Future-proofing AI Models


Experts At The Table: Making sure AI accelerators can be updated for future requirements is becoming essential due to the rapid introduction of new models. Semiconductor Engineering sat down to discuss the challenges of future-proofing these designs with Marc Meunier, director of ecosystem development at Arm; Jason Lawley, director of product marketing for AI IP at Cadence; Paul Karazuba, vic... » read more

Blog Review: May 21


Synopsys’ Frank Malloy listens in on a panel discussing the engineering challenges introduced by multi-die designs, from multi-physics interactions that impact power and thermal integrity to the availability of multi-die packages and industry standards. Siemens’ Bruce Caryl shows how to determine how much a design’s power delivery network is contributing to jitter on the output drivers... » read more

Transformation Of 2D-ICs Into 3D-ICs Using Shuttle Chips From Multi-Project Wafers (Tohoku University)


A new technical paper titled "Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding" was published by researchers at Tohoku University. Abstract "Three-dimensional integrated circuit (3D-IC) technology, often referred to as through-silicon via (TSV) formation technology, has been steadily maturing and is increasingly used in advanced semic... » read more

Overview Of 103 Research Papers On Automatic SEM Image Analysis Algorithms For Semiconductor Defect Inspection (KU Leuven, Imec)


A new technical paper titled "Scanning electron microscopy-based automatic defect inspection for semiconductor manufacturing: a systematic review" was published by researchers at KU Leuven and imec. "We identified, categorized, and discussed automatic defect inspection algorithms that analyze scanning electron microscopy (SEM) images for semiconductor manufacturing (SM). This is a topic of c... » read more

Open-Source And Royalty-Free Confidential Computing For Embedded RISC-V Systems (IBM, Max Planck)


A new technical paper titled "ACE: Confidential Computing for Embedded RISC-V Systems" was published by researchers at IBM Research, IBM T.J. Watson Research Center, Max Planck Institute for Software Systems (MPI-SWS). Abstract "Confidential computing plays an important role in isolating sensitive applications from the vast amount of untrusted code commonly found in the modern cloud. We a... » read more

Energy-Aware DL: The Interplay Between NN Efficiency And Hardware Constraints (Imperial College London, Cambridge)


A new technical paper titled "Energy-Aware Deep Learning on Resource-Constrained Hardware" was published by researchers at Imperial College London and University of Cambridge. Abstract "The use of deep learning (DL) on Internet of Things (IoT) and mobile devices offers numerous advantages over cloud-based processing. However, such devices face substantial energy constraints to prolong batte... » read more

Air-Gap Covert Channel Attack On Spread Spectrum Modulated Clocks (IETR, Lab-STICC)


A new technical paper titled "Clock-to-Clock Modulation Covert Channel" was published by researchers at University of Rennes-INSA Rennes-IETR-UMR  and University of South Brittany/Lab-STICC- UMR CNRS. Abstract "Various Electromagnetic (EM) attacks have been developed to modulate and utilize EM emanations for covert communication, including exploiting processors, memory modules, and periphe... » read more

Problems In Testing AI Chips


As AI chips get larger, it becomes much harder to test them. Today, there can be as many as 22,000 pins on a 150mm² die, but in the future that number may increase to 80,000 pins. That creates a huge challenge for the fabs and the testers. Jack Lewis, chief technologist at Modus Test, talks about the intricacies of testing these complex devices, from maintaining contact with those pins even on... » read more

Chip Industry Technical Paper Roundup: May 20


New technical papers recently added to Semiconductor Engineering’s library: [table id=432 /] Find more semiconductor research papers here. » read more

Research Bits: May 20


Smart t-shirt with sound waves Researchers at ETH Zurich developed a smart textile that uses acoustic waves passed through glass fibers to measure touch, pressure, and movement. The researchers said that using acoustic waves rather than electronics makes measurements more precise with low power consumption and the textiles lighter, more breathable, and easier to wash. It also uses readily avai... » read more

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