Joint Interdisciplinary Work To Enable Novel, Industry-Ready Chiplet Solutions


Fraunhofer is going to establish the Chiplet Center of Excellence (CCoE), which is a unique research activity based on Fraunhofer‘s long experience and broad research portfolio in design, implementation and test of 2.5 and 3D integrated electronic systems. The Center aims at establishing a common understanding among the partners and at creating a suitable chiplet development methodology. This... » read more

Decoding Glitch Power at the RTL Stage


In the context of analyzing digital semiconductor circuits, a glitch is any unwanted or unused signal transition, or toggle. A glitch is often a transient signal that is much shorter than a clock period and therefore is not captured by the next register stage. We also encounter full transition glitches, or transport glitches, which refer to toggles in a data path circuit that cover a full clock... » read more

AI/ML’s Role In Design And Test Expands


The role of AI and ML in test keeps growing, providing significant time and money savings that often exceed initial expectations. But it doesn't work in all cases, sometimes even disrupting well-tested process flows with questionable return on investment. One of the big attractions of AI is its ability to apply analytics to large data sets that are otherwise limited by human capabilities. In... » read more

Achieving Zero Defect Manufacturing Part 2: Finding Defect Sources


Semiconductor manufacturing creates a wealth of data – from materials, products, factory subsystems and equipment. But how do we best utilize that information to optimize processes and reach the goal of zero defect manufacturing? This is a topic we first explored in our previous blog, “Achieving Zero Defect Manufacturing Part 1: Detect & Classify.” In it, we examined real-time defe... » read more

Are You Ready For HBM4? A Silicon Lifecycle Management (SLM) Perspective


Many factors are driving system-on-chip (SoC) developers to adopt multi-die technology, in which multiple dies are stacked in a three-dimensional (3D) configuration. Multi-die systems may make power and thermal issues more complex, and they have required major innovations in electronic design automation (EDA) implementation and test tools. These challenges are more than offset by the advantages... » read more

Metrology And Inspection For The Chiplet Era


New developments and innovations in metrology and inspection will enable chipmakers to identify and address defects faster and with greater accuracy than ever before, all of which will be required at future process nodes and in densely packed assemblies of chiplets. These advances will affect both front-end and back-end processes, providing increased precision and efficiency, combined with a... » read more

Semiconductor Shifts In Automotive: Impact Of EV And ADAS Trends


The integration of advanced driver assistance systems (ADAS) and the transition towards electric vehicles (EVs) are significantly transforming the automotive industry. Modern vehicles, essentially computers on wheels, require substantially more semiconductors. In response, carmakers are forming stronger partnerships with semiconductor vendors – some are taking a page from tech giants like ... » read more

Driving Cost Lower and Power Higher With GaN


Gallium nitride is starting to make broader inroads in the lower-end of the high-voltage, wide-bandgap power FET market, where silicon carbide has been the technology of choice. This shift is driven by lower costs and processes that are more compatible with bulk silicon. Efficiency, power density (size), and cost are the three major concerns in power electronics, and GaN can meet all three c... » read more

Leveraging AI To Efficiently Test AI Chips


In the fast-paced world of technology, where innovation and efficiency are paramount, integrating artificial intelligence (AI) and machine learning (ML) into the semiconductor testing ecosystem has become of critical importance due to ongoing challenges with accuracy and reliability. AI and ML algorithms are used to identify patterns and anomalies that might not be discovered by human testers o... » read more

Controller Area Network (CAN) Overview


What is CAN? A controller area network (CAN) bus is a high-integrity serial bus system for networking intelligent devices. CAN busses and devices are common components in automotive and industrial systems. Using a CAN interface device, you can write LabVIEW applications to communicate with a CAN network. CAN History Bosch originally developed CAN in 1985 for in-vehicle networks.... » read more

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