3D Sensing Package Solutions

By Chiung Lee - 15 Dec, 2022 - Comments: 0

By Chiung Lee, Weilung Lu, and Adrian Arcedera 3D sensing technology is rapidly being adopted in a variety of growing markets. End-product applications include smartphones, tablets, augmented/virtual reality products, robot vacuum cleaners, industry inspection machines, and automotive vehicles. As shown in figure 1, Yole Développement expects the 3D imaging and sensing market to expand from... » read more

The Rise Of Copper Wires In Automotive ICs

By Prasad Dhond - 17 Nov, 2022 - Comments: 0

In 2011, the price of Gold (Au) surged to $1900/oz which had a drastic impact on Wirebonded ICs using Au wires. IC suppliers scrambled to convert from Au to copper (Cu) wire on as many products as they could. However, automotive ICs were reluctant to make the jump due to lack of reliability data and performance track-record. However, today’s automotive ICs are big users of Cu wires driven by ... » read more

Production Testing Of Discrete Power Products

By Vineet Pancholi - 20 Oct, 2022 - Comments: 0

By Vineet Pancholi and Dennis Dinawanao Metal Oxide Silicon Field Effect Transistors (MOSFETs), Insulated Gate Bipolar Transistors (IGBTs), Bipolar Junction Transistors (BJTs), diodes, and application specific multi-transistor packaged modules are some of the more popular discrete products. Switches control the flow of current within a circuit. MOSFETs are a building block of most electronic... » read more

Thermal Simulation Of DSMBGA And Coupled Thermal-Mechanical Simulation Of Large Body HDFO

By Nathan Whitchurch - 15 Sep, 2022 - Comments: 0

Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that were once separate components on a printed circuit board (PCB) have now been relocated along with all their associated passive devices and interconnects into single System in Package (SiP) style suba... » read more

Heterogeneous IC Packaging: Optimizing Performance And Cost

By Mike Kelly - 18 Aug, 2022 - Comments: 0

Leading integrated circuit (IC) foundries are already shipping 7-nm and 5-nm wafers and 3-nm product qualifications are ongoing. Wafer costs continue to soar as high transistor density requires ever more expensive processes to fabricate them. Even if defect densities can remain relatively flat as new nodes emerge, the cost per unit area of silicon increases nonlinearly. These economics have pla... » read more

IC Package Illustrations, From 2D To 3D

By Tyler DeHaan - 21 Jul, 2022 - Comments: 1

In five words or less can you describe what a semiconductor is? Some might say a computer chip, others may say they are "space magic," but I would venture that most people have never heard the word before and would simply say "I have no idea." I was certainly a part of the latter crowd before I began my internship with Amkor Technology where I was brought on board as a 3D illustrator to create ... » read more

Packaging Solutions For Unique Markets

By Marc Mangrum - 16 Jun, 2022 - Comments: 0

The MicroLeadframe (MLF/QFN) packaging technology is the fastest growing IC packaging solution today. From a market segment perspective, MLF packaging solutions represent a >111B-unit market for 2022 across 5 unique markets: automotive, consumer, industrial, computing/networking, and communications. The package solution requirements across these markets varies but, the fundamental values the... » read more

The Drive Toward Zero Defects

By Prasad Dhond - 19 May, 2022 - Comments: 0

The automotive semiconductor market has doubled twice in the past 20 years. But the next doubling will be even faster. While short-term results may vary, it is certain that auto semis will be much larger 10-20 years from now. Today, a gas-powered car has ~$400 of semiconductor content whereas the Tesla Model 3 with an electric powertrain and Advanced Driver Assist System (ADAS) has >4... » read more

Challenges For Achieving Automotive Grade 1/0 Reliability In FCBGA and fcCSP Packages

By Knowlton Olmstead - 21 Apr, 2022 - Comments: 0

As the quantity, complexity, and functions of electronic devices in automobiles increase, understanding and characterizing package reliability is of significant concern and importance. The Automotive Electronics Council (AEC) Q-100 specification for Grade 1 and 0 reliability introduces unique challenges as thermal cycling (TC) and high temperature storage (HTS) requirements increase. Additional... » read more

Wirebond IC Substrates: Challenges Ahead

By Prasad Dhond - 17 Mar, 2022 - Comments: 0

Substrate suppliers are slashing capacity allocated to wirebond IC substrates. We hear about "limited tenting capacity," "no support for EBS designs," and requests for "conversion to etchback" designs. What does all this mean? Let's start with "Line" and "Space." "Line" is the width of a trace on a substrate and "Space" is the distance between the two traces. For wirebond packages such a... » read more

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