Multi-Die Health And Reliability: UCIe Advances
By Faisal Goriawalla - 06 Mar, 2025 - Comments: 0

Although multi-die designs — an increasingly popular approach for integrating heterogeneous and homogenous dies into a single package — help resolve problems related to chip manufacturing and yield, they introduce a host of complexities and variables that must be addressed. In particular, designers must work diligently to ensure the health and reliability of their multi-die chip throughout ... » read more

Driving The Future Of Electrified Commercial Vehicles
By Sijia Zhang - 06 Mar, 2025 - Comments: 0

The transition to electrified transportation is transforming industries worldwide, with commercial vehicles leading the charge toward sustainability. From eTrucks and eBuses to agricultural and construction vehicles, electrification is creating exciting opportunities for innovation, efficiency, and environmental impact. However, these vehicles come with unique challenges, such as higher energy ... » read more

Secure Interfaces for Critical Semiconductor Applications
By Synopsys - 06 Mar, 2025 - Comments: 0

Security is now a concern for nearly all semiconductors in nearly all applications. Once of high interest mostly for military and financial systems, both the increasingly connected world and the plethora of existing security threats have changed the landscape dramatically. Every aspect of electronic system design—hardware, firmware, and software—has its own sets of risks and requirements to... » read more

Shift Left With Calibre Pattern Matching
By Siemens EDA - 06 Mar, 2025 - Comments: 0

As integrated circuit (IC) designs become increasingly complex, early-stage verification is crucial to ensure productivity and quality in design processes. The "shift left" verification approach, enabled by Siemens’ Calibre nmPlatform, helps IC design teams to identify and resolve critical issues much earlier in the design cycle. As part of the shift left platform, Calibre Pattern Matching... » read more

Seamless ECAD and MCAD Collaboration
By Cadence - 06 Mar, 2025 - Comments: 0

Integrating electronic computer-aided design (ECAD) and mechanical computer-aided design (MCAD) systems is critical for achieving efficient and accurate design outcomes in the rapidly evolving landscape of product design. This article explores the prevalent challenges designers and engineers face in ECAD-MCAD integration and how these challenges can be effectively addressed through integrating ... » read more

Wearable Connectivity, AI Enable New Use Cases
By Liz Allan - 06 Mar, 2025 - Comments: 0

The sensing and processing technology used in smart phones, watches, and rings is starting to be being deployed in a wide variety of wearable devices, ranging from those that fill the gap between sports and med tech, to haptic devices to assist the visually impaired and AR/VR glasses. Emerging applications include payment, building, and factory wearables. Most of these devices process signal... » read more

Automakers Grapple With Fundamental Tech Changes
By Ann Mutschler - 06 Mar, 2025 - Comments: 0

Automotive OEMs are wrestling with a stack of changes that affect every part of their business and technology, from threats of tariffs and shifting geopolitical alliances, to new vehicle architectures, tighter market windows, and a fundamental reordering of relationships and priorities between OEMs and their suppliers. There is no consistency to these developments or a best path to solving t... » read more

Understanding And Navigating The Complexities of Health Monitoring For Power Supplies
By Infineon - 06 Mar, 2025 - Comments: 0

This white paper introduces an innovative solution, which is designed to transform traditional reliability prediction procedures into the industry’s first commercially available embedded power supply health monitoring solution. This approach uses cutting-edge embedded data analytics on real-time telemetry data and a power system reliability model to dynamically recalculate the failure rate of... » read more

Scenario Coverage In Formal Verification
By Ed Sperling - 05 Mar, 2025 - Comments: 0

A rapid increase in complexity with heterogeneous assemblies and advanced-node chips is raising all sorts of questions on the formal verification side about the completeness of coverage. Engineers may assume proofs are complete, but in many cases they're black boxes that provide little or no insights into what's actually being proven. This is where scenario coverage comes into play. Ashish Darb... » read more

Verification Experts Vs. Generalists
By Ann Mutschler - 05 Mar, 2025 - Comments: 0

Experts At The Table: As chips and systems become more complicated, more verification tasks get abstracted. So do we need more specialists who are experts in specific tasks, or do we need more generalists who know how to use the tools but don't necessarily have the depth of understanding? Or do we need some way to balance both? Semiconductor Engineering sat down with a panel of experts, includi... » read more

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