Monitor And Control Automotive Devices With Over-The-Air Updates
By Siemens EDA - 05 May, 2021 - Comments: 0

Modern vehicles are complex electronic devices that require regular over-the-air (OTA) system and software updates to ensure their correct and safe operation. This paper discusses the need for OTA and the Siemens solutions that ensure OTA updates are secure and meet all regulations and standards. To read more, click here. » read more

MACsec Explained: Securing Data in Motion
By Rambus - 05 May, 2021 - Comments: 0

For end-to-end security of data, it needs to be secured when at rest (processed or stored in a device) and when in motion (communicated between connected devices). For data at rest, a hardware root of trust anchored in silicon provides the foundation upon which all data security is built. Similarly, for data in motion, security anchored in hardware at the foundational communication layer prov... » read more

Penetration Testing: A Buyer’s Guide
By Synopsys - 05 May, 2021 - Comments: 0

Data breaches continue to plague organizations—whether they’re targeted attacks from outside or malicious insiders. According to the 2020 IBM “Cost of Data Breach” report, 52% of breaches were caused by a malicious attack and the average total cost of a breach was $3.86 million. Many of these breaches are the result of combinations of errors or vulnerabilities, with attackers working th... » read more

Blog Review: May 5
By Jesse Allen - 05 May, 2021 - Comments: 0

Arm's William Wang considers how to increase the performance and programmability of persistent applications through using battery to protect the on-chip volatile cache hierarchy. Cadence's Paul McLellan finds that ransomware is getting more sophisticated, and more difficult to eradicate and defend against, with potentially life-threatening consequences. Synopsys' Jonathan Knudsen digs int... » read more

Steep Spike For Chip Complexity And Unknowns
By Ed Sperling - 05 May, 2021 - Comments: 0

Cramming more and different kinds of processors and memories onto a die or into a package is causing the number of unknowns and the complexity of those designs to skyrocket. There are good reasons for combining all of these different devices into an SoC or advanced package. They increase functionality and can offer big improvements in performance and power that are no longer available just b... » read more

Manufacturing Bits: May 4
By Mark LaPedus - 04 May, 2021 - Comments: 0

Measuring Moon dust The National Institute of Standards and Technology (NIST) and others have developed a new way to study and measure moon dust. Using an X-ray nano computed tomography (XCT) technique, researchers measured the 3D shapes of lunar particles as small as 400nm in length. The goal is to find out how these shapes impact the optical scattering characteristics of lunar dust on the... » read more

Power/Performance Bits: May 4
By Jesse Allen - 04 May, 2021 - Comments: 0

Speculative execution vulnerable again Computer scientists from the University of Virginia and University of California San Diego warn of a processor architecture vulnerability that gets around the techniques used to secure processors in the wake of Spectre. In 2018, Spectre and the similar Meltdown vulnerability were announced. These types of attacks could allow malicious agents to exploit... » read more

Startup Funding: April 2021
By Jesse Allen - 03 May, 2021 - Comments: 0

April showers brought mega fundraising rounds to the semiconductor industry. In China, a mobile chipset maker looking to go public won significant funding along with partnerships with major smartphone companies. In the US, AI hardware startups are drawing interest with unique processor architectures and business models. Plus, a major test and design services company drew new investment. This mo... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 30 Apr, 2021 - Comments: 0

Chipmakers and OEMs Intel wants $9.7 billion in subsidies for use in building a leading-edge fab in Europe, according to a report from Reuters. As reported, in March, Intel re-entered the foundry business, positioning itself against Samsung and TSMC at the leading edge, and against a multitude of foundries working at older nodes. Eighteen members of the European Union recently launched an ... » read more

Week In Review: Design, Low Power
By Jesse Allen - 30 Apr, 2021 - Comments: 0

IP, FPGA, Tools Arm released new details on its new Neoverse N2 and Neoverse V1 platforms. A range of companies announced they will be using the platforms, including Marvell and SiPearl. Aimed at server and HPC workloads, Neoverse V1 uses wider and deeper pipelines compared to the N1 and supports a 2x256bit wide vector unit executing the Scalable Vector Extension (SVE) instructions with sup... » read more

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