category: A System Perspective

category: IoT, Security & Automotive

Can We Efficiently Automate 2.5/3D IC ESD Protection Verification?
By Dina Medhat - 23 Sep, 2021 - Comments: 0

Protection against ESD events (commonly referred to as ESD robustness) is an extremely important aspect of integrated circuit (IC) design and verification, including 2.5/3D designs. ESD events cause severe damage to ICs due to a sudden and unexpected flow of electrical current between two electrically charged objects. This current may be caused by contact, an electrical short, or dielectric bre... » read more

In-Design Signoff DRC For Productivity Improvement
By Srinivas Velivala - 26 Aug, 2021 - Comments: 0

Microsemi, a wholly-owned subsidiary of Microchip Technology, produces a portfolio of semiconductor and system solutions for communications, defense and security, aerospace, and industrial markets. In addition to high-performance and radiation-hardened analog/mixed-signal integrated circuits, FPGAs, SoCs and ASICs, they also design power management products, timing and synchronization devices, ... » read more

Robust Variation-Aware Smart Power Designs For Silicon Success
By Nebabie Kebebew - 29 Jul, 2021 - Comments: 0

Power management ICs (PMICs) is a rapidly growing segment in the semiconductor industry. The growth has been fueled by the demand for Smart Power applications that include wearable electronics, mobile computing platforms, printers, hard disk drives (HDD), IoT devices, and the full array of automotive applications. According to a report from market research firm Coherent Market Insights, the gl... » read more

Shifting Left: Early Multi Physics Analysis For STCO
By Per Viklund - 24 Jun, 2021 - Comments: 0

With the economics of transistor scaling no longer universally applicable, the industry is turning to innovative packaging technologies to support system scaling demands and achieve lower system cost. This has led to the emergence of a system technology co-optimization (STCO) approach, in which an SoC is disaggregated into smaller modules (also known as chiplets) that can be asynchronously desi... » read more

Signoff DRC In P&R Lets You Get Better Products To Market Faster
By Srinivas Velivala - 27 May, 2021 - Comments: 0

Trust is generally a reflection of quality. You trust someone, be it an individual or a company, because they have, over time, consistently performed high-quality work. You trust a product because your past experience with that product has been positive, or the experiences of lots of other people have been positive. With that said, quality comes in shades and percentages. Most of us will happil... » read more

What Is Silicon Lifecycle Management? A Strategic Imperative
By Aileen Ryan - 22 Apr, 2021 - Comments: 0

The recent buzz about silicon lifecycle management speaks to the boom in high-stakes electronic devices. Whether it is an SoC used in a vehicle or in the datacenter, there are compelling reasons to monitor and analyze data regarding the design, realization, deployment, and field service of the device. While silicon lifecycle management is an emerging paradigm in the semiconductor industry, i... » read more

Aging Analysis Common Model Interface Gains Momentum
By Greg Curtis - 25 Mar, 2021 - Comments: 0

By Greg Curtis, Ahmed Ramadan, Ninad Pimparkar, and Jung-Suk Goo In February 2019, Siemens EDA wrote an article1 entitled “The Time Is Now for a Common Model Interface”. Since that time, we have continued to see increasing demand for aging analysis, not only in the traditional automotive space, but also in other areas of technology design, such as mobile communication and IoT application... » read more

Advancing IC And Systems Design With The Digital Twin
By Joseph Sawicki - 25 Feb, 2021 - Comments: 0

As many of you may have seen, we’ve passed a major milestone since Siemens announced its intent to acquire Mentor Graphics four years ago. As of January 1, 2021, “Mentor, a Siemens business” has become “Siemens EDA” and remains a segment of the larger Siemens Digital Industries Software organization. Siemens is bringing together one of the world’s most comprehensive EDA portfolios w... » read more

Have It All With No-Compromise DFT
By Geir Eide - 28 Jan, 2021 - Comments: 0

The dramatic rise in manufacturing test time for today’s large and complex SoCs is rooted in the use of traditional approaches to moving scan test data from chip-level pins to core-level scan channels. The pin-multiplexing (mux) approach works fine for smaller designs but can become problematic with an increase in the number of cores and the design complexity on today’s SoCs. The next revol... » read more

Optimizing Tool Integration Is Essential To Design Success
By James Paris - 22 Dec, 2020 - Comments: 0

By James Paris and Armen Asatryan The relationship between a place and route (P&R) application and the collection of system-on-chip (SoC) design implementation, analysis, and verification methodologies and tools has always been very much a two-way street. The P&R system is the base, if you will, of design implementation—it takes the virtual and makes it physical. However, it is use... » read more

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