category: Blogs – MD

category: IoT, Security & Automotive

How Does Line Edge Roughness (LER) Affect Semiconductor Performance At Advanced Nodes?
By Yu De Chen - 26 Sep, 2022 - Comments: 0

BEOL metal line RC delay has become a dominant factor that limits chip performance at advanced nodes [1]. Smaller metal line pitches require a narrower line CD and line to line spacing, which introduces higher metal line resistance and line to line capacitance. This is demonstrated in figure 1, which displays a simulation of line resistance vs. line CD across different BEOL metals. Even without... » read more

Thermal Simulation Of DSMBGA And Coupled Thermal-Mechanical Simulation Of Large Body HDFO
By Nathan Whitchurch - 15 Sep, 2022 - Comments: 0

Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that were once separate components on a printed circuit board (PCB) have now been relocated along with all their associated passive devices and interconnects into single System in Package (SiP) style suba... » read more

Smart Manufacturing And Advanced Technical Service
By Serena Brischetto - 15 Sep, 2022 - Comments: 0

SEMI spoke with Eyal Shekel, senior vice president of Service Strategy and Excellence at Tokyo Electron Limited, about the impact of artificial intelligence (AI) on smart manufacturing and how other fab solutions for smarter process tools are advancing semiconductor manufacturing. SEMI: AI technology is considered a key enabler for smart manufacturing. What are the latest trends? Shekel:... » read more

3D NAND Virtual Process Troubleshooting And Investigation
By Brett Lowe - 18 Aug, 2022 - Comments: 0

Modern semiconductor processes are extremely complicated and involve thousands of interacting individual process steps. During the development of these process steps, roadblocks and barriers are often encountered in the form of unanticipated negative interactions between upstream and downstream process modules. These barriers can create a long delay in the development cycle and increase costs. ... » read more

Hybrid Bonding Basics: What Is Hybrid Bonding?
By Jessica Albright - 18 Aug, 2022 - Comments: 2

Hybrid bonding is the key to paving an innovative future in advanced packaging. Hybrid bonding provides a solution that enables higher bandwidth and increased power and signal integrity. As the industry is looking to enhance the performance of final devices through scaling system-level interconnections, hybrid bonding provides the most promising solution with the ability to integrate several di... » read more

Collaborating To Decarbonize The Semiconductor Manufacturing Value Chain
By Mousumi Bhat - 18 Aug, 2022 - Comments: 0

By Mousumi Bhat and Peter Spiller SEMICON West 2022 Hybrid gathered experts from across the semiconductor industry for the debut Sustainability Summit to talk about the sustainability of the industry’s growth. Semiconductor chips have become ubiquitous in recent years. All aspects of society have become extremely dependent on semiconductors. The post-pandemic revenue growth of semicondu... » read more

Heterogeneous IC Packaging: Optimizing Performance And Cost
By Mike Kelly - 18 Aug, 2022 - Comments: 0

Leading integrated circuit (IC) foundries are already shipping 7-nm and 5-nm wafers and 3-nm product qualifications are ongoing. Wafer costs continue to soar as high transistor density requires ever more expensive processes to fabricate them. Even if defect densities can remain relatively flat as new nodes emerge, the cost per unit area of silicon increases nonlinearly. These economics have pla... » read more

Heterogeneous Integration Device Assembly: Key To Enabling Additional Innovations
By Dick Otte - 18 Aug, 2022 - Comments: 0

Heterogeneous integration (HI) improves device functionality by expanding the types of parts and physical configurations combined with silicon chips. Different parts add new functions – with minimal additional volume – thus increasing overall functionality per unit volume. By comparison, classic methods employed to build electronic products, e.g., circuit boards or metal boxes, increase pro... » read more

IC Package Illustrations, From 2D To 3D
By Tyler DeHaan - 21 Jul, 2022 - Comments: 1

In five words or less can you describe what a semiconductor is? Some might say a computer chip, others may say they are "space magic," but I would venture that most people have never heard the word before and would simply say "I have no idea." I was certainly a part of the latter crowd before I began my internship with Amkor Technology where I was brought on board as a 3D illustrator to create ... » read more

Radio Frequency Filters For 5G: What They Are And Why They’re Worth The Trouble
By David Haynes - 21 Jul, 2022 - Comments: 0

By David Haynes, Daniel Shin, and Lidia Vereen­ In the recent blog article "Our wireless world – how Wi-Fi 6 will seamlessly integrate with 5G to keep us connected," David Haynes from our Customer Support Business Group (CSBG) explained how this new generation of wireless technologies will improve our connectivity by using higher frequencies and greater bandwidth than current 4G and Wi-F... » read more

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