Sustainable Rail Transportation With High Power SiC Modules: Part 1
By Diana Car - 05 Sep, 2024 - Comments: 0

The process of electrification of railways, though crucial for achieving net-zero climate targets, is nevertheless far from being complete.  Let's delve into how high-power semiconductor technologies are accelerating the decarbonization of rail transport, making it cleaner, safer, and smarter. Decarbonization of transportation: Unraveling the global picture According to the International Ene... » read more

Exploring Machine Learning Enabled Microcontrollers As An Alternative To Linux-Based MPUs
By Infineon - 05 Sep, 2024 - Comments: 0

In today’s rapidly evolving technology landscape, the distinction between microcontrollers (MCUs) and micro processors (MPUs) is blurring with the introduction of high-performance Arm Cortex M processors. A compelling proposition emerges when a highly integrated device, PSOC™ Edge MCU, combines the power of the Cortex®M55 with advanced graphic peripherals, DSP Helium, and a neural net... » read more

Bird’s Eye View on Tensilica Vision DSPs
By Cadence - 05 Sep, 2024 - Comments: 0

The increasing use of cameras in automotive advanced driver assistance systems (ADAS) has resulted in a greater demand for the capability and performance of vision applications. This demand requires sophisticated vision processing algorithms and powerful digital signal processors (DSPs) to run them. Because of the limited power and cost budgets of these embedded systems, it is important t... » read more

Microfluidic Cooling Design For Hotspots in Thermal Design Power Chips (Corintis)
By Technical Paper Link - 04 Sep, 2024 - Comments: 0

A new technical paper titled "Glacierware: Hotspot-aware Microfluidic Cooling for High TDP Chips using Topology Optimization" was published by researchers at Corintis. Abstract: "The continuous increase in computational power of GPUs, essential for advancements in areas like artificial intelligence and data processing, is driving the adoption of liquid cooling in data centers. Skived copper... » read more

Scalable Chiplet System for LLM Training, Finetuning and Reduced DRAM Accesses (Tsinghua University)
By Technical Paper Link - 04 Sep, 2024 - Comments: 0

A new technical paper titled "Hecaton: Training and Finetuning Large Language Models with Scalable Chiplet Systems" was published by researchers at Tsinghua University. Abstract "Large Language Models (LLMs) have achieved remarkable success in various fields, but their training and finetuning require massive computation and memory, necessitating parallelism which introduces heavy communicat... » read more

ECTC 2024 Session Readout: Advancement of Metrology
By Technical Paper Link - 04 Sep, 2024 - Comments: 0

A Electronic Components and Technology Conference (ECTC) session report titled "2024 ECTC Special Session Report: Advancing Metrology for Next-Generation Microelectronics" was published by NIST, Binghamton University, and TechSearch International. Abstract: "Metrology plays a pivotal role in semiconductor research, manufacturing, packaging and assembly. It is critical to the success of this... » read more

Cooling Technology For Next Gen Power Electronics
By Technical Paper Link - 04 Sep, 2024 - Comments: 0

A new technical paper titled "Advances in Two-Phase Cooling for Next Power Electronics Converters" was published by researchers at ROMA TRE University, ENEA Casaccia Research Center and Sapienza University. "The proposed arrangement allows a greater extraction of the heat at a very low flow rate of the cooling fluid, even with standard industrial-grade heat-sinks, which motivates the use of ... » read more

Large-Scale VFETs With Ultra-Short Channel Length And High Performance
By Technical Paper Link - 04 Sep, 2024 - Comments: 0

A new technical paper titled "Large-scale sub-5-nm vertical transistors by van der Waals integration" was published by researchers at Hunan University. "Here, we demonstrate a layer-by-layer transfer process of large-scale indium gallium zinc oxide (IGZO) semiconductor arrays and metal electrodes, and realize large-scale VFETs with ultra-short channel length and high device performance," sta... » read more

Liquid Cooling, Meeting The Demands Of AI Data Centers
By Barry Pangrle - 04 Sep, 2024 - Comments: 0

Many Porsche “purists” reflect forlornly upon the 1997, 5th generation, 996 version of the iconic 911 sports car. It was the first year of the water-cooled engine versions of the 911, which had previously been based on air-cooled engines since their entry into the market in 1964. The 911 was also the successor to the popular air-cooled 356. For over three decades, Porsche’s flagship 911 w... » read more

New AI Processors Architectures Balance Speed With Efficiency
By Ed Sperling - 04 Sep, 2024 - Comments: 1

Leading AI systems designs are migrating away from building the fastest AI processor possible, adopting a more balanced approach that involves highly specialized, heterogeneous compute elements, faster data movement, and significantly lower power. Part of this shift revolves around the adoption of chiplets in 2.5D/3.5D packages, which enable greater customization for different workloads and ... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy