Configurability In The Design Of Integrated Chipsets
By Expedera - 11 Jun, 2025 - Comments: 0

The semiconductor industry is experiencing significant changes as the requirements for processing data are evolving. Computing systems must manage unparallel massive amounts of data created by users, whether machines or humans. Artificial Intelligence is the mechanism by which this data gets processed, and it is driving a rethinking of the architectures of the computing systems. In conjunction ... » read more

Designing For Reliability With A System Life Estimator
By Cadence - 11 Jun, 2025 - Comments: 0

From big machines to small handheld equipment, all typically come with varying warranty timelines based on estimations. If this number is overestimated or underestimated, it can incur millions of dollars in losses to manufacturers. That’s why it’s important to look at the lifetime system estimation as a bottom-up process. The efficiency in this approach results in a robust method to formula... » read more

Towards Base-Station-On-Chip: Wireless Communication Kernels On A RISC-V Vector Processor (TU Dresden, CeTI)
By Technical Paper Link - 10 Jun, 2025 - Comments: 0

A new technical paper titled "Towards a Base-Station-on-Chip: RISC-V Hardware Acceleration for wireless communication" was published by researchers at TU Dresden and Centre for Tactile Internet with Human-in-the-Loop (CeTI). Abstract "The evolution of 5G and the emergence of 6G wireless communication systems impose higher demands for computing capabilities and lower power consumption in the... » read more

Evaluation of LLMs on HDL-Based Communication Protocol Generation (U. of Illinois Urbana, CISPA)
By Technical Paper Link - 10 Jun, 2025 - Comments: 0

A new technical paper titled "ProtocolLLM: RTL Benchmark for SystemVerilog Generation of Communication Protocols" was published by researchers at University of Illinois Urbana Champaign and CISPA Helmholtz Center for Information Security. Abstract "Recent advances in Large Language Models (LLMs) have shown promising capabilities in generating code for general-purpose programming languages. ... » read more

Front-End Technologies Are The New Back-End Tools: Using Picosecond Ultrasonics Technology For AI Packages, Part 1
By Cheolkyu Kim - 10 Jun, 2025 - Comments: 0

If you are a part of the semiconductor industry or simply someone interested in the field, you have likely heard what has become a common refrain: the back-end of the process is becoming more like the front-end of the process. In other words, the technologies that were once exclusively deployed in the first part of the process are being used to meet the increasingly stringent requirements of ad... » read more

In-System/In-Field Testing Using High-Quality Deterministic Test Patterns
By Ashrith Harith - 10 Jun, 2025 - Comments: 0

The amount of electronic content in passenger cars is growing rapidly, primarily due to the integration of advanced safety features. The shift towards fully autonomous vehicles, which must comply with stringent safety standards, will further increase the number of electronic components required. Testing efforts must be of exceptional quality. The target test time is often limited to less than 1... » read more

Tackling Advanced Chip Manufacturing Challenges
By Christophe Begue - 10 Jun, 2025 - Comments: 0

Intel and PDF Solutions are deepening their partnership to address the growing complexity of semiconductor manufacturing at advanced nodes, according to a recent discussion between Intel CEO Lip-Bu Tan and PDF Solutions CEO John Kibarian at the Direct Connect Intel Foundry event in April. During the presentation, Kibarian highlighted how the two companies have been collaborating for approxim... » read more

The Challenges Of Testing Automotive Chips
By Pawini Mahajan - 10 Jun, 2025 - Comments: 0

For as long as semiconductor devices have been around, motor vehicles have been one of the toughest operating environments. Chips in automobiles, trucks, and buses are subject to extremes of temperature, humidity, vibration, and radiation. The challenges of designing for these environmental conditions have grown more pronounced with advanced technology nodes, which are necessary to satisfy mark... » read more

Challenges In Using Sub-7nm ICs In Automotive
By Laura Peters - 10 Jun, 2025 - Comments: 0

The automotive industry is producing vehicles with increasing levels of real-time decision-making, enabled by thousands of ICs, sensors, and multi-chip packages, but making sure these systems work flawlessly throughout their expected lifetimes is a growing challenge. Automotive chips traditionally were developed at mature process nodes in five- to seven-year cycles, but much has changed over... » read more

Can Your ATPG Do This? Cut Defects Escaping Detection With ML
By Alex Burlak - 10 Jun, 2025 - Comments: 0

Chipmakers worldwide consider Automatic Test Pattern Generation (ATPG) their go-to method for achieving high test coverage in production. ATPG generates test patterns designed to detect faults in the silicon and ensures they are applied effectively using the chip’s Design-for-Test (DFT) infrastructure. This combination enhances fault detection while optimizing test efficiency. These patter... » read more

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