SEM Analysis Reveals Real Cause Of Chip Failure
By DELTA, a part of FORCE Technology - 08 Jul, 2019 - Comments: 0

When it comes to ASIC design, DELTA’s motto is “first time right”. When the first wafers from the wafer fab showed severe electrical malfunction, we were extremely frustrated. To investigate the failure, the design team started electrical characterization of prototypes. Overall, a short between power and ground was observed and furthermore RF inputs exhibited strange VI characteristics. T... » read more

Advanced Features Of High Speed Digital I/O Devices: Double Data Rate
By NI - 08 Jul, 2019 - Comments: 0

As clock speeds and data rates continue to increase, designers of digital integrated circuits are creating new ways to maximize the rate of data being sent into and out of digital devices. One such method is known as double data rate (DDR). With single data rate (SDR) devices, data is latched on either the rising or falling edges of the sample clock. A DDR device latches data on both the rising... » read more

Addressing High Precision Automated Optical Inspection Challenges With 3D Technology
By CyberOptics - 08 Jul, 2019 - Comments: 0

Driven by the continued decrease in the size of electronics packaging, combined with the increase in density, there is a critical need for highly accurate 3D inspection for defect detection. Using multi-view 3D sensors and parallel projection, it is possible to capture more of the board at a faster rate as compared to serial image acquisition which is more time consuming. Precise 3D image re... » read more

EDA, IP Grow 16.3%
By Ed Sperling - 08 Jul, 2019 - Comments: 0

EDA and IP revenue rebounded in Q1, with all geographies reporting increases, according to the ESD Alliance Market Statistics Service. Total revenue increased to 16.3% to $2.606 billion, up from $2.241 billion in the same period in 2018. The global numbers do not reflect the impact of a trade war between the United States and China, which occurred in Q2, but they do point to a significant re... » read more

HW/SW Design At The Intelligent Edge
By Ann Mutschler - 08 Jul, 2019 - Comments: 0

Adding intelligence to the edge is a lot more difficult than it might first appear, because it requires an understanding of what gets processed where based on assumptions about what the edge actually will look like over time. What exactly falls under the heading of Intelligent Edge varies from one person to the next, but all agree it goes well beyond yesterday’s simple sensor-based IoT dev... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 05 Jul, 2019 - Comments: 0

Fab tools and materials Applied Materials has signed a definitive agreement to acquire Kokusai Electric for $2.2 billion in cash from investment firm KKR. With the acquisition of Kokusai’s semiconductor equipment unit, Applied expands its customer base and gains a foothold in the batch processing equipment business, where a tool can process wafers in parallel. Applied’s strength is in the ... » read more

Week in Review – IoT, Security, Auto
By Jeff Dorsch - 05 Jul, 2019 - Comments: 0

Products/Services Synopsys announced successful deployment of the Synopsys Yield Explorer yield learning platform for fast ramp-up of new products on Samsung's advanced finFET technology nodes. Using the secure data exchange mechanism in Yield Explorer, Samsung is able to share the data required for yield analysis, such as chip design, fab, and test, with its customers while maintaining the co... » read more

Week In Review: Design, Low Power
By Jesse Allen - 05 Jul, 2019 - Comments: 0

Si2's Unified Power Model has been approved as IEEE 2416-2019, a new Standard for Power Modeling to Enable System Level Analysis, which complements UPF/IEEE 1801-2018. UPM/IEEE 2416-2019 provides a set of power modeling semantics enabling system designers to model entire systems with flexibility. It supports power modeling from abstract design description to gate level implementation, providing... » read more

Manufacturing Bits: July 3
By Mark LaPedus - 03 Jul, 2019 - Comments: 0

Gamma-ray inspection The Defense Advanced Research Projects Agency (DARPA) has started a program to develop gamma-ray inspection techniques. The effort, called the Gamma Ray Inspection Technology (GRIT) program, is aimed to develop gamma-ray radiation sources in compact form factors for use in national security, industrial, and medical applications. [caption id="attachment_24151285" alig... » read more

Blog Review: July 3
By Jesse Allen - 03 Jul, 2019 - Comments: 0

Cadence's Paul McLellan digs into 5G with a two-part post explaining the basics of the technology, what makes it so different from 4G, and the challenges ahead including the limitations of mmWave. Synopsys' Vikramjeet Bamel and Pankaj Sharma note the features that make GDDR6 a dominant memory in the high performance segment and allowing it to expand beyond graphics to automotive, AI, and AR/... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2026 SMG   |  Terms of Service  |  Privacy Policy