Arm Neoverse N1 Core: Performance Analysis Methodology
By Arm - 08 Dec, 2021 - Comments: 0

The Arm Neoverse ecosystem is growing substantially with many Arm hardware and software partners developing applications and porting their workloads onto Arm-based cloud instances. With Neoverse N1 based systems becoming widely available, many real-world workloads are showing very competitive performance and significant cost savings when compared to legacy systems. Some recent examples include:... » read more

Big Changes Ahead For Inside Auto Cabins
By Bryon Moyer - 08 Dec, 2021 - Comments: 0

The space we occupy inside our vehicles is poised to change from mere enclosure to participant in the driving experience. Whether for safety or for comfort, a wide range of sensors are likely to appear that will monitor the “contents” of the vehicle. The overall approach is referred to as an in-cabin monitoring system (ICMS), but the specific applications vary widely. “In-cabin sensing... » read more

Blog Review: Dec. 8
By Jesse Allen - 08 Dec, 2021 - Comments: 0

Arm's Shidhartha Das introduces a method to achieve fast yet accurate power modelling for both design and runtime power introspection within the same unified framework using machine learning and data science approaches. Synopsys' Mike Borza warns that the semiconductor industry is facing a flood of counterfeit chips and why being aware of different types of semiconductor scams and tackling t... » read more

Scaling Processor Performance And Safety To Meet Requirements For Next-Generation Safety-Critical Automotive Designs
By Synopsys - 08 Dec, 2021 - Comments: 0

This white paper proposes a state-of-the-art processor architecture targeting automotive safety systems that meets the requirements of such active safety systems delivering the required processing performance, providing the highest automotive safety integrity level (ASIL) while also significantly contributing to a reduction in overall cost of the systems through the use of artificial neural net... » read more

Reconstruction of Bloch wavefunctions of holes in a semiconductor
By Technical Paper Link - 07 Dec, 2021 - Comments: 0

Summary "A central goal of condensed-matter physics is to understand how the diverse electronic and optical properties of crystalline materials emerge from the wavelike motion of electrons through periodically arranged atoms. However, more than 90 years after Bloch derived the functional forms of electronic waves in crystals [1] (now known as Bloch wavefunctions), rapid scattering processes ha... » read more

Pushing the limits of EUV mask repair: addressing sub-10 nm defects with the next generation e-beam-based mask repair tool
By Technical Paper Link - 07 Dec, 2021 - Comments: 0

Abstract "Mask repair is an essential step in the manufacturing process of extreme ultraviolet (EUV) masks. Its key challenge is to continuously improve resolution and control to enable the repair of the ever-shrinking feature sizes on mask along the EUV roadmap. The state-of-the-art mask repair method is gas-assisted electron-beam (e-beam) lithography also referred to as focused electron-beam... » read more

A Novel Fundamental Frequency Switching Operation for Conventional VSI to Enable Single-Stage High-Gain Boost Inversion with ANN Tuned QWS Controller
By Technical Paper Link - 07 Dec, 2021 - Comments: 0

Abstract "Single-stage high-gain inverters have recently gained much research focus as interfaces for inherent low voltage DC sources such as fuel cells, storage batteries, and solar panels. Many impedance-assisted inverters with different input stage configurations have been presented. To decrease passive component sizes, these inverters operate at high-frequency switching. The high-frequency... » read more

Using Manufacturing Data To Boost Reliability
By Ed Sperling and Ann Mutschler - 07 Dec, 2021 - Comments: 0

As chipmakers turn to increasingly customized and complex heterogeneous designs to boost performance per watt, they also are demanding lower defectivity and higher yields to help offset the rising design and manufacturing costs. Solving those issues is a mammoth multi-vendor effort. There can be hundreds of process steps in fabs and packaging houses. And as feature sizes continue to shrink, ... » read more

The 5G Rollout: Solving Advanced RF Metrology Challenges
By Johnny Dai - 07 Dec, 2021 - Comments: 0

The global radio frequency (RF) semiconductor market size is growing rapidly at a compound annual growth rate of 8.5%, with an expected increase from $17.4 billion in 2020 to $26.2 billion in 2025, according to Research and Markets [1]. As many are aware, the rollout of 5G technology and the Internet of Things (IoT), which is enabled by 5G, are the main driving forces for this growth. Growth... » read more

Speeding Up Scan-Based Volume Diagnosis
By Bryon Moyer - 07 Dec, 2021 - Comments: 0

In the critical process known as new-product bring-up, it’s a race to get new products to yield as quickly as possible. But the interplay between increasingly complex aspects of designs and process makes it difficult to find root causes of yield issues so they can be fixed quickly. Advanced processes have very high defectivity, and learning must be fast and effective. While progress has be... » read more

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