category: A System Perspective

category: IoT, Security & Automotive

A Better Way To Measure Heat
By John Parry - 24 Nov, 2015 - Comments: 0

Are you an engineering manager with budget responsibility, concerned about the thermal performance of your company’s designs or manufactured products? Or, are you a senior engineer who is responsible for the thermal design or characterization of components and systems? In either situation, the results of using the transient thermal testing method would be of benefit to you. The method is non-... » read more

3D Thermal Simulation Of Resistive Heating
By Robin Bornoff - 29 Oct, 2015 - Comments: 0

Joule heating, also known as resistive or Ohmic heating, is the power lost to heat as electrical current flows down a conductor. We were introduced to Joule’s first law (Power dissipation = I²R, VI, V²/R) way back in high school. From an electronics thermal simulation perspective it requires a full 3D electrical flow simulation to be conducted, and from that the Joule heating power dissipat... » read more

Wearable Devices: A Limitless Future
By Warren Kurisu - 24 Sep, 2015 - Comments: 0

Today, there are many wearable systems across industries including medical and health care, safety, smartwatches, smart goggles and glasses, smart shoes and clothing — even smart pet trackers! So why is there such a proliferation of devices, even though many of these portable/embedded devices have been around for decades? There are a few key technical trends enabling these devices. F... » read more

Full AMS Design Flow For The IoT
By Mentor, a Siemens Business - 27 Aug, 2015 - Comments: 0

By Nicolas Williams and Jeff Miller The pressure for a new generation of (analog/mixed-signal) AMS design capabilities has been accelerated by the sudden demand for Internet of Things (IoT). These inexpensive devices are used in an expanding array of scenarios on the edge of the network — thus the demand for an AMS design environment that is affordable and easy to use, but powerful enough ... » read more

Why DSA Is Cost Effective For 7nm And Below
By Yuansheng Ma - 30 Jul, 2015 - Comments: 0

The upcoming 7nm process node presents tough challenges both for printability and cost. At 7nm and below, multi-patterning is required, which makes the manufacturing process more expensive by requiring more masks. To control costs, any alternative technology that provides equivalent yields with fewer patterning steps should be explored. One promising option is to use directed self-assembly (... » read more

Thermal Interface Materials: The Unknown Entity?
By Mathew Clark - 25 Jun, 2015 - Comments: 0

Thermal interface materials (TIMs) are becoming more important in all application areas and between different component parts. Any semiconductor, ranging from LEDs to high-power electronics, is becoming smaller, yet producing more power. In many ways the physical design limits have been reached for packaging, allowing entire components to have a total thermal resistance of less than 0.1 K/W. Ho... » read more

When Things Go Wrong Even When You’re Doing the Right Thing
By Joseph Hupcey III - 28 May, 2015 - Comments: 0

By Kurt Takara and Joe Hupcey III “Isolation. Retention. Level shifters. Dynamic voltage scaling. I’m doing all the right things to reduce the power consumption of my design by adding all of this power control logic. But because of this new low power circuitry, I’m seeing fresh clock domain crossing (CDC) problems that are making my design do all the wrong things; and my trusty old low... » read more

The Auto Industry Taking Things Into Their Own Hands
By Mathew Clark - 23 Apr, 2015 - Comments: 0

A new standard is here! I can hear a collective groan, but I suggest we quiet down and see what this new direction has to offer. When Audi AG, BMW AG, Daimler AG, Porsche AG, and Volkswagen AG get together to work up a document, there is a shift happening. Although this standard is not out-of-the-oven-fresh, it will mean a change in the industry in the near future. But before I continue, I want... » read more

Chip-Package-Board Optimization: The Future Of Integrated Co-Design
By John Park - 26 Mar, 2015 - Comments: 0

Multi-die and three-dimensional packages have made breakout and routing of extremely high-pin-count devices on PCBs very difficult. Keeping track of all the signals and pins is also a task that has just about outgrown current methods. Many companies simply use a spreadsheet for tracking signals. With no central database or accurate device modeling and rule-based optimization, design intent is o... » read more

Defining Functional Accuracy
By Jon McDonald - 26 Feb, 2015 - Comments: 0

I have been heavily involved in a project that recently completed. It involved creating virtual platforms (VPs) for a number of Altera’s FPGA SoCs. If you’re interested in more information, an announcement on the VP availability went out last week. Some of the modeled platforms existed and some were in various stages of development. The goal of the project was to deliver functionally acc... » read more

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