category: Low Power-High Performance

category: IoT, Security & Automotive

Software-Defined Vehicles for Dummies
By Arm - 11 Sep, 2024 - Comments: 0

This latest Dummies Guide takes you through the captivating world of software-defined vehicles (SDVs), offering important insights into the technologies and systems that propel SDVs, and their impact on the future of transportation. This book covers the foundational understanding of SDVs and progressively delves into their various aspects, exploring the potential implications of this rapidly ev... » read more

Striking A Balance On Efficiency, Performance, And Cost
By Ed Sperling - 11 Sep, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss power-related issues such as voltage droop, application-specific processing elements, the impact of physical effects in advanced packaging, and the benefits of backside power delivery, with Hans Yeager, senior principal engineer, architecture, at Tenstorrent; Joe Davis, senior director for Calibre interfaces and EM/IR product m... » read more

Research Bits: Sept. 9
By Jesse Allen - 09 Sep, 2024 - Comments: 0

All-silicon polarization multiplexer Researchers from the University of Adelaide and Osaka University propose an ultra-wideband integrated terahertz polarization (de)multiplexer implemented on a substrateless silicon base, which they tested in the sub-terahertz J-band (220-330 GHz) for 6G communications. “Our proposed polarization multiplexer will allow multiple data streams to be transmi... » read more

Liquid Cooling, Meeting The Demands Of AI Data Centers
By Barry Pangrle - 04 Sep, 2024 - Comments: 0

Many Porsche “purists” reflect forlornly upon the 1997, 5th generation, 996 version of the iconic 911 sports car. It was the first year of the water-cooled engine versions of the 911, which had previously been based on air-cooled engines since their entry into the market in 1964. The 911 was also the successor to the popular air-cooled 356. For over three decades, Porsche’s flagship 911 w... » read more

Research Bits: Sept. 3
By Jesse Allen - 03 Sep, 2024 - Comments: 0

3D printing of specialized antennas, sensors Researchers from the National University of Singapore developed a 3D printing technique that can be used to create three dimensional, self-healing electronic circuits. Called tension-driven CHARM3D, the technique enables the 3D printing of free-standing metallic structures without requiring support materials and external pressure. It uses Field�... » read more

Research Bits: Aug. 27
By Jesse Allen - 27 Aug, 2024 - Comments: 0

Ammonia-free GaN Researchers from Nagoya University discovered a way to grow gallium nitride (GaN) semiconductors without using ammonia. The process is both more environmentally friendly and allows for high-quality growth of crystals at a lower cost. Metal organic chemical vapor deposition (MOCVD) is the most common technique for GaN production, which uses ammonia (NH3) gas as the source of... » read more

Next-Gen High-Speed Communication In Data Centers
By Ed Sperling - 21 Aug, 2024 - Comments: 0

Data centers are being flooded with data. While more of it needs to be processed locally, much of it also needs to be moved around within a system and between systems. This has put a spotlight on a variety of new optical technologies and methodologies. Yang Zhang, senior product marketing manager at Cadence, talks about the rapid increase in different types of optics and optical scenarios being... » read more

Research Bits: Aug. 20
By Jesse Allen - 20 Aug, 2024 - Comments: 0

EUV mirror interference lithography Researchers from the Paul Scherrer Institute developed an EUV lithography technique that can produce conductive tracks with a separation of just five nanometers by exposing the sample indirectly rather than directly. Called EUV mirror interference lithography (MIL), the technique uses two mutually coherent beams that are reflected onto the wafer by two id... » read more

Reusable Power Models
By Brian Bailey - 14 Aug, 2024 - Comments: 0

Power is not a new concern, and proprietary models are available for some tasks, but the industry lacks standardization. The Silicon Integration Initiative (Si2) is hoping to help resolve that with an upcoming release of IEEE 2416, based on its Unified Power Model (UPM) work. The creation of any model is not to be taken lightly. There is a cost to its creation, verification and maintenance. ... » read more

Research Bits: Aug. 13
By Jesse Allen - 13 Aug, 2024 - Comments: 0

3D X-ray of chip interiors Researchers from the Paul Scherrer Institute, EPFL Lausanne, ETH Zurich, and the University of Southern California used X-rays to take non-destructive, three-dimensional images of the inside of a microchip at 4 nanometer resolution. To create the images, the researchers relied on a technique called ptychography, in which a computer combines many individual images ... » read more

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