category: Blogs – MD

category: IoT, Security & Automotive

We Must Teach Chips To Feel Pain
By Imec - 17 Sep, 2015 - Comments: 0

By Guido Groeseneken When I was a doctorate student in the 1980s there was lots of wild speculation about Moore’s Law: give it another 10 years and transistors will stop getting smaller, they were saying back then. But in the end, the creativity of engineers turned out to be greater than the pessimism of the forecasters. Yet today I believe that we are close to the end of Moore’s Law.... » read more

Much Ado About Weakening Currency, China, And IoT
By Lara Chamness - 31 Aug, 2015 - Comments: 0

At the 10th annual SEMI/Gartner Market Symposium, keynoted by ARM’s Ian Ferguson, market analysts gathered to present their views on the current state of the industry. Several key themes emerged including weakening currency impact on the industry’s forecasts, China’s $20 billion Industry Fund, and the Internet of Things (IoT). Industry overview and trends were presented by Bob Johnson,... » read more

Shrinking R&D Pool
By Ed Sperling - 20 Aug, 2015 - Comments: 2

The rule of thumb in business is that consolidation in a maturing industry improves the health of the surviving companies. In most market sectors that's true. In the semiconductor industry, that formula doesn't work. The reason is due to what might well be called foundational economics. While it's possible to reduce costs in making chips for years to come, at some point the basic building bl... » read more

Still Searching For Rare Earths
By Mark LaPedus - 20 Aug, 2015 - Comments: 1

There is both good and bad news for buyers of rare earths. The good news: It’s a buyers’ market. Prices for rare earths remain depressed amid a glut in the marketplace. The bad news: The supplier base is shaky. China still accounts for 85% of the world’s total production of rare earths, but most Chinese suppliers are operating at a loss. And two of the main non-Chinese suppliers, M... » read more

Wanted: Integrated Approach To Hardware Design
By Semico Research - 20 Aug, 2015 - Comments: 0

By Tarun Amla Today’s electronic products have become so sophisticated and ubiquitous that we have come to expect that each new generation will address both our current and future needs. Years ago, the industry was hardware-centric and driven by “big iron” products. Capacity and functionality were thoroughly dependent upon increasingly complex hardware. Think of the movies of the 1950s w... » read more

Case Studies in P&R Double-Patterning Debug
By David Abercrombie - 20 Aug, 2015 - Comments: 0

In my last article, we looked at some case studies of the unique types of issues related to double patterning (DP) that place and route (P&R) and chip finishing engineers have to deal with. I’ve got some more interesting case studies to show you this time. In modern P&R designs, the metal routes on a particular layer are unidirectional (or at least primarily unidirectional). Long p... » read more

Patterning Interconnects At 10nm And Below
By Applied Materials - 20 Aug, 2015 - Comments: 0

By Connie Duncan Chip manufacturers today build billions of transistors on a chip, delivering incredible computing power to consumers. What often gets overlooked is how hard it’s getting to create the many miles of ultra-thin copper wiring used to connect each of the transistors. Patterning these electrical pathways is becoming increasingly challenging as they grow denser and finer, and any ... » read more

Challenges And Opportunities for China in the Semiconductor Industry
By SEMI - 20 Aug, 2015 - Comments: 0

By Allen Lu China’s new industry investment and government promotion policies represent major opportunities for China and global semiconductor companies. The global industry is closely watching the details of the policy and its implementation ─ both because of the resources China’s government has dedicated and the potential impact to the global semiconductor manufacturing supply chain. I... » read more

Complementary E Beam Lithography
By eBeam Initiative - 19 Aug, 2015 - Comments: 0

Multibeam Chairman David Lam looks at complementary E-Beam lithography (CEBL) and the impact of 1D design and pitch division. [youtube vid=nyvplBl4HA4] » read more

Pathfinding Beyond 10nm
By Paula Doe - 10 Aug, 2015 - Comments: 0

After higher aspect-ratio finFETs and higher mobility SiGe and III-V materials, the industry will move to lateral nanowires and then to vertical nanowire transistors, and to new tunnel junction FETs or spin wave architectures ─ or to various combinations of these technologies for different applications, reported An Steegan, Imec senior vice president of process technology, during SEMICON West... » read more

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