category: Blogs – PTES

category: IoT, Security & Automotive

The Next Big Generation
By Judy Davies - 15 Jan, 2019 - Comments: 0

As members of the global semiconductor business, we are continually looking to identify the next big thing (NBT) that will drive market growth. Typically, we try to predict which new product – from smart vehicles to wearable electronics – will become the next mass-market item that will boost our industry into a successively higher orbit. Thanks to the innovators and visionaries among us, th... » read more

Food for Thought
By Judy Davies - 10 Dec, 2018 - Comments: 0

Eating healthy, getting plenty of rest and exercising regularly are the main ingredients in the recipe for wellness and fitness. But with today’s hectic lifestyles and hurried pace, do most of us still meet these basic requisites? Over the years, multiple programs have been launched to optimize the nutritional content of the foods we eat. Since the early 1900s, breakfast cereals have been ... » read more

Love and Affection in the Age of Robots
By Judy Davies - 05 Nov, 2018 - Comments: 0

It is increasingly common to rely upon robotic devices to perform a wide range of tasks that were previously handled by humans. With robots becoming more pervasive in our lives, people are demonstrating a tendency to treat and relate to robot assistants as they would their pets and loved ones. We are beginning to project companion status on these mechanical tools. There is ample evidence tha... » read more

Virtual Packages Improve Signal Integrity
By Jeff McGuire - 23 Oct, 2018 - Comments: 0

The 112 Gb/s generation of SerDes has brought along excessive loss within the package, around 5 dBs of loss within each monolithic package. This loss markedly reduces the usefulness of these SerDes. MCM technology has progressed to where the use of 70mm packages is routine. Non-interposer MCMs easily can use 20 or more chiplets, plus large dies and passives can be used. These MCMs have low ... » read more

SerDes For Chiplets
By Jeff McGuire - 16 Oct, 2018 - Comments: 0

The XSR 56G and 112G Interoperability Agreements (IAs) announced by the OIF are intended to cover a channel consisting of a pair of up to 50mm. The primary defined application of the XSR SerDes is connecting a chip to a “nearby” optical engine. Because the requirements on these channels are much less stringent than they are on long reach channels, XSR SerDes are expected to have lower power... » read more

How Much Data Can Be Pushed Through Copper Wires?
By Jeff McGuire - 08 Oct, 2018 - Comments: 0

As the amount of digital data grows, so do requirements on the speed of the transmission at all levels of the transmission chain—between dies in a shared package, between packaged chips inside a device, and between devices. The communication channels encountered at every stage of this communication are different in nature. Those between dies in a shared package, or between packaged chips in a... » read more

Thinking Ahead To Society 5.0
By Judy Davies - 08 Oct, 2018 - Comments: 0

Industry 4.0 is a familiar term throughout the global semiconductor community. It conjures images of fully automated factories and computerized decision making at all levels of business. Less widely known is Japan’s thinking about the next step in technological evolution, which it calls Society 5.0. Instead of viewing upcoming technology advances as the fourth industrial revolution, Japan tak... » read more

Solving Fan-Out Wafer-Level Warpage Challenges Using Material Science
By Kim Yess - 10 Sep, 2018 - Comments: 0

Now more than ever we’re finding that semiconductor process engineers are turning to material scientists to help find solutions for their most complex challenges. Currently, they are looking for ways to improve fan-out wafer-level packaging (FOWLP), one of today’s hottest technologies for heterogeneous integration. Often, with these new advanced solutions come challenges that can impact ... » read more

Digital Fabrication’s Promise And Potential Pitfalls
By Judy Davies - 10 Sep, 2018 - Comments: 0

Semiconductor functionality continues to expand, enabling robotic machines to analyze problems, make decisions and communicate information better than ever. These capabilities open the door for new applications such as Industry 4.0, a term now commonly used throughout Europe and the U.S. (more on Japan’s interpretation to follow). By integrating the performance capabilities of the Internet of... » read more

Some Human Musings On Machine Learning
By Judy Davies - 06 Aug, 2018 - Comments: 0

Throughout our semiconductor industry, there are examples of binary balance. By that, I’m not just referring to the 1s and 0s in binary code. This balance also applies to n-well and p-well device features or the deposition and etching of materials on a wafer. This duality is present in our human makeup, too. We use both hard intellect and intangible feeling in recognizing challenges, findi... » read more

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