category: Blogs – MD

category: IoT, Security & Automotive

Surprises At SEMICON West
By Joanne Itow - 23 Jul, 2015 - Comments: 0

As companies such as TSMC and Intel spend less on capital expenditures this year, expectations for SEMICON West 2015 were pretty bleak. I thought I’d have fewer appointments and nothing to really write home about. Au contraire. Although traffic on the show floor was nothing compared to events like CES, there are three things that are driving growth and excitement at semiconductor equipment... » read more

5 Technologies To Watch
By Mark LaPedus - 23 Jul, 2015 - Comments: 0

The industry is developing a dizzying array of new technologies. In fact, there are more new and innovative technologies than ever before. And the list is countless. At least from my vantage point, I have come up with my own list of the top five technologies to watch in 2015 and beyond. They are listed in alphabetical order. (See below). Obviously, there are more than just five technologi... » read more

Not All Scientific Problems Can Be Solved
By Ed Sperling - 18 Jun, 2015 - Comments: 0

In the early part of the 20th century psychologist Karl Lashley set out to locate and study the engram, the memory storage center for the human brain. He never found it. In fact, he ended up disproving the theory that an engram even exists, which was far more important to the understanding of the brain than if he had proven the existence of an engram. The results of more than six decades of ... » read more

Capex Growing To A Record High In 2015
By Adrienne Downey - 18 Jun, 2015 - Comments: 0

Semiconductor companies are spending more than ever to stay competitive. In 2015, the total amount spent for capital expenditures is forecast to be $68.7 billion, up 9% from 2014’s $63.3 billion. This breaks the previous record set in 2011 at $63.8 billion, as shown in the following graph. Total Semiconductor Capital Expenditures, 2009-2015 Source: Semico Research Corp. The Top 15 A... » read more

Conquering Heat Issues In e-beam Lithography
By eBeam Initiative - 18 Jun, 2015 - Comments: 0

By Noriaki Nakayamada What's the best way to deal with the menacing heating effects in VSB mask writing? The answer lies in part on leveraging GPU acceleration. Check out this video on what's ahead for multi-beam mask writing. [youtube vid=Ij2l3hk6aFg] —Noriaki Nakayamada is group manager at NuFlare Technology. » read more

Case Studies In Double-Patterning Debug
By David Abercrombie - 18 Jun, 2015 - Comments: 0

Double patterning (DP) impacts just about every part of the design and manufacturing flows. However, the kinds of issues you encounter, the way they manifest themselves, and the ideal way to address them may be very different in different parts of these flows. I feel like I have spent a lot of time the last six months or so working with place and route (P&R) and chip finishing engineers on DP i... » read more

Japan: Finding Leadership In New Technology Areas
By SEMI - 18 Jun, 2015 - Comments: 0

By Osamu Nakamura The semiconductor industry is a technology-driven industry — and technology invention and innovation are the engines that drive industry growth. Japan has seen the global landscape for semiconductor manufacturing change, and in turn, Japan’s semiconductor industry has been changing, finding technology leadership opportunities in emerging technology areas that lead to grow... » read more

Fab Tool M&A Slowdown?
By Mark LaPedus - 18 Jun, 2015 - Comments: 0

The semiconductor industry is in the midst of a dizzying array of mergers and acquisitions. At the current pace, some 32% of all U.S. publicly traded semiconductor companies are projected to get acquired in 2015, according to FBR. But in reality, the M&A activity will slow and edge towards a 15% consolidation rate for the year, according to the firm. Still, the IC industry is bracing for... » read more

The Future Is Flexible
By Max McDaniel - 18 Jun, 2015 - Comments: 0

For the next installment in my display survey series, I will focus on advanced display technologies coming down the pipeline and how materials engineering solutions will enable tomorrow’s TVs and mobile devices to be flexible, bendable and foldable. [caption id="attachment_20529" align="alignnone" width="438"] Source: Samsung[/caption] I touched on this topic at the recent SID Display W... » read more

New Approaches To Imaging For Both Large And Small
By Michael Watts - 08 Jun, 2015 - Comments: 0

Imaging is the common theme for everything at Photonics West this year, and two new ideas caught my attention—a near field very small microscope and a new way of collecting images that separates reflected light from indirect light. IMEC has presented papers about its near field microscope before. This year the research house has reduced it to a product. The idea is to illuminate a object w... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy