of Model 3s coming off the lines continue to improve relative to prior checks, and we view this as one of t... » read more

The Week In Review: Design


M&A MIPS has reportedly been acquired again, this time by AI startup Wave Computing. Wave focuses on data center-based neural network training using its parallel dataflow processing architecture. In March, the company signed on to use 64-bit multi-threaded processor cores from MIPS in future projects. Previously, MIPS was owned by Tallwood Venture Capital, which acquired MIPS from Imaginat... » read more

The Week in Review: IoT


Tools/Chips Synopsys rolled out a new release of its automotive exterior lighting design and analysis software. The tool calculations and generates images for multiple viewing directions and different lighting conditions. Lighting on vehicles has become far more complex than just shining a beam on the road. The latest technology can adapt to road conditions, other cars, and help illuminate the... » read more

Blazing-Fast Performance


When it comes to raw performance, there's nothing like a supercomputer. Until recently, though, most of this was simply bragging rights about whose supercomputer was faster. A trillion calculations (petaflop), more or less, doesn't mean that much outside of scientific circles. What's changing is that companies and governments now can utilize these blazing fast machines across a wider swath o... » read more

Is It Time To Take Inductance And Electromagnetic Effects On SoCs Seriously?


Electromagnetic (EM) crosstalk impact on SoC performance has been a topic of discussion for a number of years, but how seriously have designers put EM crosstalk detection and avoidance into their SoC design practice? With increasing demand for faster bandwidth, lower power and higher density electronic systems, isn’t it about time to take inductance and EM effects seriously? This topic will b... » read more

Beyond Signoff


The future of connectivity is very promising - the new era of semiconductors will give rise to transformational products that will enable seamless connectivity with 5G, smarter devices with AI, next generation mobility with autonomous vehicles and immersive experiences with AR and VR. These cutting-edge electronics systems will require the use of advanced sub-16nm SoCs and complex packaging tec... » read more

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