Week In Review: Manufacturing, Test
By Mark LaPedus - 28 Jan, 2022 - Comments: 0

Government policy As reported, the United States is in dire need of more fab capacity as well as packaging plants. The U.S. took a big step in an effort to solve the problem. The U.S. House of Representatives this week introduced the America Competes Act of 2022. The bill includes funding for the Creating Helpful Incentives to Produce Semiconductors for America (CHIPS) Act, which is earmarked... » read more

Week In Review: Design, Low Power
By Jesse Allen - 28 Jan, 2022 - Comments: 0

Kalray, a provider of programmable data processing and storage acceleration cards for data centers, will acquire Arcapix Holdings, which provides software-defined storage and data management solutions for data-intensive applications. "I am delighted at the prospect of this acquisition that will accelerate our go-to-market and strengthen our key position in the data-intensive storage market. It ... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 28 Jan, 2022 - Comments: 0

China’s regulators are agreeing to AMD’s acquisition of Xilinx with the caveat that AMD must agree not to force tie-in sales Xilinx's products with AMD products, according to Reuters. China's State Administration for Market Regulation said the companies cannot discriminate against customers using other technology. Xilinx's SEC 8-K form confirms that the two companies received clearance for ... » read more

Electro-optic spatial light modulator from an engineered organic layer
By Technical Paper Link - 27 Jan, 2022 - Comments: 0

Abstract "Tailored nanostructures provide at-will control over the properties of light, with applications in imaging and spectroscopy. Active photonics can further open new avenues in remote monitoring, virtual or augmented reality and time-resolved sensing. Nanomaterials with χ(2) nonlinearities achieve highest switching speeds. Current demonstrations typically require a trade-off: they eith... » read more

Inverse Design of Inflatable Soft Membranes Through Machine Learning
By Technical Paper Link - 27 Jan, 2022 - Comments: 0

Abstract "Across fields of science, researchers have increasingly focused on designing soft devices that can shape-morph to achieve functionality. However, identifying a rest shape that leads to a target 3D shape upon actuation is a non-trivial task that involves inverse design capabilities. In this study, a simple and efficient platform is presented to design pre-programmed 3D shapes starting... » read more

Metasurface Colloidal Quantum Dot Photodetectors
By Technical Paper Link - 27 Jan, 2022 - Comments: 0

Abstract: "Efficient photodetectors that can be easily engineered for a specific spectral window are of high interest. Here, we report on the design, fabrication, and characterization of metasurface-enhanced photodetectors and photodiodes using colloidal quantum dots. We fabricate photoconductors optimized for the wavelength range around 1550 nm featuring responsivities of up to 8000 A/W wit... » read more

Hybrid architecture based on two-dimensional memristor crossbar array and CMOS integrated circuit for edge computing
By Technical Paper Link - 27 Jan, 2022 - Comments: 0

Abstract "The fabrication of integrated circuits (ICs) employing two-dimensional (2D) materials is a major goal of semiconductor industry for the next decade, as it may allow the extension of the Moore’s law, aids in in-memory computing and enables the fabrication of advanced devices beyond conventional complementary metal-oxide-semiconductor (CMOS) technology. However, most circuital demons... » read more

A New Dimension Of Complexity For IC Design
By Ann Mutschler - 27 Jan, 2022 - Comments: 0

Full 3D designs involving logic-on-logic are still in the tire-kicking stage, but gaps in the tooling already are showing up. This is especially evident with static timing analysis (STA), which is used to validate a design’s timing performance by checking all possible paths for timing violations. STA issues began popping up particularly with the introduction of hybrid bonding, a bumpless p... » read more

Growth Spurred By Negatives
By Brian Bailey - 27 Jan, 2022 - Comments: 0

The success and health of the semiconductor industry is driven by the insatiable appetite for increasingly complex devices that impact every aspect of our lives. The number of design starts for the chips used in those devices drives the EDA industry. But at no point in history have there been as many market segments driving innovation as there are today. Moreover, there is no indication this... » read more

Ethical Coverage
By Brian Bailey - 27 Jan, 2022 - Comments: 1

How many times have you heard statements such as, "The verification task quadruples when the design size doubles?" The implication is that every register bit that is created has doubled the state space of the design. It gives the impression that complete verification is hopeless, and because of that little progress has been made in coming up with real coverage metrics. When constrained rando... » read more

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