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MIT: Stackable AI Chip With Lego-style Design

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New technical paper titled “Reconfigurable heterogeneous integration using stackable chips with embedded artificial intelligence” from researchers at MIT, along with Harvard University, Tsinghua University, Zhejiang University, and others.

Partial Abstract:
“Here we report stackable hetero-integrated chips that use optoelectronic device arrays for chip-to-chip communication and neuromorphic cores based on memristor crossbar arrays for highly parallel data processing. With this approach, we create a system with stackable and replaceable chips that can directly classify information from a light-based image source.”

Find the technical paper here and the MIT news summary here. Published June 2022.

Choi, C., Kim, H., Kang, JH. et al. Reconfigurable heterogeneous integration using stackable chips with embedded artificial intelligence. Nat Electron (2022). https://doi.org/10.1038/s41928-022-00778-y

Visit Semiconductor Engineering’s Technical Paper library here and discover many more chip industry academic papers.

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