Reaction Mechanisms in a Chemically Amplified EUV Photoresist (imec, KU Leuven)


A new technical paper titled "Unraveling the Reaction Mechanisms in a Chemically Amplified EUV Photoresist from a Combined Theoretical and Experimental Approach" was published by researchers at imec and KU Leuven. "Our combined experimental and theoretical approach shows that EUV photoemission can simultaneously resolve chemical dynamics and the production of primary and secondary electrons,... » read more

Mixed-Criticality SW Architectures for Centralized HPC Platforms in Software-Defined Vehicles (Daimler, TU Munich)


A new technical paper titled "Towards Mixed-Criticality Software Architectures for Centralized HPC Platforms in Software-Defined Vehicles: A Systematic Literature Review" was published by researchers at Daimler Truck AG and Technical University of Munich. Abstract "Centralized electrical/electronic architectures and High-Performance Computers (HPCs) are redefining automotive software develo... » read more

EUV Lithography: The Resolution Capability And Stochastic Behavior From Statistical Viewpoints


A new technical paper titled "Statistics of EUV exposed nanopatterns: Photons to molecular dissolutions" was published by Hiroshi Fukuda, Hitachi High-Tech Corporation. Abstract "For higher computing power of semiconductor integrated circuits, pattern feature sizes below 10 nm are anticipated by introducing extreme ultraviolet (EUV) lithography with high numerical aperture (NA) optics. Ho... » read more

Can You Build A Known-Good Multi-Die System?


Semiconductor Engineering sat down to discuss the challenges of designing and testing multi-die systems, including how to ensure they will work as expected, with Bill Mullen, Ansys fellow; John Ferguson, senior director of product management at Siemens EDA; Chris Mueth, senior director of new markets and strategic initiatives at Keysight; Albert Zeng, senior engineering group director at Cadenc... » read more

Blog Review: June 18


Synopsys’ John Koeter and other industry experts discuss whether high-bandwidth memory should follow established standards for broad compatibility and scalability or be customized to address specific use case requirements and time-to-market targets. In a podcast, Siemens’ Conor Peick, Dale Tutt, and Mike Ellow chat about how progress in 3D-IC development, thermal management, and the indu... » read more

Baya Systems: Moving Data Faster


Moving data is one of the big challenges in the AI world. There is so much data being generated that even moving it back and forth from processors to memories requires a significant amount of power, enormous bandwidth, and frequently causes delays that can bog down performance. Now, with substantially more processing, different types of processors on each system on chip (SoC), and the emerging ... » read more

Chip Industry Technical Paper Roundup: June 17


New technical papers recently added to Semiconductor Engineering’s library: [table id=440 /] Find more semiconductor research papers here.   » read more

Research Bits: June 17


Superlattice castellated FETs Researchers from the University of Bristol and Northrop Grumman Mission Systems discovered a latch-effect in gallium nitride (GaN) that could lead to improved radio frequency device performance, crucial for enabling 6G devices. “We have piloted a device technology, working with collaborators, called superlattice castellated field effect transistors (SLCFETs),... » read more

HBM Roadmap: Next-Gen High-Bandwidth Memory Architectures (KAIST’s TERALAB)


A new technical paper titled "HBM Roadmap Ver 1.7 Workshop" was published by researchers at KAIST’s TERALAB. The 371-page paper provides an overview of next-generation HBM architectures based on current technology trends, as well as many technology insights. Find the technical paper here or here.  Published June 2025. Advising Professor : Prof. Joungho Kim. Fig. 1: Thermal Manag... » read more

The Impact Of Parameter Uncertainties On The Lifetime Prediction of Power Devices (TU Delft)


A new technical paper titled "Impact of Parameter Uncertainties on Power Electronic Device Lifetime Predictions" was published by researchers at TU Delft. Abstract "Properly addressing uncertainties in reliability analysis is essential for realistic lifetime predictions of power devices. This paper investigates parameter uncertainties on the lifetime estimation of power devices using an emp... » read more

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