Energy Efficiency As A Native Network Attribute Through 6G
By Michele Robinson-Pontbriand - 29 Aug, 2024 - Comments: 0

Energy efficiency offers positive societal benefits in both environmental and economic ways, such as lowering pollutants and utility bills. As such, the global community is looking toward technological advancements to help drive a more sustainable future. One such technology that offers opportunities in this space is 6G. Utilizing its unparalleled speed and connectivity, and powered by the tran... » read more

AI’s Role In Chip Design Widens, Drawing In New Startups
By Karen Heyman - 29 Aug, 2024 - Comments: 0

Using AI in EDA is reinvigorating the whole tools industry, prompting established players to upgrade their tool offerings with AI/ML features, while drawing in startups trying to carve out differentiated approaches to fill unaddressed gaps with new tools and methodologies. Today’s new generation of entrepreneurs is comprised of both young post-grads with innovative ideas and industry veter... » read more

Edge Devices Require New Security Approaches
By Adam Kovac - 29 Aug, 2024 - Comments: 0

The diversity of connected devices and chips at the edge — the vaguely defined middle ground between the end point and the cloud — is significantly widening the potential attack surface and creating more opportunities for cyberattacks. The edge build-out has been underway for at least the past half-decade, largely driven by an explosion in data and increasing demands to process that data... » read more

GDDR7: The Ideal Memory Solution In AI Inference
By Frank Ferro - 29 Aug, 2024 - Comments: 1

The generative AI market is experiencing rapid growth, driven by the increasing parameter size of Large Language Models (LLMs). This growth is pushing the boundaries of performance requirements for training hardware within data centers. For an in-depth look at this, consider the insights provided in "HBM3E: All About Bandwidth". Once trained, these models are deployed across a diverse range of... » read more

Defining The Chiplet Socket
By Brian Bailey - 29 Aug, 2024 - Comments: 0

Experts At The Table: The semiconductor industry has been buzzing with the possibilities surrounding chiplets, but so far this packaging technology has been confined to large semiconductor companies that are vertically integrated. The industry has been attempting to open this up to a broader group of people. To work out what this means for chiplets, and what standardization will be required, Se... » read more

Accelerating The Pace And Precision Of AI Chip Innovation
By Stelios Diamantidis - 29 Aug, 2024 - Comments: 0

The Hot Chips 2024 conference, which took place this week in Silicon Valley, was a showcase for AI chip innovation. The three-day program illustrated the race among both established chipmakers and new entrants to explore advanced architectures and embrace novel design solutions to deliver the next breakthrough AI processor. In this article, I share a few “hot takes” from the conference that... » read more

Ready For Curvilinear: New Innovations For Resistance Extraction
By Siemens EDA - 29 Aug, 2024 - Comments: 0

The rapid evolution of semiconductor industry, fueled by the propagation of IOT applications, image sensors, photonics and MEMS applications and other emerging technologies dramatically increased the complexity of IC design. Designers often use unconventional structures to achieve the desired functionality and optimal performance. For example, image sensors use wide polygons in the layout and a... » read more

Analysis of the Errors of High-Fidelity Two-Qubit Gates in Silicon Quantum Dots (UNSW et al.)
By Technical Paper Link - 28 Aug, 2024 - Comments: 0

A new technical paper titled "Assessment of the errors of high-fidelity two-qubit gates in silicon quantum dots" was published by researchers at UNSW, Diraq, Sandia National Laboratories, Keio University, Leibniz-Institut für Kristallzüchtung and others. Abstract "Achieving high-fidelity entangling operations between qubits consistently is essential for the performance of multi-qubit syst... » read more

DL Compiler for Efficiently Utilizing Inter-Core Connected AI Chips (UIUC, Microsoft)
By Technical Paper Link - 28 Aug, 2024 - Comments: 0

A new technical paper titled "Scaling Deep Learning Computation over the Inter-Core Connected Intelligence Processor" was published by researchers at UIUC and Microsoft Research. Abstract "As AI chips incorporate numerous parallelized cores to scale deep learning (DL) computing, inter-core communication is enabled recently by employing high-bandwidth and low-latency interconnect links on th... » read more

Real-Time Safety Monitoring
By Ed Sperling - 28 Aug, 2024 - Comments: 0

Various types of semiconductor test will determine whether a chip is free of defects and meets the specification, but understanding how it's behaving in the field under real workloads and harsh ambient conditions may be very different in automotive applications, where vibration, heat, cold can disrupt the normal functioning of a chip over time and reduce its lifespan. Alex Burlak, vice presiden... » read more

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