Manufacturing Bits: Nov. 2
By Mark LaPedus - 02 Nov, 2021 - Comments: 0

IRDS lithography roadmap The Journal of Micro/Nanopatterning, Materials, and Metrology (JM3) has published a paper that outlines the lithography roadmap and the various challenges for the next 15 years. The paper, called the "International Roadmap for Devices and Systems lithography roadmap," projects that extreme ultraviolet (EUV) lithography and a next-generation version will remain the m... » read more

Power/Performance Bits: Nov. 2
By Jesse Allen - 02 Nov, 2021 - Comments: 0

GaN CMOS ICs Researchers from the Hong Kong University of Science and Technology (HKUST) are working to increase the functionality available to wide bandgap gallium nitride (GaN) electronics. GaN is frequently used in power electronics, such as power converters and supplies. However, GaN CMOS technology has been hampered by the difficulties in implementing p-channel transistors and integrat... » read more

Reviving The IPO Route For IP Companies
By Ed Sperling - 01 Nov, 2021 - Comments: 0

K. Charles Janac, chairman and CEO of Arteris IP, sat down with Semiconductor Engineering to talk about the company's recent decision to go public, including the benefits and risks of operating as a public IP company. SE: The rule of thumb used to be $20 million in revenue was needed for an IP company to do an IPO at the turn of the Millennium, and then it increased to $40 million about a de... » read more

What’s Missing For Designing Chips At The System Level
By Ed Sperling - 01 Nov, 2021 - Comments: 0

Semiconductor Engineering sat down to talk about design challenges in advanced packages and nodes with John Lee, vice president and general manager for semiconductors at Ansys; Shankar Krishnamoorthy, general manager of Synopsys' Design Group; Simon Burke, distinguished engineer at Xilinx; and Andrew Kahng, professor of CSE and ECE at UC San Diego. This discussion was held at the Ansys IDEAS co... » read more

Research on Wire Sweep of Integrated Circuit Packaging Based on Three-dimensional Flow Simulation
By Technical Paper Link - 31 Oct, 2021 - Comments: 0

Abstract: "Semiconductor manufacturing technology is becoming more and more rapidly. In the process of Integrated Circuit (IC) encapsulation, when wires contact each other, it will cause short circuit. Wire sweep has become the main factor affecting the reliability of the product. Therefore, it is a great challenge to master wire sweep in IC packaging process. This paper takes Low Profile Fi... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 29 Oct, 2021 - Comments: 0

Chipmakers After years in the works, GlobalFoundries is finally a public company. But on its first day of trading on Thursday (Oct. 28), shares of the foundry vendor slipped a bit. GF finished its first day of trading at $46.40. This compares to the $47 per share it priced in the initial public offering (IPO), according a report to Reuters. The chipmaker has a market capitalization of about $2... » read more

Week In Review: Design, Low Power
By Jesse Allen - 29 Oct, 2021 - Comments: 0

Arteris IP uncorked its initial public offering this week, a rare occurrence for a semiconductor IP vendor over the past couple decades. The stock began trading on the Nasdaq Global Market on Wednesday under the ticker symbol AIP, gaining more than 40% on its first day. Tools Codasip updated its Studio processor design toolset. Version 9.1 includes an expanded bus support with full AXI for ... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 29 Oct, 2021 - Comments: 0

Automotive The automotive chip shortage is still affecting automotive OEMs. U.S. automakers Ford and GM reported lower 3rd quarter income year over year related to the chip shortage. They, as well as other automotive OEMs around the world, have had to temporarily shut assembly lines down when chips were not available. Infineon Technologies signed a memorandum of understanding with Hyundai M... » read more

2021 CWE Most Important Hardware Weaknesses
By Technical Paper Link - 28 Oct, 2021 - Comments: 0

"The 2021 CWE™ Most Important Hardware Weaknesses is the first of its kind and the result of collaboration within the Hardware CWE Special Interest Group (SIG), a community forum for individuals representing organizations within hardware design, manufacturing, research, and security domains, as well as academia and government. The goals for the 2021 Hardware List are to drive awarenes... » read more

Dealing With Market Shifts
By Brian Bailey - 28 Oct, 2021 - Comments: 1

Back in the days when I was in EDA development, I was taken in by the words of Clayton Christensen when he published "The Innovators Dilemma." He successfully introduced the technology world to the ideas of disruptive innovation. One of the key takeaways was that you should always be working to make your own successful products redundant, or someone else will do it for you. One tool I worked... » read more

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