Key Challenges In Scaling AI Clusters


AI is evolving at an unprecedented pace, driving an urgent need for more powerful and efficient data centers. In response, nations and companies are ramping up investments into AI infrastructure. According to Forbes, AI spending from the Big Tech sector will exceed $250 billion in 2025, with the bulk going towards infrastructure. By 2029, global investments in AI infrastructure, including dat... » read more

Bold Prediction: 50% Of New HPC Chip Designs Will Be Multi-Die In 2025


Monolithic chips have been the workhorses behind decades of technological advancement. But just as the industrial revolution saw workhorses replaced with more efficient and powerful machinery, the semiconductor industry is on the cusp of a similar revolution. Multi-die and chiplet-based designs — which integrate multiple specialized dies in a single package or stack integrated circuits ver... » read more

Top 5 Reasons Engineers Need A Smart NoC


As system-on-chip (SoC) designs grow more complex, IP interconnect engineers struggle with achieving optimal scalability, performance, and power efficiency. The increasing number of IP blocks, often ranging from 50 to more than 500, introduces significant interconnect congestion, timing closure issues, and power dissipation challenges. Additionally, many network-on-chip (NoC) design tasks are s... » read more

UCIe For 1.6T Interconnects In Next-Gen I/O Chiplets For AI Data Centers


The rise of generative AI is pushing the limits of computing power and high-speed communication, posing serious challenges as it demands unprecedented workloads and resources. No single design can be optimized for the different classes of models – whether the focus is on compute, memory bandwidth, memory capacity, network bandwidth, latency sensitivity, or scale, all of which are affected by ... » read more

Complete Transistor Level Electrical Checks With Formal Analysis


Nothing is worse for a design team than a chip that fails to work in the bringup lab. Electrical problems are historically a major cause of such failures. Power leaks, power-ground DC paths, missing level shifters, and design flaws such as high fanout lead to unexpected power consumption, incorrect functionality, and even total meltdown. Designers learned years ago that pre-silicon electrical c... » read more

From DIY To Advanced NoC Solutions: The Future Of MCU Design


The evolution of microcontrollers (MCUs) has significantly transformed embedded systems, shifting from simple, standalone processors to complex, multifunctional units that rival traditional systems-on-chip (SoCs). These advancements are fueled by the demand for increased computational efficiency, cutting-edge features like AI and machine learning (ML) integration, and the need to address growin... » read more

Gold In The Machine: Scaling Infrastructure For The Age Of AI


During the gold rush, hopeful prospectors flooded the west to make their fortunes in gold. Today, technology pioneers are looking to stake their claim in the realm of artificial intelligence (AI). Price Waterhouse Cooper (PWC) estimates that 45% of total global economic gains by 2030 will be driven by AI as more sectors embrace the productivity and product enhancement benefits of AI. PWC’s ... » read more

AI Infrastructure At A Crossroads


By Ramin Farjadrad and Syrus Ziai There is a big push to achieve greater scale, performance and sustainability to fuel the AI revolution. More speed, more memory bandwidth, less power — these are the holy grails. Naturally, the one-two punch of StarGate and DeepSeek last week has raised many questions in our ecosystem and with our various stakeholders. Can DeepSeek be real? And if so, w... » read more

Fast Monte Carlo Simulations For Timing Variation Analysis


Process variations and device mismatches profoundly affect the latest ultra-small geometrical processes. Complexity creates additional factors that impact device manufacturing variability, which in turn impact overall yield. Monte Carlo (MC) simulations use repeated random sampling to relate process variations to circuit performance and functionality, thus determining how they impact yield. How... » read more

What IoMT Really Stands For


The basic goals of engineering include the achievement of a product’s purpose, safety, cost, manufacturability, and supportability, among other things. For internet of things (IoT) applications, much of the essential purpose relates to wireless communications that untether communication from wires and cables. This is especially true of the rapidly growing internet of medical things (IoMT), wh... » read more

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