category: Low Power-High Performance

category: Auto, Security & Edge AI

AI: Driving the Way to Safer and Smarter Cars
By Expedera - 10 Sep, 2025 - Comments: 0

As autonomous vehicles have only begun to appear on limited public roads, it has become clear that achieving widespread adoption will take longer than early predictions suggested. With Level 3 systems in place, the road ahead leads to full autonomy and Level 5 self-driving. However, it’s going to be a long climb. Much of the technology that got the industry to Level 3 will not scale in all th... » read more

A Lens Designer’s View Of Metaoptics: Aberration Theory For Flat Optics
By Synopsys - 10 Sep, 2025 - Comments: 0

By Dr. John R. Rogers and Dr. Yijin Ding. This paper covers a discussion of the Abbe Sine Condition and its implication for Flat Optics, including the effects of stop shift and substrate curvature. Following that, we apply Sweatt’s high index model of diffractive effects to develop a third-order aberration theory for diffractive, meta-, and hybrid optical systems, including the pos... » read more

Best Practices and HPC Strategies for Ansys Mechanical
By Ansys - 10 Sep, 2025 - Comments: 0

Mechanical engineers face growing complexity in structural simulations. Modeling intricate geometries, capturing nonlinear material behaviors, and ensuring accurate boundary conditions often push traditional computing resources to their limits. These challenges can lead to longer solve times, convergence issues, and difficulties interpreting results — all of which slow innovation and impact p... » read more

The Evolution of DRAM
By Ed Sperling - 08 Sep, 2025 - Comments: 1

DRAM has been around since 1966, but today it's still the same basic 1T 1C bit cell architecture. Yet changes are coming as DRAM is called upon to store and retrieve more data faster. Steve Woo, distinguished inventor and fellow at Rambus, talks about how DRAM works, why there are different flavors, the impact of cooling new solutions in denser configurations, and ongoing issues involving the s... » read more

Research Bits: Sept. 8
By Jesse Allen - 08 Sep, 2025 - Comments: 0

Gallium oxide pn diodes Researchers at Nagoya University fabricated functional gallium oxide pn diodes that can carry twice as much electrical current as previous gallium oxide diodes and waste less energy than silicon-based diodes. The key challenge in making the pn diode was creating a stable p-type gallium oxide layer. While gallium oxide's crystal structure easily accepts the atoms need... » read more

IBM Power Processor, This One Goes to 11
By Barry Pangrle - 08 Sep, 2025 - Comments: 0

Hot Chips 25 was held August 24-26 on the Stanford University campus again this year, with many exciting and interesting presentations. I’ve noticed an overall trend with more focus being placed on overall systems rather than the socket. As the conference name suggests, there’s a history of showcasing chips, but with the increased emphasis on AI and related large-scale computing, efficiency... » read more

Research Bits: Sept. 2
By Jesse Allen - 02 Sep, 2025 - Comments: 0

Microwave neural network Researchers from Cornell University designed an on-chip microwave neural network that can perform real-time frequency domain computation for tasks like radio signal decoding, radar target tracking, and digital data processing. By using interconnected modes produced in tunable waveguides, the device can handle data streams in the tens of gigahertz while consuming less t... » read more

Research Bits: August 26
By Jesse Allen - 26 Aug, 2025 - Comments: 0

THz-optical converter Researchers from École Polytechnique Fédérale de Lausanne (EPFL) and Harvard University designed a chip that can convert between electromagnetic pulses in the terahertz and optical ranges on the same device. Applications include communication, sensing, spectroscopy, and computing. The design embeds micron-sized transmission lines into a lithium niobate photonic chip... » read more

Research Bits: August 19
By Jesse Allen - 19 Aug, 2025 - Comments: 0

Co-packaged optics Researchers from the Massachusetts Institute of Technology (MIT) and Bridgewater State University developed a new way to co-package photonic and electronic chips that uses existing automated pick-and-place assembly equipment in traditional fabs along with a less-expensive passive alignment process. “We’ve developed a packaging design [for integrating photonics with el... » read more

System-Level Design For 1.6 Tbps Interoperability In AI Data Centers
By Madhumita Sanyal - 14 Aug, 2025 - Comments: 0

By Madhumita Sanyal and Diwakar Kumaraswamy The rapid escalation of AI/ML workloads—driven by increasingly large language models—is reshaping high-performance computing and AI data center architectures. Real-time inference and large-scale training are pushing the limits of compute and interconnect performance. With model sizes and parameter counts doubling every 4–6 months, infrastruct... » read more

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