Addressing Stress In Heterogeneous 3D-IC Designs
By Shetha Nolke - 29 May, 2025 - Comments: 0

The benefits of 3D IC architectures are well-documented – smaller footprints, lower power, and increased performance. However, the move to heterogeneous 3D designs also introduces a host of new challenges that must be carefully navigated. As chip designers integrate multiple dies and technologies into a single 3D package, the interactions between the chip and package become increasingly co... » read more

Closing The RISC-V Verification Disconnect
By Larry Lapides - 29 May, 2025 - Comments: 0

With the explosive adoption of RISC-V processors, processor verification has become a hot topic. This is due both to the criticality of the processor IP in the SoC and to the fact that many experienced SoC verification engineers are doing their first processor verification project. While there are similarities between SoC verification and processor verification, there are also significant diffe... » read more

Optimizing Data Movement
By Ann Mutschler - 29 May, 2025 - Comments: 1

Demand for new and better AI models is creating an insatiable demand for more processing power and much better data throughput, but it's also creating a slew of new challenges for which there are not always good solutions. The key here is figuring out where bottlenecks might crop up in complex chips and advanced packages. This involves a clear understanding of how much bandwidth is required ... » read more

Boosting AI Performance With CXL
By Vanessa Do - 29 May, 2025 - Comments: 0

As AI applications rapidly advance, AI models are being tasked with processing massive amounts of data containing billions – or even trillions – of parameters. Each large workload involves numerous iterations for data comparison, predictive calculations, and parameter results updating during training. Hence, there is a constant demand for flexible memory expansion and memory sharing among d... » read more

A Balanced Approach To Verification
By Brian Bailey - 29 May, 2025 - Comments: 0

First-time chip success rates are dropping, primarily due to increased complexity and attempts to cut costs. That means management must take a close look at their verification strategies to determine if they are maximizing the potential of their tools and staff. Using simulation to demonstrate that a design exhibits a required behavior has been the cornerstone of functional verification sinc... » read more

Executive Outlook: Chiplets, 3D-ICs, and AI
By Ed Sperling - 29 May, 2025 - Comments: 0

Semiconductor Engineering sat down to discuss chiplets and the challenges of moving to 3D-ICs with Bill Mullen, Ansys fellow; John Ferguson, senior director of product management at Siemens EDA; Chris Mueth, senior director of new markets and strategic initiatives at Keysight; Albert Zeng, senior engineering group director at Cadence; Anand Thiruvengadam, senior director and head of AI product ... » read more

Thermo-Mechanical Stress On Active Chiplets In A 3D-IC Heterogeneous Package Assembly
By Siemens EDA - 29 May, 2025 - Comments: 0

The move to heterogeneous multi-chip/chiplet products improves yield, performance and modularity while reducing power and overall product footprint. However, this shift to heterogeneous assembly also introduces new complexities that can influence chip warpage and circuit behavior due to thermo-mechanical stress impacts. In heterogeneous 3D IC architectures, the interaction between the chips ... » read more

CSR Management: Life Beyond Spreadsheets
By Insaf Meliane - 29 May, 2025 - Comments: 0

The ASIC, ASSP, and system-on-chip (SoC) design landscape has undergone significant evolution over the past two decades. For example, while early devices contained only tens of intellectual property (IP) blocks, modern high-end SoCs may integrate up to 1000 IPs, each containing millions of logic gates. Furthermore, unlike their predecessors, today’s SoCs are no longer primarily hardware; i... » read more

Optical Interconnectivity At 224 Gbps
By Ed Sperling - 28 May, 2025 - Comments: 0

AI is generating so much traffic that traditional copper-based approaches for moving data inside a chip, between chips, and between systems, are running out of steam. Just adding more channels is no longer viable. It requires more power to drive signals, and the distance those signals can travel without excessive loss is shrinking. Mike Klempa, product marketing specialist at Alphawave Semi, di... » read more

SoC Power Delivery Network (PDN) Telemetry And Applications
By Movellus - 28 May, 2025 - Comments: 0

PDN characterization needs visibility at the transistor. Through this white paper, we will learn why PDN visibility is crucial to each stage of the silicon lifecycle and its relation to power, performance, and in-field uptime. Register here to download the paper. » read more

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