Making Electric Vehicles Go Further With New Materials


It’s no secret that vehicle original equipment manufacturers (OEMs) are aggressively pursuing electric vehicle (EV) development. Among the headwinds they face in selling their technology to consumers are price and vehicle range. Not surprisingly, there is a direct correlation between the two — in 2021, for any EV under $40,000, the average vehicle range was 187 miles, while the lowest veh... » read more

The Computational Electromagnetics Simulation Challenge Of 3D-IC


By Kelly Damalou and Matt Commens Innovation in semiconductor design today is energized primarily by AI/ML, data centers, autonomous and electric vehicles, 5G/6G, and IoT. Recently developed 2.5 and 3D-IC silicon-based packaging technologies have advanced the state of the art beyond SoC technologies which first united digital, analog, and memory functions on a single chip in the '90s. These ... » read more

Challenges And Solutions In Chip Design


Ansys is hosting IDEAS Digital Forum 2022, a no-cost virtual event that brings together industry executives and technical design experts to discuss the latest in EDA for Semiconductors, Electronics, and Photonics. The December 6th on-line event starts with Keynote addresses from Raja Koduri from Intel, Pankaj Kukkal from Qualcomm, and insights into the metaverse from DP Prakash with start-up... » read more

An Update On 5G And Aircraft Safety


The U.S. aircraft industry is in the final phases of adapting aircraft and airports to address concerns over potential 5G cellular signal interference of automated landing systems. The Federal Aviation Administration (FAA) has driven the process to determine the level of risk to aircraft and safeguard against problems for low-visibility approaches — such as during inclement weather — for ne... » read more

What’s So Different About Interposer Signal Integrity?


By Kelly Damalou and Pete Gasperini To achieve gains in power, performance, area, and cost, 3D-IC architectures are pushing electronics design to new limits. Silicon integration technology and associated devices have undergone an impressive evolution over the last several decades. Their development encourages technological advancement in applications like high-performance computing, Artificial... » read more

Coming In Hot: Requirements For Successful Thermal Management In 3D-IC


As the speed, density, and capabilities of electronics have all increased, power has become a first order driver in almost all electronic systems. For instance, it’s well recognized that heat is often the number one limiting factor in 3D-IC design. High-speed chips stacked close together in a small housing cause things to heat up fast. One of the most common designer responses to overheating ... » read more

Artificial Intelligence 101: It’s Math, Not Magic


The term artificial intelligence (AI) can be somewhat misleading. While the medium of intelligence is designed (and, in that sense, artificial or human-made), the intelligence itself is based on very real data. However, most people hear “AI” and think of futuristic robots or scenes from science fiction movies, not recognizing that the origin of AI is not fictional or magical — it’s math... » read more

A Glimpse Into Deep Space With Extreme Optical Engineering


By Daewook Kim and Erik Ferguson In the past few decades, optical science has pushed far beyond the foundations originally laid by Galileo and Newton 400 years ago. The planned deployment of new ground- and space-based telescopes dedicated to seeing farther into deep space in more detail than ever before will provide astronomers with increased opportunities to find Earth-like exoplanets and ... » read more

Thermal Cycling Failure In Electronics


Each time a device is turned off and on, its temperature changes. (Just think about how often your phone lights up all day.) Energy flowing through several layers of tightly stacked materials causes devices to heat up, then rapidly cool down. This repeated oscillation between temperatures over the lifetime of a device is called thermal cycling. Why thermal management is important Thermal cycl... » read more

Electromagnetic Simulation And 3D-IC Interposers


By Matt Commens, Juliano Mologni, and Pete Gasperini Today’s 3D integrated circuit (3D-IC) technology is the culmination of 40 years of research in universities and laboratories scattered across the globe. Beginning with dynamic random-access memory (DRAM) deployments that appeared on the market a decade ago, 3D-IC has since expanded its reach. It is now decisively beginning to achieve the... » read more

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