category: Blogs – MD

category: IoT, Security & Automotive

Resetting Expectations On Multi-Patterning Decomposition And Checking
By David Abercrombie - 22 Oct, 2015 - Comments: 0

It never ceases to amaze me how much confusion and misunderstanding there is when it comes to multi-patterning (MP) decomposition and checking. I sometimes forget just how new a topic it is in our industry. Because of this short-lived history, and the limited time designers have had to acquire any detailed understanding of its complexity, there appears to be some serious disconnect in expectati... » read more

China’s MEMS Foundry Business Takes Shape
By SEMI - 22 Oct, 2015 - Comments: 0

By Clark Tseng Over the years, MEMS has evolved from a niche segment to a strong growth market thanks to the wide adoption from mobile devices in recent years. With the industry moving to the Internet of Things (IoT) era, MEMS will play an even more important role ─ enabling the realization of IoT environment. In the semiconductor ecosystem, China is the largest consumption market but i... » read more

Inside The Quantum Dot
By Mark LaPedus - 22 Oct, 2015 - Comments: 0

Quantum dots, a relatively new and emerging technology, are creating a buzz in the industry. Basically, when inserted into an LCD TV, quantum dots can boost the color gamut in the display, enabling vivid picture quality with relatively little capital. Quantum dots can also be used in other applications, such as solar and LED lighting. To get a handle on the technology, Semiconductor Enginee... » read more

Design Techniques Are Helping To Keep Moore’s Law Alive Longer
By Imec - 22 Oct, 2015 - Comments: 0

By Francky Catthoor Moore's Law means that electronic products can constantly be produced more cheaply, faster and more economically. Down to 45nm, this was due mainly to the technology that made it possible to reduce the size of transistors. Now things are becoming more difficult. But even if we are not able to achieve these gains through the further scaling of transistors as the result ... » read more

High-Speed Systems Need High-Speed Parts For Prototyping
By Rich Wawrzyniak - 12 Oct, 2015 - Comments: 0

One of the ironies of prototyping for high-speed system design using FPGAs is that in the past most FPGAs did not run at the speeds required by the end system. Many of these FPGAs today have high speed SerDes channels used for communicating with other elements of the system at close to the speeds specified by the designer. Unfortunately most of the FPGAs used for the prototyping phase of the sy... » read more

Raise A Fence, Dig A Tunnel, Build A Bridge
By Ed Sperling - 17 Sep, 2015 - Comments: 0

There are three main options for chipmakers over the course of the next decade. Which option they choose depends upon their individual needs, talents, and how much and what kind of differentiation they believe will matter to them. The options roughly fall into three categories—fence, bridge or tunnel. The fence option Rather than changing anything, the entire ecosystem can stick to wha... » read more

Inside The MRAM
By Mark LaPedus - 17 Sep, 2015 - Comments: 0

Today, the industry is shipping various next-generation nonvolatile memory types, such as 3D NAND, MRAM and ReRAM. In fact, MRAM has been shipping for some time. To get a handle on MRAM, Semiconductor Engineering sat down to discuss the technology with Phillip LoPresti, president and chief executive of Everspin, a supplier of MRAMs. What follows are excerpts of that conversation. SE: Where ... » read more

Déjà Vu For CMP Modeling?
By Jeff Wilson - 17 Sep, 2015 - Comments: 0

One definition of design for manufacturing (DFM) is providing knowledge about the impact of the manufacturing process on a design layout to the designers, so they can use that information to improve the robustness, reliability, or yield of their design before tapeout. Essentially, DFM is about designers taking ownership of the full “lifecycle” of a design, and going beyond the required desi... » read more

SEMICON Taiwan’s Packaging Punch
By SEMI - 17 Sep, 2015 - Comments: 0

SEMICON Taiwan packed a punch, setting several new records and new heights in 2015. This year marked the 20th anniversary of SEMICON in Taiwan and was the largest SEMICON in Taiwan ever, with a Nobel Prize winner (Professor Shuji Nakamura, 2014’s winner) keynoting the Executive Summit, Taiwan’s President Ma speaking at the hugely attended Gala Dinner, and 2015 on track for TSMC to be the wo... » read more

New System Requirements Demand a Creatively Choreographed Ecosystem
By Jim Feldhan - 17 Sep, 2015 - Comments: 0

In the past, integrated circuits, packages and boards were all designed independently, and yet in most cases still managed to fit together with very few functional or technical problems. However, recent advances in chip performance have changed this process dramatically. New designs, processes and materials already have been seen in packaging as high-performance semiconductor chips need to c... » read more

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