A Bluetooth LE Throughput Faceoff
By Isaac Ahn - 06 Feb, 2025 - Comments: 0

The Bluetooth Low Energy (LE) space is shared by over 50 IC suppliers, each in healthy competition with one another. This healthy competition is one of the main driving forces behind the constant innovation and wide spread of Bluetooth LE technology. In the spirit of competition, we thought it would be fun to stage a friendly competition between ourselves and one of our competitors, an estab... » read more

Automotive Security Shifts To The System Level
By Adam Kovac - 06 Feb, 2025 - Comments: 0

Cars are getting smarter, more complicated, and more vulnerable to cyberattacks. As the amount of semiconductor and software content continues to increase, so does the number of over-the-air updates and connections to edge-based servers and services, adding a variety of new vectors for attacks. Properly securing vehicles requires engineers to first identify all the possible connection points... » read more

GaN Power Semiconductors – 2025 Predictions
By Infineon - 06 Feb, 2025 - Comments: 0

GaN power semiconductors are on a tremendous growth trajectory. GaN is on its way to reaching more tipping points in its adoption in more industries. Consumer chargers and adapters have been the forerunner, more applications are expected to tip this year, with many others to follow in time. Still, there are some headwinds for GaN to reach this adoption level. Why is that and how can we overcome... » read more

Securing FPGAs Beyond the Bitstream
By Synopsys - 06 Feb, 2025 - Comments: 0

FPGAs are a popular solution for low-volume applications and applications where frequent updates are essential to the value of the solution, as in many aerospace and defense and AI applications. Security is a critical part of FPGA solutions, and FPGA providers have invested much effort into securing the bitstream. However, there is a need for a cryptographic solution for FPGAs beyond the bitstr... » read more

Beyond Simulation: Transforming Early IC Design With Insight Analyzer
By Siemens EDA - 06 Feb, 2025 - Comments: 0

Traditional verification methods are proving inadequate for addressing critical reliability challenges in today's increasingly complex integrated circuit (IC) designs. Modern IC design requires a proactive approach to verification that emphasizes early-stage analysis. The shift-left methodology enables earlier identification of potential design risks, addressing the complex challenges of IP blo... » read more

Using AI In Semiconductor Inspection
By Ed Sperling - 05 Feb, 2025 - Comments: 0

AI is exceptionally good at spotting anomalies in semiconductor inspection. The challenge is training different models for different inspection tools and topographies, and knowing which model to use at any particular time. Different textures in backgrounds are difficult for traditional algorithms, for example. But once machine learning models are trained properly, they have proven effective in ... » read more

Universities Augment Engineering Curricula To Boost Employability
By Liz Allan - 05 Feb, 2025 - Comments: 0

Increasing numbers of universities are offering semiconductor courses in their engineering programs, and also in math, physics, and business degrees. Most universities now offer a broad foundation so students can pivot to other industries during cyclical downturns, or when technology and science create entirely new and potentially lucrative opportunities, such as generative AI, advanced pack... » read more

Chiplets: Where Are We Today?
By Barry Pangrle - 05 Feb, 2025 - Comments: 1

The 3rd annual Chiplet Summit was held in Santa Clara from January 21st to 23rd at the Convention Center. The conference continues to grow from its 1st year when it was held at the San Jose Doubletree Hotel (almost exactly 2 years ago). During his Chairman’s Welcome presentation, Chuck Sobey mentioned that there were 41 exhibitors at this year’s conference. Chuck was also the moderator f... » read more

Blog Review: Feb. 5
By Jesse Allen - 05 Feb, 2025 - Comments: 0

Cadence's Rajneesh Chauhan explores the extended metadata feature in CXL 3.1, which helps systems manage memory and devices more effectively by sending extra information along with memory transactions to provide more context about what's happening during these transactions. Siemens' Bianca Ward recommends semiconductor companies combat rising production costs by leaning into digitalization a... » read more

Optimization of Oxygen Plasma Conditions for Cu-Cu Bonding
By Technical Paper Link - 04 Feb, 2025 - Comments: 0

A new technical paper titled "Understanding and Optimizing Oxygen Plasma Treatment for Enhanced Cu-Cu Bonding Application" was published by researchers at Seoul National University of Science and Technology. Abstract "This study investigates the optimization of O2 plasma treatment conditions to enhance Cu-Cu bonding. The O2 plasma treatment conditions were optimized using Design of Experime... » read more

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