Critical Moves: Advanced Logic Devices And CIS Benefit From Applications Using IRCD Metrology


As 3D NAND continues to scale vertically — all in the name of increasing capacity and speed and reducing inefficiency and cost — maintaining channel hole critical dimension (CD) and shape uniformity becomes even more challenging. Faced with rising high-aspect ratios, addressing these challenges requires new inline non-destructive metrology to provide real-time process control. Infrared crit... » read more

Simplify DFT For Advanced SoCs


The purpose of electronic design automation (EDA) software is to solve SoC design problems and simplify the entire process. For design for test (DFT), this means aiming to streamline the DFT development for today’s large and complex designs. The technologies and methods developed through partnerships between EDA suppliers, foundries, and semiconductor companies should effectively reduce risk,... » read more

More Manufacturing Issues, More Testing


Douglas Lefever, CEO of Advantest America, sat down with Semiconductor Engineering to talk about changes in test, the impact of advanced packaging, and business changes that are happening across the flow. What follows are excerpts of that discussion. SE: What are the big changes ahead in test? Lefever: It's less about inflection points and more like moving from algebra to calculus in the ... » read more

Evolution Of Data Center Networking Technology — IP And Beyond


Ethernet is ubiquitous—it is the core technology that defines the Internet and serves to connect the world in ways that people could not imagine even one generation ago. HPC clusters are working on solving the most challenging problems facing humanity—and cloud computing is the service hosting many of the application workloads struggling with these questions. While alternative network infra... » read more

Is A Guestimate Good Enough For Obtaining Failure Mode Distribution?


SoCs targeting automotive applications are required to meet certain safety and quality standards as described in ISO 26262. A quantitative approach to safety analysis involves performing Failure Mode Effects and Diagnostic Analysis (FMEDA). FMEDA is a systematic quantitative analysis technique to obtain subsystem/product level failure rates, failure modes and diagnostic capabilities of systemat... » read more

Technology Advancements For Dynamic Function eXchange In Vivado ML Edition


As systems become more complex and designers are asked to do more with less, adaptability is a critical asset. While Xilinx FPGAs and SoCs always provided the flexibility to perform on-site device reprogramming, current constraints including increased cost, tighter board space, and power consumption demand even more efficient design strategies. Xilinx Dynamic Function eXchange (DFX) extends the... » read more

Data Association Between Perception and V2V Communication Sensors


Abstract: "The connectivity between vehicles, infrastructure, and other traffic participants brings a new dimension to automotive safety applications. Soon all the newly produced cars will have Vehicle to Everything (V2X) communication modems alongside the existing Advanced Driver Assistant Systems (ADAS). It is essential to identify the different sensor measurements for the same targets (... » read more

Enhancement of Robustness in Object Detection Module for Advanced Driver Assistance Systems


Abstract: "A unified system integrating a compact object detector and a surrounding environmental condition classifier for enhancing the robustness of object detection scheme in advanced driver assistance systems (ADAS) is proposed in this paper. ADAS are invented to improve traffic safety and effectiveness in autonomous driving systems where object detection plays an extremely important rol... » read more

Chemoselective Surface Trap-Mediated Metal Growth on Semiconductor Nanocrystals


Abstract "We present a highly chemoselective deposition of precious metals on semiconductor nanoheterostructures with a strong preference for cadmium and zinc telluride over the lighter chalcogenides. The selectivity is explained by p-type surface traps on the tellurides, compared to n-type defects of the homologous sulfides and selenides, and can be turned off by passivating the particle su... » read more

Non-destructive Thickness Characterisation of 3D Multilayer Semiconductor Devices Using Optical Spectral Measurements and Machine Learning


Abstract: "Three-dimensional (3D) semiconductor devices can address the limitations of traditional two-dimensional (2D) devices by expanding the integration space in the vertical direction. A 3D NOT-AND (NAND) flash memory device ispresently the most commercially successful 3D semiconductor device. It vertically stacks more than 100 semiconductor material layers to provide more storage capac... » read more

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