Technical Paper Round-up: June 14
By Linda Christensen - 14 Jun, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=33 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit f... » read more

Research Bits: June 14
By Jesse Allen - 14 Jun, 2022 - Comments: 0

Photonic deep neural network chip Engineers from the University of Pennsylvania built a photonic deep neural network on a 9.3 square millimeter chip they say is faster and more efficient at classifying images, with the ability to process nearly two billion images a second. The chip uses a series of waveguides that form 'neutron layers' mimicking the brain. “Our chip processes information ... » read more

U. Of Florida: Protecting Chip-Design IP From Reverse-Engineering
By Technical Paper Link - 13 Jun, 2022 - Comments: 0

New research paper titled "Hardening Circuit-Design IP Against Reverse-Engineering Attacks" from University of Florida. "Design-hiding techniques are a central piece of academic and industrial efforts to protect electronic circuits from being reverse-engineered. However, these techniques have lacked a principled foundation to guide their design and security evaluation, leading to a long line... » read more

Synchrotron S-ray Diffraction-based Non-destructive Nanoscale Mapping of Si/SiGe Nanosheets for GAA structures
By Technical Paper Link - 13 Jun, 2022 - Comments: 0

New research paper titled "Mapping of the mechanical response in Si/SiGe nanosheet device geometries" from researchers at IBM T.J. Watson Research Center and Brookhaven National Laboratory. Sponsored by U.S. DOE. Abstract "The performance of next-generation, nanoelectronic devices relies on a precise understanding of strain within the constituent materials. However, the increased flexibilit... » read more

ORNL: Advantages of Using Wide Bandgap Semiconductor Materials For Extreme Temp & Radiation
By Technical Paper Link - 13 Jun, 2022 - Comments: 0

Research paper from ORNL (Oak Ridge National Lab) titled "Wide Bandgap Semiconductors for Extreme Temperature and Radiation Environments." Abstract "With their greater voltage breakdowns, higher current limitations, and faster switching speeds, wide bandgap semiconductors are increasing in market application over the traditionally dominant silicon devices. Silicon carbide semiconductors hav... » read more

MIT: Stackable AI Chip With Lego-style Design
By Technical Paper Link - 13 Jun, 2022 - Comments: 0

New technical paper titled "Reconfigurable heterogeneous integration using stackable chips with embedded artificial intelligence" from researchers at MIT, along with Harvard University, Tsinghua University, Zhejiang University, and others. Partial Abstract: "Here we report stackable hetero-integrated chips that use optoelectronic device arrays for chip-to-chip communication and neuromorphic... » read more

Finding Wafer Defects Using Quantum DL
By Technical Paper Link - 13 Jun, 2022 - Comments: 0

New research paper titled "Semiconductor Defect Detection by Hybrid Classical-Quantum Deep Learning" by researchers at National Tsing Hua University. Abstract "With the rapid development of artificial intelligence and autonomous driving technology, the demand for semiconductors is projected to rise substantially. However, the massive expansion of semiconductor manufacturing and the develo... » read more

Audio, Visual Advances Intensify IC Design Tradeoffs
By Ann Mutschler - 13 Jun, 2022 - Comments: 0

A spike in the number of audio and visual sensors is greatly increasing design complexity in chips and systems, forcing engineers to make tradeoffs that can affect performance, power, and cost. Collectively, these sensors generate so much data that designers must consider where to process different data, how to prioritize it, and how to optimize it for specific applications. The tradeoffs in... » read more

AlphaGo Game Influences Argonne’s New AI Tool For Materials Discovery
By Technical Paper Link - 10 Jun, 2022 - Comments: 0

Research paper titled "Learning in continuous action space for developing high dimensional potential energy models" from researchers at Argonne National Lab with contributions from Oak Ridge National Laboratory. Abstract "Reinforcement learning (RL) approaches that combine a tree search with deep learning have found remarkable success in searching exorbitantly large, albeit discrete action ... » read more

Quantum: Pairing Cooper Pairs Magnifies The Phase Fluctuations of the Ground State
By Technical Paper Link - 10 Jun, 2022 - Comments: 0

New technical paper titled "Magnifying Quantum Phase Fluctuations with Cooper-Pair Pairing" from researchers at Université PSL, CNRS, Sorbonne Université, Université Paris-Diderot, Inria de Paris, PSL Research University. Abstract "Remarkably, complex assemblies of superconducting wires, electrodes, and Josephson junctions are compactly described by a handful of collective phase degrees ... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy