On-Chip FPGA: The “Other” Compute Resource
By Andy Jaros - 02 Dec, 2021 - Comments: 0

When system companies discuss processing requirements for their next generation products, the typical discussion invariably leads to: what should the processor subsystem look like? Do you upgrade the embedded processors in the current subsystem to the latest and greatest embedded CPU? Do you add more CPUs? Or perhaps add a little diversity by adding a DSP or GPU? One compute resource tha... » read more

Securing Connected And Autonomous Vehicles
By Andy Gothard - 02 Dec, 2021 - Comments: 0

Vehicles are on track to become highly sophisticated Internet of Things (IoT) devices. With the added functionality that connects vehicles to other vehicles, the infrastructure, and even pedestrians, the opportunity for hacking expands. Challenges like complexity and the burden of legacy systems further complicate the situation. The future of connected and autonomous vehicles (CAV) demands leve... » read more

Why It’s So Difficult — And Costly — To Secure Chips
By Ed Sperling - 02 Dec, 2021 - Comments: 0

Rising concerns about the security of chips used in everything from cars to data centers are driving up the cost and complexity of electronic systems in a variety of ways, some obvious and others less so. Until very recently, semiconductor security was viewed more as a theoretical threat than a real one. Governments certainly worried about adversaries taking control of secure systems through... » read more

Innovative Technology Drives Rapid Deployment Of New 5G Products, Services, And Business Models
By Brendan Farley - 02 Dec, 2021 - Comments: 0

The wireless future is about developing the most compelling products using a combination of advanced technologies to maximize system performance, while optimizing both cost and power. Doing so will unlock deployment of new 5G products and services for mobile operators and the whole 5G ecosystem, from businesses to consumers to the economy. With 5G offering so much potential, how can the industr... » read more

Advanced Packaging For Automotive Chips
By Ann Mutschler - 02 Dec, 2021 - Comments: 0

Multiple types of chips may be better than one for dealing with large amounts and different types of data, but in automotive applications it's not entirely clear how or even whether they should be packaged together. The biggest problem with electronics in vehicles is the extreme range of temperatures, both within and outside of vehicles. Without adequate cooling, chips can age prematurely, s... » read more

Meeting Processor Performance And Safety Requirements For New ADAS & Autonomous Vehicle Systems
By Fergus Casey - 02 Dec, 2021 - Comments: 1

By Fergus Casey and Srini Krishnaswami Innovation in today’s automotive industry is accelerating as companies race to be the market leader in safety and autonomous vehicles. With vehicle control moving from humans to the vehicles’ active safety systems, more sensors – cameras, radar, lidar, etc. – are being added to automotive systems. More sensors require more computational performa... » read more

Will Markets For ML Models Materialize?
By Bryon Moyer - 02 Dec, 2021 - Comments: 0

Developers are spending increasing amounts of time and effort in creating machine-learning (ML) models for use in a wide variety of applications. While this will continue as the market matures, at some point some of these efforts might be seen as reinventing models over and over. Will developers of successful models ever have a marketplace in which they can sell those models as IP to other d... » read more

Building A More Secure U.S. Microelectronic Design Infrastructure
By Jason Oberg - 02 Dec, 2021 - Comments: 0

The security of the U.S. microelectronic designs and their supply chain is becoming a significantly growing concern for both commercial semiconductor companies and the Department of Defense (DoD). The industry has seen significant impact from both silicon shortages and vulnerabilities that have caused disruption in the assurance of microelectronics that power our autonomous vehicles, 5G, and co... » read more

Three Key Aspects Of IP Quality
By Tom Anderson - 02 Dec, 2021 - Comments: 0

It’s no secret that today’s huge system-on-chip (SoC) projects require massive amounts of design reuse. No team, no matter how talented, can design a billion or more gates from scratch. They use extensive borrowing of RTL code from previous and related projects, plus hundreds of thousands of instantiated IP blocks from internal libraries, open-source repositories, development partners, and ... » read more

More Than Moore At iMAPS
By Paul McLellan - 02 Dec, 2021 - Comments: 0

San Diego recently hosted the 54th International Symposium on Microelectronics. That's a very generic title, so you should know that it is run by iMAPS, the International Microelectronics Assembly and Packaging Society. Generally, the conference is just known as iMAPS. One of the keynotes was given by Cadence's KT Moore (in person). His presentation was titled "More Moore or More than Moore: a... » read more

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