category: Blogs – PTES

category: IoT, Security & Automotive

Importance Of Certifications In Automotive IP
By Pawini Mahajan - 10 Oct, 2023 - Comments: 0

The automotive industry is renowned for its unwavering commitment to enforcing strict standards for enabling safety, quality, reliability, and security. However, upholding stringent measures to ensure vehicle safety and reliability has led to the need for predictive maintenance i.e., using advanced monitoring and analytical techniques as a part of Silicon Lifecycle Management (SLM) to anticipat... » read more

Delivering Real-Time Analytics To Semiconductor Test
By Eli Roth - 10 Oct, 2023 - Comments: 0

As defined by Moore’s Law, the semiconductor field has been growing at a steady pace since the 1960s. Concurrent with this progression, semiconductors are becoming more complex, densely integrated, and expensive to produce. While such advancements pose new challenges to semiconductor manufacturing, we can extend Moore’s Law well into the future by reimagining the way we approach the semicon... » read more

Particle Filter Material Choice For Raman And FTIR Microscopy
By Inga Koehler - 10 Oct, 2023 - Comments: 0

The filter material to analyze particulate matter with Raman or FTIR microspectroscopy plays a vital role. Their simple task is to filter liquids to isolate solids onto filters – but as soon as you introduce spectroscopic methods, the requirements on the filter increase drastically. But let’s start at the beginning: Which filters are at our disposal, and how do we select the right one for... » read more

Installing Yield Software Early In A Ramp Up
By Dieter Rathei - 10 Oct, 2023 - Comments: 0

In 1999, the White Oak Semiconductor Fab in Richmond, VA, was awarded the prestigious “Top Fab of the Year” (yes, that actually existed – proof attached!) by the leading semiconductor magazine of the time. Back then, I was a young engineer on the ramp up team and I recall that the reason we were chosen for the award was the incredibly short time in which we were able to ramp up production... » read more

The Glass Substrate Question: When Will It Replace Copper Clad Laminate?
By Keith Best - 12 Sep, 2023 - Comments: 0

"When will glass replace copper clad laminate on advanced IC substrates?" That’s a question many on the heterogeneous integration (HI) side of the semiconductor industry are asking. Unfortunately, the answer is not straightforward. But before we get to answering that, let’s take an advanced IC substrate (AICS) refresher. In other words, how did we get to the point where glass substrat... » read more

The Growing Importance Of PMIC Validation
By Kaitlynn Mazzarella - 12 Sep, 2023 - Comments: 0

In the ever-evolving world of technology, the semiconductor industry plays a pivotal role in shaping the devices we use daily. Among the countless components that make up these devices, Power Management Integrated Circuits (PMICs) have emerged as unsung heroes, silently ensuring the efficient use of power resources. PMICs are specialized integrated circuits designed to manage and regulate th... » read more

Automotive Safety Requires PVT Monitoring IP Within Semiconductor ICs
By Rohan Bhatnagar - 12 Sep, 2023 - Comments: 0

The modern automobile, especially with the move toward more electrification, presents huge challenges to the designers of vehicular electronics. Gone are the days of mechanical issues and oil changes being primary concerns. Today’s automobile has a high number of semiconductor chips performing functions for self-driving autonomous systems, advanced driver assistance systems (ADAS), connectivi... » read more

Test Strategies In The Era Of Heterogeneous Integration
By Fisher Zhang - 12 Sep, 2023 - Comments: 0

Moore’s Law, the observation that the number of transistors on an integrated circuit doubles approximately every two years, is critical to advances in computing technology. For decades, fabs have managed to achieve exponential growth in digital capability and transistor density by making transistors smaller and smaller, but we’ve hit the physical limits of these processes. Today, new proces... » read more

MMAF Option Enables Picoampere Measurements
By Yoshiyuki Aoki - 12 Sep, 2023 - Comments: 0

By Yoshiyuki Aoki and Tsunetaka Akutagawa Demand for low-current devices is increasing, as many new sensors are being created for medical, automotive, industrial, and other applications. Chief among the heightened production and test requirements for these low-current devices is the need to achieve picoampere (pA)-class measurements. Sensors’ functionality and efficacy, especially in medic... » read more

3D NAND Needs 3D Metrology
By Nick Keller - 08 Aug, 2023 - Comments: 0

By Nick Keller and Andy Antonelli You’ve read the reports: the memory market is floundering as the semiconductor industry moves through another scarcity/surplus cycle. Be that as it may, innovation is happening as the industry continues to pursue increasingly higher three-dimensional stacks, with 3D NAND stacks taller than 200 layers entering production. However, there are challenges... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy