category: Connect With SEMI

category: IoT, Security & Automotive

Breaking the Barrier Again: Fab Equipment Spending Up in 2012; in 2013 to Reach an All-Time Record High
By Christian Dieseldorff - 11 Jun, 2012 - Comments: 0

Strong Improvement also Seen in Fab Construction By Christian Gregor Dieseldorff, SEMI Industry Research & Statistics (June 1, 2012) Breaking the barrier into positive growth for 2012, the end-of-May edition of the World Fab Forecast shows improved growth in fab equipment spending this year — at US$ 39.5 billion, a two percent year-over-year (YoY) increase.  For 2013, fab equipment... » read more

Photomask Market to Hit $3.35 billion in 2013
By Lara Chamness - 09 May, 2012 - Comments: 0

by Lara Chamness, senior market analyst, SEMI Industry Research and Statistics The worldwide semiconductor photomask market was $3.12 billion in 2011 and is forecasted to reach $3.35 billion in 2013. After reaching a market peak in 2010, the photomask market grew another 3 percent in 2011 to set another market high. The mask market is expected to grow 4 percent and 3 percent sequentially ove... » read more

European Policy Considerations for Supporting the 450mm Supply Chain and Existing Manufacturing
By SEMI - 08 Mar, 2012 - Comments: 0

By Heinz Kundert, president, SEMI Europe European competitiveness in the semiconductor industry was the focus of the SEMI Industry Strategy Symposium Europe 2012 executive conference recently held in Munich, Germany. Over 200 delegates from 20 countries gathered to hear about the strengths and issues of concern for chip manufacturing in Europe, including the implications of the industry-wide... » read more

Packaging Community Takes on New Challenges through Industry Collaboration
By SEMI - 25 Jan, 2012 - Comments: 0

By Tom Salmon, senior director, SEMI As the semiconductor industry responds to increasing demands for lower power, higher performance and reduced form factor, packaging technologies are increasingly important.  This enhanced importance in the micro-electronics food chain is mirrored in a growth of the different segments of the packaging market.  According to the recently updated Global Sem... » read more

Substrates for Semiconductor Packaging
By SEMI - 16 Jan, 2012 - Comments: 0

2012 Market Outlook for Laminate and Leadframe Materials By Jan Vardaman, TechSearch International, and Dan Tracy, SEMI Combined, laminate substrates and leadframes will represent an estimated US$ 13.3 billion market in 2011 and is forecasted to reach $14 billion in 2012. This is larger than the revenues for silicon wafers (including silicon-on-insulator wafers) of $10.3 billion in 2011 and... » read more

Mighty Japan Endures as Leader
By Christian Dieseldorff - 16 Nov, 2011 - Comments: 0

By Christian Gregor Dieseldorff After the devastating natural disaster in March, Japan’s semiconductor industry has once again proven that it can overcome disaster and recover quickly. Japan is home to a large number of semiconductor companies and has the largest share of total installed fab capacity. In addition, fabs in Japan lead in cutting-edge technology such as 24nm and 19nm NAND Fla... » read more

The End of the DRAM Era – Flash Spending Surpasses DRAM
By SEMI - 06 Oct, 2011 - Comments: 0

By Clark Tseng, SEMI Industry Research and Statistics, Taiwan The semiconductor memory industry has a long history of fluctuating market cycles. The DRAM sector in particular has gone through a few bad cycles and witnessed quite a few consolidations in the past ten years or so.  However, DRAM continues to be one of the most important and capital intensive sectors in the semiconductor indust... » read more

450mm and EUV Linked With Uncertainty
By Jonathan Davis - 13 Sep, 2011 - Comments: 0

By Jonathan Davis The transition to manufacturing semiconductors on larger wafers continues to be one of the hottest topics in the industry. Some chipmakers have committed to advancing the transition. Intel announced that its D1X fab in Oregon will be 450mm compatible (2013). TSMC announced a 450mm pilot line by 2013-2014. IMEC and ISMI have well-established programs focused on the challeng... » read more

3D-IC, LED and 450 mm Update
By SEMI - 03 Sep, 2011 - Comments: 0

By James Amano, director, SEMI International Standards The SEMI International Standards Program brings together industry experts to exchange ideas and work towards developing globally accepted technical standards. SEMI provides a forum for the essential collaborations that must be achieved to move new and existing markets forward efficiently and profitably. Here are the latest updates on... » read more

Industry Leaders See a Promising but Challenging Future
By Tom Morrow - 04 Aug, 2011 - Comments: 0

By Tom Morrow “The challenge with all these technologies is that we cannot decouple them from the economics,” said Rick Wallace, president and CEO of KLA-Tencor during the annual Executive Summit at SEMICON West. While aligning the economics of new production technologies such as EUV, III-V materials, FinFETS, and 450 mm wafers have yet to be fully worked out, the insatiable appetite for... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy