category: Blogs – MD

category: IoT, Security & Automotive

The Urge To Merge
By Jonathan Davis - 14 Dec, 2015 - Comments: 0

The electronics supply chain will remember 2015 as a year of unprecedented consolidation due to relentless acquisition activity, mega mergers and a rampant restructuring of the industry. Almost every other week brought a momentous announcement. Seemingly, before one could appreciate the current status, the industry reverberated with yet another new deal. To better understand the scope of M&A... » read more

MEMS: Flexible, Reusable Platforms Facilitate Innovation
By Paula Doe - 07 Dec, 2015 - Comments: 0

As the game-changing enabler for whatever the emerging market of widespread fragmented intelligence turns out to look like, the MEMS sector is in some ways the bellwether for much of the greater semiconductor/components supply chain looking to rethink how to serve a wider range of fragmented applications with lower costs and faster time to market. Leaders from Cisco, InvenSense, Nasiri Ventures... » read more

Healthy Growth Predictions For MEMS
By Paula Doe - 30 Nov, 2015 - Comments: 0

To figure out what’s actually happening in the emerging Internet of Things (IoT) market, there’s no better place to look than MEMS and sensors, which are enabling this revolution in embedded intelligence in ever more places. The MEMS market is seeing continued steady growth, but components suppliers also are seeing brutal price declines and low margins, while the data analysis side captures... » read more

You’re Not Alone
By Srinivas Velivala - 19 Nov, 2015 - Comments: 0

All too often we get caught up in our own work and our own issues, thinking no one else could possibly be having as much trouble as we are. The reality is that many, if not most, of the problems and challenges in IC verification are not unique to one design, one team, or one person. The natural reluctance of people to admit they are struggling with some aspect of their job often keeps them from... » read more

Packaging Wars Ahead
By Ed Sperling - 19 Nov, 2015 - Comments: 0

There has been much talk about semiconductor industry consolidation, but the shift into advanced packaging could have more far-reaching effects than all the mega-deals so far. Packaging is big business. Yole Développement has pinned the market at $30 billion, but that's only a thin slice of the pie that's in play. Companies that win the packaging deals also have a good shot of winning the m... » read more

Inside X-ray Metrology
By Mark LaPedus - 19 Nov, 2015 - Comments: 0

Chipmakers are ramping up a new class of chip architectures, such as 3D NAND and finFETs. Measuring and characterizing the tiny structures in these technologies is a major challenge. It will not only take the traditional metrology tools, but also various X-ray techniques. To get a handle on X-ray metrology, Semiconductor Engineering recently discussed the trends with the following experts: ... » read more

The Growing Role Of Extended Supply Chain Collaboration
By Karen Savala - 19 Nov, 2015 - Comments: 0

At the executive keynote panel held at Semicon West 2015, one of the key industry challenges discussed was the growing need for closer collaboration between supply chain partners in order to support the fast time to market and shortened product lifecycles of today’s consumer electronics. Traditionally, the yield ramp phase has been a critical time to resolve manufacturing issues, enable high ... » read more

ReRAM Gains Even More Steam
By Michael Watts - 19 Nov, 2015 - Comments: 0

The prospect of using the latest in finFET processing to enable embedded non-volatile memory (NWM) will be described by a team from TSMC and Tsing Hua University in Taiwan at the IEDM meeting on Dec. 8 in Washington, D.C. Embedded NVM has been the first commercial application of ReRam, with products from Panasonic and Terrazon. Industry leaders agree the creation of NVM as a seamless additio... » read more

The Silicon Foundry Market Is Alive And Well
By Rich Wawrzyniak - 19 Nov, 2015 - Comments: 0

I attended the ARM TechCon conference in Santa Clara last week and met with the GlobalFoundries team to discuss their new 14nm finFET technology. GlobalFoundries’ 14LPP technology offering was qualified in the third quarter of 2015 and is on track for volume production in 2016. FX-14 design kits are available to customers now.  This announcement was the culmination of an extensive body of... » read more

How Will China Spend $120B?
By Ed Sperling - 22 Oct, 2015 - Comments: 1

It's daunting to consider how much Chinese VC and government money is ready for investment around the globe. With the total now estimated somewhere in the neighborhood of $120 billion, that's a huge stockpile of cash. Just to put that in perspective, roughly $48.3 billion was invested by U.S. investors in 2014, according to a report issued by the National Venture Capital Association and Pricewa... » read more

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