A New Class Of Actuators Mimicking Human Muscle


Developing robots with human-like muscles that produce autonomous movement is not possible using traditional rigid, high-voltage electronics. However, recent research funded by FlexTech, a SEMI Technology community, shows promise in incorporating microcircuits to do just that by directly controlling and operating HASEL actuators. The innovation could guide intelligent, goal-oriented robots in ... » read more

Next Gen Laser Assisted Bonding (LAB) Technology


In the semiconductor market, there are many applications including smartphone, tablets, central processing units (CPUs), artificial intelligence (AI), data cloud and more that are expecting rapid growth. Among them, CPU data processing, AI and data cloud require much higher power consumption than smart phones or tablets. For the higher power applications, Flip Chip ball grid array (FCBGA) or 2.... » read more

The Impact Of Metal Gate Recess Profile On Transistor Resistance And Capacitance


In logic devices such as finFETs (field-effect transistors), metal gate parasitic capacitance can negatively impact electrical performance. One way to reduce this parasitic capacitance is to optimize the metal gate recess dimensions. However, there are limits to reducing this capacitance if you simply remove more of the metal material, since this can modify capacitance unexpectedly through chan... » read more

Reflections On Photomask Japan 2023: Embracing The Era Of Curvilinear Masks


In April, 2023, I had the privilege of participating in Photomask Japan 2023 (PMJ2023), a web conference that brought together experts and enthusiasts in the field. The conference commenced with an enlightening keynote talk by Dr. Kurt Ronse of imec on the status and challenges of the high NA EUV ecosystem, presenting roadmaps for the introduction of high NA EUV. I would like to express my grat... » read more

Enabling New Functionality In Medtech And Biotech Devices


Medtech and biotech devices are uniquely suited to benefit from emerging electronic capabilities – specifically, the kind of electronics design, packaging and assembly offerings that are Promex’s specialty. With that said, these markets present a variety of manufacturing challenges and demands that require heterogeneous integration (HI) to address. This two-part blog post provides a high... » read more

MEMS & Sensors Market Forecast: Impact Of Semiconductor Industry Slowdown


Of all technologies, MEMS and sensors stand out for their far-reaching promise to improve lives across segments such as Internet of Things (IoT), wearables, smart home, digital health, precision agriculture, autonomous vehicles, robotics, and environmental monitoring. Little wonder, then, that the growth of the MEMS and sensor design and manufacturing industry is among the hottest topics at ... » read more

A Deposition And Etch Technique To Lower Resistance Of Semiconductor Metal Lines


Copper's resistivity depends on its crystal structure, void volume, grain boundaries and material interface mismatch, which becomes more significant at smaller scales. The formation of copper (Cu) wires is traditionally done by etching a trench pattern in low-k silicon dioxide using a trench etch process, and subsequently filling the trench with Cu via a damascene flow. Unfortunately, this meth... » read more

Supply Chain Resilience And Agility: Two Critical Sides Of The Same Coin


Over the past three years of major global disruptions, the supply chains of many industries have sharpened their focus on resilience. Today, discussions on electronics industry resilience center on redundancy across suppliers, multi-tier supplier mapping, nearshoring, reducing the number of unique parts, regionalizing supply chains, and business continuity planning. Resilience connotes a st... » read more

Revising 5G RF Calibration Procedures For RF IC Production Testing


Modern radio frequency (RF) components introduce many challenges to outsourced semiconductor assembly and test (OSAT) suppliers whose objective is to ensure products are assembled and tested to meet the product test specifications. The growing advancement and demand for RF products for cellphones, navigational instruments, global positioning systems, Wi-Fi, receiver/transmitter (Rx/Tx) componen... » read more

Panel Tackles Chiplet Packaging Challenges


QP Technologies recently exhibited at the first Chiplet Summit, held January 24-26 in San Jose, California. Dick Otte, CEO of our parent company Promex Industries, participated on a panel titled “Best Packaging for Chiplets Today.” Moderated by Nobuki Islam with JCET Group, the packaging panel also included Daniel Lambalot, Alphawave Semi; Laura Mirkarimi, Adeia; Syrus Ziai, Eliyan; and Mik... » read more

← Older posts Newer posts →