Week In Review: Design, Low Power
By Linda Christensen - 24 Mar, 2023 - Comments: 0

Renesas will acquire Panthronics, a fabless semiconductor company specializing in high-performance wireless products, expanding its reach into near-field communications for financial, IoT, asset tracking, wireless charging, and automotive applications. The two companies already had collaborated on designs for mobile point-of-sale terminals, wireless charging, and smart metering. Renesas also... » read more

Innovations in Device Design of The Gate-All-Around (GAA) Nanosheet FETs (IBM Research)
By Technical Paper Link - 23 Mar, 2023 - Comments: 0

A technical paper titled "A Review of the Gate-All-Around Nanosheet FET Process Opportunities" was published by researchers at IBM Research Albany. Abstract: "In this paper, the innovations in device design of the gate-all-around (GAA) nanosheet FET are reviewed. These innovations span enablement of multiple threshold voltages and bottom dielectric isolation in addition to impact of channel... » read more

Easy-To-Use Mechanical Frequency Comb Platform (TU Delft)
By Technical Paper Link - 23 Mar, 2023 - Comments: 0

A new technical paper titled "Mechanical overtone frequency combs" was published by researchers at Delft University of Technology, Ahmedabad University and NIST. Abstract "Mechanical frequency combs are poised to bring the applications and utility of optical frequency combs into the mechanical domain. So far, their main challenge has been strict requirements on drive frequencies and power,... » read more

Integrating MEMS with Standardized Silicon Photonics Technology
By Technical Paper Link - 23 Mar, 2023 - Comments: 0

A new technical paper titled "Integrated silicon photonic MEMS" was published by researchers at EPFL, University of Sydney, CSEM, KTH Royal Institute of Technology, Ghent University, Imec, and Tyndall National Institute. Abstract Excerpt "Here, we introduce a silicon photonic MEMS platform consisting of high-performance nano-opto-electromechanical devices fully integrated alongside standar... » read more

Feasibility of Using Domain Wall-Magnetic Tunnel Junction for Magnetic Analog Addressable Memories
By Technical Paper Link - 23 Mar, 2023 - Comments: 0

A new technical paper titled "Domain Wall-Magnetic Tunnel Junction Analog Content Addressable Memory Using Current and Projected Data" was published by researchers at UT Austin and Samsung Advanced Institute of Technology (SAIT). Abstract "With the rise in in-memory computing architectures to reduce the compute-memory bottleneck, a new bottleneck is present between analog and digital conver... » read more

RISC-V Disrupting EDA
By Brian Bailey - 23 Mar, 2023 - Comments: 3

The electronic design automation (EDA) industry started in the 1980s and primarily was driven by the test and PCB industries. The test industry was focused on simulation so that test vector sets could be developed and optimized. The PCB industry needed help managing complexity as system sizes grew. That complexity soon was eclipsed by IC complexity and the costs associated with making a mist... » read more

True 3D Is Much Tougher Than 2.5D
By Brian Bailey - 23 Mar, 2023 - Comments: 0

Creating real 3D designs is proving to be much more complex and difficult than 2.5D, requiring significant innovation in both technology and tools. While there has been much discussion about 3D designs, there are multiple interpretations about what 3D entails. This is more than just semantics, however, because each packaging option requires different design approaches and technologies. And a... » read more

Looking Beyond TOPS/W: How To Really Compare NPU Performance
By Paul Karazuba - 23 Mar, 2023 - Comments: 0

There is a lot more to understanding the true capabilities of an AI engine beyond TOPS per watt. A rather arbitrary measure of the number of operations of an engine per unit of power, the TOPS/W metric completely misses the point that a single operation on one engine may accomplish more useful work than a multitude of operations on another engine. In any case, TOPS/W is by no means the only spe... » read more

The Race Toward Mixed-Foundry Chiplets
By Ann Mutschler - 23 Mar, 2023 - Comments: 1

Creating chiplets with as much flexibility as possible has captured the imagination of the semiconductor ecosystem, but how heterogeneous integration of chiplets from different foundries will play out remains unclear. Many companies in the semiconductor ecosystem are still figuring out how they will fit into this heterogeneous chiplet world and what issues they will need to solve. While near... » read more

Rethinking Validation To Improve Products Quicker
By Kaitlynn Mazzarella - 23 Mar, 2023 - Comments: 0

By Kaitlynn Mazzarella and Marvin Landrum The boundaries of measurement science are being pushed more than ever before. Keeping up with evolving industry needs is not a simple feat. Not only does each new technology create business opportunities for companies to take share in new markets, but it also changes the way we design and test products. As the pace of technical innovation accelerates... » read more

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