Clean Focus, Dose And CD Metrology For CD Uniformity Improvement
By KLA - 11 Jun, 2019 - Comments: 0

Authors: Honggoo Leea, Sangjun Hana, Minhyung Honga, Seungyong Kima, Jieun Leea, DongYoung Leea, Eungryong Oha, Ahlin Choia, Nakyoon Kimb, John C. Robinsonc, Markus Mengelc, Pablo Rovirac, Sungchul Yooc, Raphael Getinc, Dongsub Choib, Sanghuck Jeonb aSK Hynix, 2091, Gyeongchung-daero, Bubal-eub, Icheon-si, Gyeonggi-do, 467-701, Korea bKLA-Tencor Korea, Starplaza bldg., 53 Metapolis-ro, Hwasung... » read more

Hacking SoC IP Under Pressure
By SE Staff - 11 Jun, 2019 - Comments: 0

Hack@DAC certainly shows that some teams can find bugs faster than others. The hackfest, now in its third year, is a bug-finding contest for teams of university students joined by a smattering of industry members whose task is to find a bugs implanted in SoC IP.  The teams follow the practices of real-world security teams. “[The teams'] objective is to identify the security vulnerabilitie... » read more

Manufacturing Bits: June 10
By Mark LaPedus - 10 Jun, 2019 - Comments: 1

Predicting warpage in packages At the recent IEEE Electronic Components and Technology Conference (ECTC) in Las Vegas, there were several papers on ways to predict variation and warpage in IC packages. Advanced packages are prone to unwanted warpage during the process flow. The warpage challenges escalate as the packages become thinner. Warpage in turn can impact yields in IC packages. ... » read more

ECTC Packaging Trends
By Mark LaPedus - 10 Jun, 2019 - Comments: 0

At the recent IEEE Electronic Components and Technology Conference (ECTC) in Las Vegas, a number of packaging houses, R&D organizations and universities presented a slew of papers on the latest IC packaging technologies. The event provided a glimpse of the future of packaging, which is becoming more important in the industry. At one time, IC packaging took a backseat in the semiconductor... » read more

System Bits: June 10
By Jeff Dorsch - 10 Jun, 2019 - Comments: 0

SlothBot swings through the trees, slowly A robot that doesn’t often move, spending its days, weeks, months, in the forest canopy, monitoring the local environment – that’s SlothBot, from the Georgia Institute of Technology. The robot has two photovoltaic solar panels for its power source. It is designed to stay in the trees for months at a time. It’s gone through trials on the Geor... » read more

Power/Performance Bits: June 10
By Jesse Allen - 10 Jun, 2019 - Comments: 0

Quantum dots plus perovskites Researchers at the University of Toronto and KAUST created a hybrid material for solar cells that utilizes both perovskites and quantum dots. Both quantum dots and perovskites suffer from instability: perovskites degrade quickly and certain types become incapable of fully absorbing solar radiation at room temperature, while quantum dots must be covered with a p... » read more

Disregard Safety And Security At Your Own Peril
By Brian Bailey - 10 Jun, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss industry attitudes towards safety and security with Dave Kelf, chief marketing officer for Breker Verification; Jacob Wiltgen, solutions architect for functional safety at Mentor, a Siemens Business; David Landoll, solutions architect for OneSpin Solutions; Dennis Ciplickas, vice president of characterization solutions at PDF Solutions; Andrew Dauma... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 07 Jun, 2019 - Comments: 0

Market research IC Insights has released its forecast for chips in terms of applications. Communications is still the biggest IC market, but automotive is growing the fastest. In its first forecast of artificial intelligence (AI) edge processors, International Data Corp. (IDC) estimates that worldwide shipments of AI-optimized processors for edge systems will reach 340.1 million units in 20... » read more

5G Design Changes
By Ed Sperling - 07 Jun, 2019 - Comments: 0

Mike Fitton, senior director of strategic planning at Achronix, talks with Semiconductor Engineering about the two distinct parts of 5G deployment, how to get a huge amount of data from the core to the edge of a device where it is usable, and how a network on chip can improve the flow of data. » read more

Week In Review: Design, Low Power
By Jesse Allen - 07 Jun, 2019 - Comments: 0

M&A Infineon Technologies will acquire Cypress Semiconductor for $23.85 per share in cash, or $10.1 billion. The deal will place Infineon as the number eight chip manufacturer in the world based on 2018 revenues and create an automotive powerhouse, making the combined company the largest supplier of chips to the automotive market. Infineon sees potential to reach into new industrial and co... » read more

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