New Package Solutions for Automotive Optical Sensors
By Amkor - 22 May, 2025 - Comments: 0

This article introduces the development of a new optical ball grid array (OBGA) packaging platform designed for automotive applications, with a focus on platform development and compliance with the Automotive Electronics Council (AEC) AEC-Q100 Grade 2 reliability standard. The proposed packaging solution extends beyond traditional cavity OBGA packages, which have been primarily utilized for mic... » read more

Advanced Packaging Depends On Materials And Co-Design
By Katherine Derbyshire - 22 May, 2025 - Comments: 0

Multi-die assemblies offer significant opportunities to boost performance and reduce power, but these complex packages also introduce a number of new challenges, including die-to-RDL misalignment, evolving warpage profiles, and CTE mismatch. Heterogeneous integration — an umbrella term that covers many different applications and packaging requirements — holds the potential to combine com... » read more

Optimization Approach For The Dispensing of Thermal Interface Material (KIT, Robert Bosch)
By Technical Paper Link - 21 May, 2025 - Comments: 0

A new technical paper titled "TIMtrace: Coverage Path Planning for Thermal Interface Materials" was published by researchers at Karlsruhe Institute of Technology (KIT) and Robert Bosch GmbH. Abstract "Thermal Interface Materials are used to transfer heat from a semiconductor to a heatsink. They are applied along a dispense path onto the semiconductor and spread over its entire surface once ... » read more

Future-proofing AI Models
By Ann Mutschler - 21 May, 2025 - Comments: 0

Experts At The Table: Making sure AI accelerators can be updated for future requirements is becoming essential due to the rapid introduction of new models. Semiconductor Engineering sat down to discuss the challenges of future-proofing these designs with Marc Meunier, director of ecosystem development at Arm; Jason Lawley, director of product marketing for AI IP at Cadence; Paul Karazuba, vic... » read more

Blog Review: May 21
By Jesse Allen - 21 May, 2025 - Comments: 0

Synopsys’ Frank Malloy listens in on a panel discussing the engineering challenges introduced by multi-die designs, from multi-physics interactions that impact power and thermal integrity to the availability of multi-die packages and industry standards. Siemens’ Bruce Caryl shows how to determine how much a design’s power delivery network is contributing to jitter on the output drivers... » read more

Transformation Of 2D-ICs Into 3D-ICs Using Shuttle Chips From Multi-Project Wafers (Tohoku University)
By Technical Paper Link - 20 May, 2025 - Comments: 0

A new technical paper titled "Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding" was published by researchers at Tohoku University. Abstract "Three-dimensional integrated circuit (3D-IC) technology, often referred to as through-silicon via (TSV) formation technology, has been steadily maturing and is increasingly used in advanced semic... » read more

Overview Of 103 Research Papers On Automatic SEM Image Analysis Algorithms For Semiconductor Defect Inspection (KU Leuven, Imec)
By Technical Paper Link - 20 May, 2025 - Comments: 0

A new technical paper titled "Scanning electron microscopy-based automatic defect inspection for semiconductor manufacturing: a systematic review" was published by researchers at KU Leuven and imec. "We identified, categorized, and discussed automatic defect inspection algorithms that analyze scanning electron microscopy (SEM) images for semiconductor manufacturing (SM). This is a topic of c... » read more

Open-Source And Royalty-Free Confidential Computing For Embedded RISC-V Systems (IBM, Max Planck)
By Technical Paper Link - 20 May, 2025 - Comments: 0

A new technical paper titled "ACE: Confidential Computing for Embedded RISC-V Systems" was published by researchers at IBM Research, IBM T.J. Watson Research Center, Max Planck Institute for Software Systems (MPI-SWS). Abstract "Confidential computing plays an important role in isolating sensitive applications from the vast amount of untrusted code commonly found in the modern cloud. We a... » read more

Energy-Aware DL: The Interplay Between NN Efficiency And Hardware Constraints (Imperial College London, Cambridge)
By Technical Paper Link - 20 May, 2025 - Comments: 0

A new technical paper titled "Energy-Aware Deep Learning on Resource-Constrained Hardware" was published by researchers at Imperial College London and University of Cambridge. Abstract "The use of deep learning (DL) on Internet of Things (IoT) and mobile devices offers numerous advantages over cloud-based processing. However, such devices face substantial energy constraints to prolong batte... » read more

Air-Gap Covert Channel Attack On Spread Spectrum Modulated Clocks (IETR, Lab-STICC)
By Technical Paper Link - 20 May, 2025 - Comments: 0

A new technical paper titled "Clock-to-Clock Modulation Covert Channel" was published by researchers at University of Rennes-INSA Rennes-IETR-UMR  and University of South Brittany/Lab-STICC- UMR CNRS. Abstract "Various Electromagnetic (EM) attacks have been developed to modulate and utilize EM emanations for covert communication, including exploiting processors, memory modules, and periphe... » read more

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