Path To Net-Zero Emissions In IC Packaging


To strengthen climate resilience and accelerate towards net-zero emissions, ASE has implemented comprehensive carbon reduction strategies and management frameworks to practice responsible actions and achieve performance results. In our efforts to reduce our carbon footprint, we strive to design production facilities and processes that prioritize eco-efficient production and the creation of en... » read more

How An Environmental Sustainability Community Fostered Employee-Driven Innovation


Co-written by S. Sinan Erzurumlu (Babson College), Wojciech T. Osowiecki (Lam Research) and Victor P. Seidel (Babson College). Firms are increasingly promoting innovations that advance environmental sustainability across all aspects of their business, but this can be challenging in global, complex, technology-focused organizations. Much research has focused on top-down strategic initiatives;... » read more

2025 Impact Report: Environmental, Social and Governance Efforts


Brewer Science’s Impact Report 2025 tracks progress on goals set in environment, social and governance, including: Progress towards reducing carbon footprint for Scope 1 and Scope 2 GHG by 80% from baselines (2018) by 2030 Progress towards achieving net zero carbon footprint by 2050 Progress towards creating a circular supply chain, prioritizing collaboration ... » read more

Critical Minerals Due Diligence And The Semiconductor Supply Chain


“Critical minerals our world needs for electric vehicles and semiconductors can be found here. Clean energy we need to power artificial intelligence data centers and economic growth can be built here.”[1] This statement was made by former US President Joseph Biden during his visit to Angola in December 2024 to support a US-funded railroad project called the Lobito Corridor. The railroad wou... » read more

Are Larger Reticle Sizes On The Horizon?


Making high-NA EUV lithography work will take a manufacturing-worthy approach to stitching together circuits or a wholesale change to larger masks. Circuit stitching between the exposure fields is challenging the design, yield and manufacturability of the high-NA (0.55) EUV transition. The alternative is a radical change from 6x6-inch to 6x11-inch masks that would eliminate stitching, but it... » read more

2024 Corporate Responsibility Report


Amkor recognizes the need for transparent reporting, and we have been publishing annual reports to facilitate the disclosure of comparable, consistent, and reliable information about our initiatives and progress for our stakeholders. Last year, we verified our targets to achieve net-zero greenhouse gas emissions by 2050, including near-term targets, with the Science Based Targets initiative ... » read more

Thermoelectricity in Topological Flat-Band Compounds (TU Wien, et al.)


A new technical paper titled "Topological Flat-Band-Driven Metallic Thermoelectricity" was published by researchers at TU Wien, Los Alamos National Lab, Flatiron Institute and others. Abstract "Materials where flattened electronic dispersions arise from destructive phase interference, rather than localized orbitals, have emerged as promising platforms for studying emergent quantum phenome... » read more

All-In-One Analog AI Accelerator With CMO/HfOx ReRAM Integrated Into The BEOL (IBM Research-Europe)


A new technical paper titled "All-in-One Analog AI Hardware: On-Chip Training and Inference with Conductive-Metal-Oxide/HfOx ReRAM Devices" was published by researchers at IBM Research-Europe. Abstract "Analog in-memory computing is an emerging paradigm designed to efficiently accelerate deep neural network workloads. Recent advancements have focused on either inference or training accelera... » read more

Review Paper: Wafer-Scale Accelerators Versus GPUs (UC Riverside)


A new technical paper titled "Performance, efficiency, and cost analysis of wafer-scale AI accelerators vs. single-chip GPUs" was published by researchers at UC Riverside. "This review compares wafer-scale AI accelerators and single-chip GPUs, examining performance, energy efficiency, and cost in high-performance AI applications. It highlights enabling technologies like TSMC’s chip-on-wafe... » read more

Reaction Mechanisms in a Chemically Amplified EUV Photoresist (imec, KU Leuven)


A new technical paper titled "Unraveling the Reaction Mechanisms in a Chemically Amplified EUV Photoresist from a Combined Theoretical and Experimental Approach" was published by researchers at imec and KU Leuven. "Our combined experimental and theoretical approach shows that EUV photoemission can simultaneously resolve chemical dynamics and the production of primary and secondary electrons,... » read more

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