category: Blogs – LPHP

category: IoT, Security & Automotive

Power Management And Integration Of IPs In SoCs: Part 2
By Progyna Khondkar - 14 May, 2020 - Comments: 0

Most IP are available as either soft or hard macros. But both pose immense challenges. This is especially so when integrating them into low power designs and conducting power aware (PA) verification, because the majority of IP are self-contained and pre-verified at the block level and they must be preserved in their entirety when integrated or verified in the SoC level. Part one of this two ... » read more

Layout Generators For Artificial Intelligence Hardware Design
By Benjamin Prautsch - 14 May, 2020 - Comments: 0

Artificial intelligence (AI) is a powerful tool that offers great convenience in many areas of life. In addition to improving Internet searches and online shopping, it enables driver assistance systems that can save lives, for example. AI in its various forms is the essential tool for such applications, and it can be expected to show a similar development as microelectronics did. Although AI... » read more

Enabling Chiplet And Co-Packaged Optics Architectures With 112G XSR SerDes
By Suresh Andani - 14 May, 2020 - Comments: 0

Conventional chip designs are struggling to achieve the scalability, as well as power, performance, and area (PPA), that are demanded of leading-edge designs. With the slowing of Moore’s Law, high complexity ASICs increasingly bump up against reticle limits. The demise of Dennard scaling means power consumption is a growing challenge. In this context, disaggregated architectures such as chipl... » read more

The Need For 3D IC Packaging And Design Evolution
By Rita Horner - 14 May, 2020 - Comments: 0

If you are familiar with Moore’s Law, you’ve probably read pronouncements that the premise of transistor counts doubling each year is reaching a wall due to complex process technologies and device physics limitations. Regardless of how well transistor counts continue to scale, market segments continue to drive the thirst for more compute performance and fast time to markets. Artificial i... » read more

iSIM With IoT SAFE For Seamless Authentication From Chip To Cloud
By Paul Bradley - 14 May, 2020 - Comments: 0

When transferring data over mobile networks, IoT devices need to exchange that data securely and establish trust with a public or edge cloud in a way that’s seamless, scalable and easy to manage. IoT SAFE (IoT SIM Applet For Secure End-2-End Communication) enables IoT device manufacturers and IoT service providers to leverage the SIM (Subscriber Identity Module) as a robust, scalable and stan... » read more

Choosing Between Static and Dynamic Shapes
By Tyler Lockman - 14 May, 2020 - Comments: 0

That title might be a touch misleading. We’re not here to talk about why to convert shapes between static and dynamic. Rather, I want to talk about why you should NOT be doing this. Every design has some conductor shapes in it (or at least a very large percentage of them). What style to use is a choice that will impact performance through your entire flow; let the shape’s purpose guide you.... » read more

Monitoring For In-Die Process Speed Detection
By Richard McPartland - 14 May, 2020 - Comments: 0

Chip designers working on advanced nodes typically include a fabric of sensors spread across the die for a number of very specific reasons. In this, the second of a three-part blog series, we explore some of the key applications and benefits of these types of sensing solutions. In this installment, the focus is In-Die Process Speed Detection and why understanding in-chip process speed detecti... » read more

Doing More For Less With Upgraded LON Networks
By Apurba Pradhan - 14 May, 2020 - Comments: 0

At Adesto, we talk a lot about the importance of embracing all IoT communications protocols. We believe that our customers and their customers can derive great benefit from building and industrial control solutions that connect to industrial field bus protocols such as BACnet, LON and Modbus, as well as IP-based protocols – especially when those solutions are enabled to work seamlessly togeth... » read more

Using AI-Optimized Tuning To Design 5G And mmWave Filters
By David Shin - 14 May, 2020 - Comments: 0

The demand for 5G applications increases the need for radio frequency (RF) and microwave filter components in the mm-Wave frequency bands. The SynMatrix online interface with the AI-optimized tuning panel. “5G applications present some unique challenges to mm-Wave and 5G passive components,” said Diamond Liu, product manager of SynMatrix. “Fabrication capability limitations make i... » read more

Benefits Of In-Chip Thermal Sensing
By Richard McPartland - 22 Apr, 2020 - Comments: 0

The latest SoCs on advanced semiconductor nodes typically include a fabric of sensors spread across the die, and for good reason. But why and what are the benefits? This first blog of a three-part series explores some of the key applications for in-chip thermal sensing and why embedding in-chip monitoring IP is an essential step to maximize performance and reliability and minimize power, or a... » read more

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