category: A System Perspective

category: IoT, Security & Automotive

Deep Space Design Considerations
By Nicolas Williams - 28 Apr, 2016 - Comments: 0

The linchpin technology in a deep space telescope is the ability to efficiently convert analog image sensor data into digital data in order to beam home high-resolution images of astronomical objects. The analog-to-digital converters (ADC) must perform flawlessly once deployed, because it is not feasible to drive out 1 million miles into space to fix any problems. The next-generation success... » read more

Enhanced Electro-Mechanical Collaboration
By Alex Grange - 24 Mar, 2016 - Comments: 0

By Alex Grange and Linda Mazzitelli Integrating electronics into its mechanical environment comes with a number of challenges that boil down to Collision and Connectivity (does the cabinet bang against that capacitor?) and Synchronization (is mechanical designing to the latest PCB design and vice versa?). The culprit to problems that arise usually is the result of poor communications. Mod... » read more

Can You Really Fry an Egg on a CPU?
By James Forsyth - 25 Feb, 2016 - Comments: 0

Solving complex thermal models with computational fluid dynamics (CFD) requires a lot of processing power, and a central processing unit (CPU) under full load generates a fair amount of heat. But can you cook an egg on it? Search online and you can find videos of people attempting to cook on their processors—I wouldn’t recommend this as a cooling solution. However, just out of curiosity, I ... » read more

Three Steps To Complete Power-Aware Debug
By Ellie Burns - 28 Jan, 2016 - Comments: 0

In previous blogs, we’ve talked about UPF and the successive refinement low power flow developed by ARM and Mentor Graphics (you can find these here.) In this blog we’d like to walk through some typical debugging scenarios our customers face in their low power designs. So I’ve asked two of our low power debug experts, Gabriel Chidolue and Mark Handover, to join me to make sure you get ... » read more

The Latest Power Management Techniques For Wearable Devices
By Warren Kurisu - 22 Dec, 2015 - Comments: 0

Wearable devices are popping up everywhere — across all markets. In part one of this wearables white paper series, I wrote about the market and technical factors driving the development and adoption of wearable devices. In part two, we roll up our sleeves and address one of the key requirements for wearable devices. Ah yes, power management. You don’t need super powers to see th... » read more

A Better Way To Measure Heat
By John Parry - 24 Nov, 2015 - Comments: 0

Are you an engineering manager with budget responsibility, concerned about the thermal performance of your company’s designs or manufactured products? Or, are you a senior engineer who is responsible for the thermal design or characterization of components and systems? In either situation, the results of using the transient thermal testing method would be of benefit to you. The method is non-... » read more

3D Thermal Simulation Of Resistive Heating
By Robin Bornoff - 29 Oct, 2015 - Comments: 0

Joule heating, also known as resistive or Ohmic heating, is the power lost to heat as electrical current flows down a conductor. We were introduced to Joule’s first law (Power dissipation = I²R, VI, V²/R) way back in high school. From an electronics thermal simulation perspective it requires a full 3D electrical flow simulation to be conducted, and from that the Joule heating power dissipat... » read more

Wearable Devices: A Limitless Future
By Warren Kurisu - 24 Sep, 2015 - Comments: 0

Today, there are many wearable systems across industries including medical and health care, safety, smartwatches, smart goggles and glasses, smart shoes and clothing — even smart pet trackers! So why is there such a proliferation of devices, even though many of these portable/embedded devices have been around for decades? There are a few key technical trends enabling these devices. F... » read more

Full AMS Design Flow For The IoT
By Mentor, a Siemens Business - 27 Aug, 2015 - Comments: 0

By Nicolas Williams and Jeff Miller The pressure for a new generation of (analog/mixed-signal) AMS design capabilities has been accelerated by the sudden demand for Internet of Things (IoT). These inexpensive devices are used in an expanding array of scenarios on the edge of the network — thus the demand for an AMS design environment that is affordable and easy to use, but powerful enough ... » read more

Why DSA Is Cost Effective For 7nm And Below
By Yuansheng Ma - 30 Jul, 2015 - Comments: 0

The upcoming 7nm process node presents tough challenges both for printability and cost. At 7nm and below, multi-patterning is required, which makes the manufacturing process more expensive by requiring more masks. To control costs, any alternative technology that provides equivalent yields with fewer patterning steps should be explored. One promising option is to use directed self-assembly (... » read more

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