Blog Review: Mar. 7
By Jesse Allen - 07 Mar, 2018 - Comments: 0

Synopsys' Amit Paunikar and Shaily Khare take a look at new features in LPDDR5, from improved data bandwidth and Deep Sleep Mode to WCK clock. Cadence's Paul McLellan dives into forward error correction, a technique for automatically correcting errors in transmitted network data, with a look at why it's important and how it works. In his latest embedded software video, Mentor's Colin Wall... » read more

Manufacturing Bits: March 6
By Mark LaPedus - 06 Mar, 2018 - Comments: 0

Security ICs with multi-beam Leti, a research institute of CEA Tech, and Mapper Lithography have developed a new application for its multi-beam, direct-write lithography technology—security. In 2016, Mapper Lithography introduced the FLX-1200, a direct-write, multi-beam e-beam system. Using a 5-kV acceleration voltage, a beam generator creates an electron beam about 3cm in diameter. Then,... » read more

System Bits: March 6
By Ann Mutschler - 06 Mar, 2018 - Comments: 0

Printed graphene biosensors According to researchers at the Fraunhofer Institute for Biomedical Engineering IBMT in St. Ingbert (in Germany’s Saarland region), cell-based biosensors can simulate the effect of various substances, such as drugs, on the human body in the laboratory but depending on the measuring principle, producing them can be expensive. As such, they aren’t used very often.... » read more

Power/Performance Bits: Mar. 6
By Jesse Allen - 06 Mar, 2018 - Comments: 0

Neural network chip Neural networks are both slow and consume a lot of power. This made researchers at MIT examine the important aspects of the nodes within a neural network and to see how each part of the computation could be improved. The outcome was a dedicated chip that increases the speed of neural-network computations by three to seven times over its predecessors, while reducing power c... » read more

Is Advanced Packaging The Next SoC?
By Ed Sperling - 05 Mar, 2018 - Comments: 1

Device scaling appears to be possible down to 1.2nm, and maybe even beyond that. What isn't obvious is when scaling will reach that node, how many companies will actually use it, or even what chips will look like when foundries actually start turning out these devices using multi-patterning with high-NA EUV and dielectrics with single-digit numbers of atoms. There are two big changes playing... » read more

Xcerra: Back to the Drawing Board
By Jeff Dorsch - 05 Mar, 2018 - Comments: 0

It’s been nearly two weeks since Xcerra and Hubei Xinyan Equity Investment Partnership announced they have terminated their merger agreement in the face of apparent opposition by the Committee on Foreign Investment in the United States, the federal interagency panel that reviews transactions for their impacts on national security. Xcerra and Hubei Xinyan also withdrew their CFIUS application.... » read more

5G New Radio Signal Design
By David Vye - 05 Mar, 2018 - Comments: 0

By Gent Paparisto, Joel Kirshman, and David Vye The CP-OFDM modulation scheme will have many options. Variable subcarrier spacing (SCS) will be 3.75, 15, 30, 60, 120, 240, 480 kHz with sub-1 GHz of 15 and 30 kHz and sub-6 GHz of 15, 30, and 60 kHz, and above 6 GHz of 60 and 120 kHz. There will be normal and extended CP options. Slot duration will be 0.5 ms, subframe curation will be 1 ms, an... » read more

Toward High-End Fan-Outs
By Ed Sperling - 05 Mar, 2018 - Comments: 1

Foundries and OSATs are working on more advanced fan-outs, including some with vertically stacked die inside the package, filling a middle ground between lower-cost fan-outs and systems in package on one side and 2.5D and 3D-ICs on the other. These new [getkc id="202" kc_name="fan-outs"] have denser interconnects than previous iterations, and in some cases they include multiple routing layer... » read more

TATA Motors Builds HIL Test System For Hybrid Vehicle Simulation Using NI Tools
By NI - 05 Mar, 2018 - Comments: 0

The Challenge: Developing a scalable, flexible, and universal hardware-in-the-loop (HIL) platform to validate the integration of multiple electronic control units (ECUs) for a parallel hybrid vehicle. The Solution: Using the scalability of the PXI platform and the out-of-the-box functionality of NI VeriStand software to build a test system that could test six interconnected vehicle ECUs toge... » read more

Finding Faulty Auto Chips
By Mark LaPedus - 05 Mar, 2018 - Comments: 1

The next wave of automotive chips for assisted and autonomous driving is fueling the development of new approaches in a critical field called outlier detection. KLA-Tencor, Optimal+, as well as Mentor, a Siemens Business, and others are entering or expanding their efforts in the outlier detection market or related fields. Used in various industries for several years, outlier detection is one... » read more

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