Blog Review: Feb. 15
By Jesse Allen - 15 Feb, 2023 - Comments: 0

Siemens EDA's Harry Foster examines the relationship between verification maturity and non-trivial bug escapes into production, as well as whether safety critical development processes yield higher quality in terms of preventing bugs and achieving silicon success. Synopsys' Shankar Krishnamoorthy finds that the rapid progress of machine learning models is driving demand for more domain-speci... » read more

AI’s Impact In Automobiles Remains Uncertain
By Ed Sperling - 15 Feb, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk about software updates in cars, where AI makes sense, and why there's a growing sense of optimism, with Geoff Tate, CEO of Flex Logix; Veerbhan Kheterpal, CEO of Quadric; Steve Teig, CEO of Perceive; and Kurt Busch, CEO of Syntiant. What follows are excerpts of that conversation, which were held in front of a live audience at Desi... » read more

Research Bits: Feb. 14
By SE Staff - 14 Feb, 2023 - Comments: 0

Defining Kagome superconductors An international team of scientists and researchers from the Brown University lab are now able to describe the structure of the superconductor Kagome metals. The team used nuclear magnetic resonance (NMR) imaging and a quantum modeling theory to describe the microscopic structure as the metal changed states into a charge density wave (CDW) state at 103°Kelvin (... » read more

Chip Industry’s Technical Paper Roundup: Feb. 14
By Linda Christensen - 14 Feb, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=80 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us p... » read more

Emulation System for Racetrack Memories Based on FPGA
By Technical Paper Link - 13 Feb, 2023 - Comments: 0

A technical paper titled "ERMES: Efficient Racetrack Memory Emulation System based on FPGA" was written by researchers at University of Calabria and TU Dresden. "This paper presents a new emulation system for RTMs based on heterogeneous FPGA-CPU Systems-on-Chips (SoCs). Thanks to its high flexibility, the proposed emulator can be easily configured to evaluate different memory architectures. ... » read more

Advanced Packaging for High-Bandwidth Memory: Influences of TSV size, TSV Aspect Ratio And Annealing Temperature
By Technical Paper Link - 13 Feb, 2023 - Comments: 0

A technical paper titled "Stress Issue of Vertical Connections in 3D Integration for High-Bandwidth Memory Applications" was published by researchers at National Yang Ming Chiao Tung University. Abstract: "The stress of TSV with different dimensions under annealing condition has been investigated. Since the application of TSV and bonding technology has demonstrated a promising approach for ... » read more

ILP-Based Router for Wire-Bonding FBGA Packaging Design
By Technical Paper Link - 13 Feb, 2023 - Comments: 0

A new technical paper titled "ILP-Based Substrate Routing with Mismatched Via Dimension Consideration for Wire-bonding FBGA Package Design" was written by researchers at National Taiwan University of Science and Technology. "In this paper, we propose an integer linear programming (ILP)-based router for wire-bonding FBGA packaging design. Our ILP formulation not only can handle design-depende... » read more

Modeling and Thermal Analysis of 3DIC
By Technical Paper Link - 13 Feb, 2023 - Comments: 0

A new technical paper titled "Heat transfer in a multi-layered semiconductor device with spatially-varying thermal contact resistance between layers" was published by researchers at UT Arlington. "This work presents a theoretical model to determine the steady state temperature distribution in a general M-layer structure with spatial variation in thermal contact resistance between adjacent la... » read more

New Method Improves Machine Learning Models’ Reliability, With Less Computing Resources (MIT, U. of Florida, IBM Watson)
By Technical Paper Link - 13 Feb, 2023 - Comments: 0

A new technical paper titled "Post-hoc Uncertainty Learning using a Dirichlet Meta-Model" was published (preprint) by researchers at MIT, University of Florida, and MIT-IBM Watson AI Lab (IBM Research). The work demonstrates how to quantify the level of certainty in its predictions, while using less compute resources. “Uncertainty quantification is essential for both developers and users o... » read more

Ion Implantation Applications For In-Line SIMS Metrology
By Wei Ti Lee - 13 Feb, 2023 - Comments: 0

By Wei Ti Lee, Sarah Okada, Lawrence Rooney, Feng Zhang, and Benjamin Hickey In the semiconductor industry, ion implantation process has expanded to a wide range of applications with doses and energies spanning several orders of magnitude. Ion implantation is a very complicated process with many parameters and factors that affect the implant profile. For example, shadowing effects from high... » read more

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