category: A System Perspective

category: IoT, Security & Automotive

IP Qualification During RTL Synthesis
By Sudhakar Jilla - 23 Feb, 2017 - Comments: 0

By Sudhakar Jilla and Arvind Narayanan The use of IP (intellectual property) as basic building blocks is an established practice for SoC designs. Most IP is developed without chip-level context and very little knowledge about physical design, which can introduce unwanted schedule risk into the design process. Much of the risk of IP development can be mitigated by using new physical synthesis... » read more

Real-Time Performance Across The Factory Floor
By Andrew Caples - 26 Jan, 2017 - Comments: 0

Next generation processors continue to push the performance envelope. It seems the price continues to drop while the processing speeds increase with each new processor release. I recall discussions not that long ago in which the future utility of real-time operating systems and middleware were being bantered about as if they were not going to be required going forward. After all, with each subs... » read more

Transistor-Level Defect Diagnosis
By Geir Eide - 22 Dec, 2016 - Comments: 0

Each new semiconductor process node represents exciting opportunities for suppliers of design, manufacturing, test, and failure analysis solutions. A new process means new challenges to solve, and hopefully more money to be made. On the flip side, whenever solutions that address these new challenges are presented, we seldom hear how useful these are to more mature process nodes. One technology ... » read more

Avoiding The Barriers For Multi-Board Systems Design Development
By Dave Wiens - 22 Nov, 2016 - Comments: 0

Designing electronic systems that comprise multiple interacting boards, connectors and cables requires a multi-discipline team collaboration to effectively manage design complexity for optimum product performance and reliability. Multi-board systems may comprise two boards or up to hundreds of boards, packing a cabinet or rack, with interconnected connectors and/or cables. Since the hardware fu... » read more

Industry 4.0 And The Internet Of Manufacturing For PCB Assembly & Fabrication
By Michael Ford - 27 Oct, 2016 - Comments: 0

For years, the PCB manufacturing industry has needed a robust real-time, comprehensive shop-floor communication standard that would include detailed, bidirectional, machine-to-machine communication, as well as shop-floor to IT computerization communication. Now, there is a solution: the Open Manufacturing Language (OML), an open communications specification managed through a community of indust... » read more

Moving Automotive Test Into The Analog Domain
By Steve Pateras - 29 Sep, 2016 - Comments: 0

The amount of electronic content in passenger cars continues to grow rapidly, driven mainly by the integration of various advanced safety features. The industry’s move towards fully autonomous vehicles promises to even further increase the number of these safety features and consequentially, the electronic content required in each vehicle. Recent reports indicate that hundreds of semicondu... » read more

The Rise Of Complex Debug On Heterogeneous Multicore SoCs
By Kathy Tufto - 25 Aug, 2016 - Comments: 0

When projects move away from discrete development of loosely coupled systems to an integrated heterogeneous environment, elephantine debugging challenges are created. These challenges do not exist during discrete development because developers are able to design, develop, test, and optimize within the confines of their own device. But when consolidating heterogeneous systems, developers and ... » read more

Advanced Analog And Mixed Signal Design Continues Pushing The Design Envelope
By Paul Musto - 28 Jul, 2016 - Comments: 0

As PCB design has evolved into its present form with extremely complex boards housing high speed circuitry in very small areas, analog and mixed signal (AMS) and high speed analysis can address the latest design challenges. Analog/mixed signal design More and more products incorporate more than just digital circuitry. The vast majority of products now integrate digital and analog circuitr... » read more

Improve DFT Verification And Meet Time-To-Market Goals With Emulation
By Steve Dondershine - 30 Jun, 2016 - Comments: 0

What if all the DFT verification on your next big chip could be completed before tape-out? This “shift-left” of DFT verification would eliminate the need for shortcuts in verification and allow for more types of verification. The benefits of faster and earlier DFT verification include higher confidence in the “golden” RTL, eliminating DFT from the critical path of tape-out, and more pre... » read more

What I Learned About Heatsinks Using Thermal Simulation
By Mentor, a Siemens Business - 26 May, 2016 - Comments: 1

By Yousaf Mohammed, Student Intern at Mentor Graphics When designing electronics, heat dissipated to the surroundings by micro devices is an important consideration because heat has a powerful and stringent effect on their operation and lifespan.  When an electronic device overheats, components start to wear out more quickly, degrade, cross the threshold into safe mode, and then stop functi... » read more

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