category: Looking Past The Horizon

category: IoT, Security & Automotive

Design Challenges Of High-Speed Wireline Transmitters
By Samad Parekh - 27 Apr, 2023 - Comments: 0

By Samad Parekh and Noman Hai The need for higher bandwidth networking equipment as well as connectivity in the cloud and hyperscale data centers is driving the switch technology transition from 25T (terabytes) to 50T and soon to 100T. The industry has chosen Ethernet to drive the switch market, using 112G SerDes technology today and next generation architectures being designed to operate at... » read more

How AI Drives Faster Verification Coverage And Debug For First-Time-Right Silicon
By Taruna Reddy - 23 Mar, 2023 - Comments: 0

By Taruna Reddy and Robert Ruiz These days, the question is less about what AI can do and more about what it can’t do. From talk-of-the-town chatbots like ChatGPT to self-driving cars, AI is becoming pervasive in our everyday lives. Even industries where it was perhaps an unlikely fit, like chip design, are benefiting from greater intelligence. What if one of the most laborious, time-co... » read more

Beyond Human Reach: Meeting Design Targets Faster With AI-Driven Optimization
By James Chuang - 23 Feb, 2023 - Comments: 0

The implementation flow for semiconductor devices is all about optimizing for power, performance, area (PPA), or some combination of these attributes. The history of this flow in electronic design automation (EDA) tools is all about adding more automation, tightening iterative loops, and reducing the number of iterations. The goal is converging to the PPA targets faster while using fewer resour... » read more

Benefits Of A Silicon-Proven 800G Ethernet Solution For High-Performance Computing
By Madhumita Sanyal - 26 Jan, 2023 - Comments: 0

The evolution of high-speed Ethernet began in 2014 when Arista, Broadcom, Microsoft, Mellanox and Google formed the Ethernet Consortium, now called the “Ethernet Technology Consortium.” Since then, the technology has been adopted by more than 45 members. The push for 200G, then 400G, and now 800G Ethernet is driven by the insatiable need to process and transmit high-performance workloads in... » read more

Automated Late Stage Timing-Aware Dynamic Voltage Drop ECO
By Manoj Chacko - 09 Jan, 2023 - Comments: 0

One of the never-ending frustrations for electrical engineers is having to deal with counterproductive real-world effects that they wish would just go away. Examples include switch bounce, metastability, and contact resistance. For IC designers, dynamic voltage drop (DVD), also known as IR drop, is one of those unfortunate facts of the profession. There’s no way to avoid it; every trace and w... » read more

How The Electronics Industry Can Shape A More Sustainable, Energy-Efficient World
By Piyush Sancheti - 21 Dec, 2022 - Comments: 0

By Piyush Sancheti and Godwin Maben We’re already experiencing the effects of our world’s changing climate—devastating wildfires, prolonged droughts, torrential flooding, just to name a few examples. Global energy consumption is increasing, raising carbon dioxide levels and triggering extreme weather conditions. Two key forces driving these trends are the shift to hyperscale datacenter... » read more

Addressing Three Big Challenges In Silicon Realization
By Bradley Geden - 22 Nov, 2022 - Comments: 0

There is no better way to gain insight into prevailing technical challenges than bringing together industry experts to share experiences and proposed solutions. Silicon realization—the ability to design and build today’s complex semiconductors—is one domain with no shortage of challenges. The quest for the best power, performance, and area, and delivery of first-time-right silicon, requir... » read more

Ensuring Memory Reliability Throughout the Silicon Lifecycle
By Anand Thiruvengadam - 14 Nov, 2022 - Comments: 0

By Anand Thiruvengadam and Guy Cortez Memories are everywhere in modern electronics. Discrete memory chips account for much of the space on printed circuit boards (PCBs). Embedded memories consume much of the floorplan in system-on-chip (SoC) devices. Many multi-die chip configurations, including 2.5D/3DIC devices, are driven by the need for faster memory access. Designing and verifying memo... » read more

Digitizing Memory Design And Verification To Accelerate Development Turnaround Time
By Anand Thiruvengadam - 10 Oct, 2022 - Comments: 0

By Anand Thiruvengadam, Farzin Rasteh, Preeti Jain, and Jim Schultz Some digital design and verification engineers imagine that their colleagues working on analog/mixed-signal (AMS) chips are jealous. After all, the digital development flow has enjoyed the benefits of increased automation and higher levels of abstraction for many years. Hand-instantiated devices and manual interconnection we... » read more

Golden Signoff ECO For Last-Mile Electronic Design Closure
By Manoj Chacko - 03 Oct, 2022 - Comments: 0

Electronic design developers really hate iterative, resource-intensive tasks that occur late in the project schedule. Most engineers are under tremendous time to market (TTM) pressure due to competition while being told that they must minimize the cost of both the project and the end chip. In addition, they are struggling to meet power, performance, and area (PPA) requirements far more aggressi... » read more

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