Why 40G UCIe IP?

By Aparna Tarde - 31 Oct, 2024 - Comments: 0

AI applications are bringing new challenges to the semiconductor industry. There is an increased demand for greater bandwidth, especially for compute and networking applications to support the high data processing required by deep learning and machine learning algorithms. The requirements for these AI applications are different for die-to-die interfaces. Let’s take 100Tb networking switches a... » read more

Accelerating The Pace And Precision Of AI Chip Innovation

By Stelios Diamantidis - 29 Aug, 2024 - Comments: 0

The Hot Chips 2024 conference, which took place this week in Silicon Valley, was a showcase for AI chip innovation. The three-day program illustrated the race among both established chipmakers and new entrants to explore advanced architectures and embrace novel design solutions to deliver the next breakthrough AI processor. In this article, I share a few “hot takes” from the conference that... » read more

Enhancing RTL Design Efficiency: The Power And Benefits Of Integrated Development Environments

By Eldon Nelson - 25 Jul, 2024 - Comments: 0

In today's rapidly evolving semiconductor design landscape, efficiency and productivity are integral to success. It is here that Integrated Development Environments (IDEs) are making a significant impact. These software suites are much more than programming environments where designers input text or code. They represent a comprehensive ecosystem of tools, utilities, and functionalities, all des... » read more

Enabling 2.5D/3D Multi-Die Package

By Kenneth Larsen - 27 Jun, 2024 - Comments: 1

In the rapidly evolving world of ASIC design, the shift from monolithic to 2.5D and 3D multi-die architectures represents a significant leap forward. This approach, which integrates multiple chiplets (also knowns as dies) into a single package, demands not only a new level of IC design innovation but also an increased complexity in coordination and integration. At the forefront of this technolo... » read more

AI Accelerated Migration Of Existing Designs To New Processors

By Rob van Blommestein - 30 May, 2024 - Comments: 0

In this fast-paced digital age where speed, performance, and time-to-market are king, chip designers are under pressure to deliver high-performance computing that doesn’t compromise power efficiency. The constant demand for instantaneous data processing and sharing is pushing the boundaries of innovation in chip design. With this context, we revisit and revamp the insights from the Synopsys U... » read more

How To Get The Most Out Of Gate-All-Around Designs

By Andrew Appleby - 25 Apr, 2024 - Comments: 0

The semiconductor industry has relied on finFETs, three-dimensional field-effect transistors with thin vertical fins, for many generations of technology. However, the industry is reaching the limits of how much finFETs can be shrunk while maintaining their speed and power benefits, which are crucial for artificial intelligence (AI) and machine learning (ML) applications. The solution is the gat... » read more

Rapid Timing Constraints Signoff With Automated Constraint Management

By Rimpy Chugh - 28 Mar, 2024 - Comments: 0

Signoff of a system on chip (SoC) or IP design has multiple aspects, but often timing closure is the most challenging. Early use of a static timing analysis (STA) tool is clearly important, and such a tool must be tied closely into the logic synthesis process to make it more likely that the generated gate-level netlist will meet the desired timing. Power, performance, and area (PPA) goals can o... » read more

Navigating IoT Security

By Dana Neustadter - 29 Feb, 2024 - Comments: 0

By Dana Neustadter (Synopsys), Ruud Derwig (Synopsys), and Martin Rösner (G+D) IoT expansion requires secure and efficient connectivity between machines. Integrated SIM technology and remote SIM provisioning can make this possible. Subscriber Identity Module (SIM) cards have been around for a long time, with Giesecke+Devrient (G+D) developing and delivering the first commercial SIM car... » read more

Why Is The Power Device Market So Hot Right Now?

By Dermott Lynch - 25 Jan, 2024 - Comments: 0

Growing adoption of electric vehicles (EVs) and renewable energy sources is putting the spotlight on power semiconductor devices. These power devices have always been essential in determining the efficiency of a variety of systems, from small household electronics to equipment used in outer space. But as calls to reduce carbon emissions get louder, the market for these chips continues to flouri... » read more

Shedding More Light On Photonics For Multi-Die Systems

By Kenneth Larsen - 21 Dec, 2023 - Comments: 0

By Kenneth Larsen and Twan Korthorst Photonics harness the speed of light for fast, low-power, high-capacity data transfer. A tremendous amount of data needs to be moved swiftly across different components in a multi-die system. Considering this, exploiting the advantages of light is one way to mitigate heat dissipation and energy consumption concerns while delivering fast data transmission.... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

category: Looking Past The Horizon

category: IoT, Security & Automotive