EZ-PD PMG1 High Voltage MCU As A Coprocessor For Embedded Applications
By Infineon - 04 May, 2022 - Comments: 0

EZ-PD™ PMG1, a family of High Voltage Microcontrollers (MCUs) with USB-C Power Delivery (PD), supports embedded firmware engineers and system designers to adopt USB-C into applications such as smart speakers, IoT hubs, home appliances, internet gateways, power and garden tools. This article targets embedded firmware engineers and system designers interested in including USB-C in their em... » read more

Research Bits: May 3
By Jesse Allen - 03 May, 2022 - Comments: 0

Fingerprinting quantum noise Scientists from the University of Chicago and Purdue University propose a different method of understanding the effect of noise in quantum computers. Instead of trying to measure it directly, they created a 'fingerprint' of how the noise impacts a program run on the computer. “We wondered if there was a way to work with the noise, instead of against it,” sai... » read more

Technical Paper Round-up: May 3
By Linda Christensen - 03 May, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=24 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit for... » read more

Hardware Encryption: Ultra-compact Active Interconnect Based on FeFET
By Technical Paper Link - 02 May, 2022 - Comments: 0

New technical paper "Hardware functional obfuscation with ferroelectric active interconnects" from researchers at Penn State, Rochester Institute of Technology, GlobalFoundries Fab1, North Dakota State University. Abstract "Existing circuit camouflaging techniques to prevent reverse engineering increase circuit-complexity with significant area, energy, and delay penalty. In this paper, we... » read more

Parallel Circuit Execution & NISQ Computing
By Technical Paper Link - 02 May, 2022 - Comments: 0

Research from LIRMM, University of Montpellier, CNRS. Abstract "Quantum computing is performed on Noisy Intermediate-Scale Quantum (NISQ) hardware in the short term. Only small circuits can be executed reliably on a quantum machine due to the unavoidable noisy quantum operations on NISQ devices, leading to the under-utilization of hardware resources. With the growing demand to access quan... » read more

AI-Based Method to Prune the Design Space of Heterogeneous NoCs
By Technical Paper Link - 02 May, 2022 - Comments: 0

Abstract "Often suffering from under-optimization, Networks-on-Chip (NoCs) heavily impact the efficiency of domain-specific Systems-on-Chip. To cope with this issue, heterogeneous NoCs are promising alternatives. Nevertheless, the design of optimized NoCs satisfying multiple performance objectives is extremely challenging and requires significant expertise. Prior works failed to combine many... » read more

Vertically stacked, low-voltage organic ternary logic circuits including nonvolatile floating-gate memory transistors
By Technical Paper Link - 02 May, 2022 - Comments: 0

Research paper from KAIST and Gachon University. Abstract "Multi-valued logic (MVL) circuits based on heterojunction transistor (HTR) have emerged as an effective strategy for high-density information processing without increasing the circuit complexity. Herein, an organic ternary logic inverter (T-inverter) is demonstrated, where a nonvolatile floating-gate flash memory is employed to ... » read more

Analog Edge Inference with ReRAM
By Technical Paper Link - 02 May, 2022 - Comments: 0

Abstract "As the demands of big data applications and deep learning continue to rise, the industry is increasingly looking to artificial intelligence (AI) accelerators. Analog in-memory computing (AiMC) with emerging nonvolatile devices enable good hardware solutions, due to its high energy efficiency in accelerating the multiply-and-accumulation (MAC) operation. Herein, an Applied Materials... » read more

CEO Outlook: Chip Industry 2022
By Ed Sperling - 02 May, 2022 - Comments: 0

Semiconductor Engineering sat down to discuss broad industry changes and how that affects chip design with Anirudh Devgan, president and CEO of Cadence; Joseph Sawicki, executive vice president of Siemens EDA; Niels Faché, vice president and general manager at Keysight; Simon Segars, advisor at Arm; and Aki Fujimura, chairman and CEO of D2S. This discussion was held in front of a live audience... » read more

Chipping In For Equipment Suppliers: The Equipment Multiplier Effect On The Chip Shortage
By Ajit Manocha - 02 May, 2022 - Comments: 0

By Ajit Manocha and Sanjay Malhotra Global semiconductor supply imbalances have hindered countless industries including essential segments such as automotive and medical as well as workers and consumers. Around the world, policymakers are increasing semiconductor manufacturing capacity to strengthen supply chains and meet growing demand for semiconductors through robust incentive packages to... » read more

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