MIPI Deployment In Ultra-Low-Power Streaming Sensors


Streams of data from higher-speed sensors pose throughput and latency challenges for designers. However, optimizing a design for those criteria can come at the expense of increased power consumption if not conceived and executed carefully. A device like a high-resolution, high-frame-rate home security camera in a non-wired application requiring frequent battery changes or recharging will likely... » read more

Overcoming Signal Integrity Challenges Of 112G Connections


One of the big challenges with 112G SerDes (and, to a lesser extent, all SerDes) is handling signal integrity issues. In the worst case of a long-reach application, the signal starts at the transmitter on one chip, goes from the chip to the package, across a trace on a printed-circuit board (PCB), through a connector, then a cable or backplane, another connector, another PCB trace, another pack... » read more

Effectively Monitor And Streamline Test Processes Using A DAQ


Manufacturing and field operations generate a high volume of data, and they are also fueling growth in the use of smart remote sensing and the Industrial Internet of Things (IIoT). The data that is generated gives users visibility into their operations in real time or near real time to help them make decisions quickly. Time is a critical factor when high-volume production lines go down, electri... » read more

Simulation With Taint Propagation For Security Verification


Security has arisen as a primary concern for many types of electronic devices. A wide range of malicious agents is constantly probing and looking for weaknesses to try to steal confidential information or exert unauthorized control. The need for security has been well understood and widely adopted in software for years. Techniques such as passwords, multi-factor authentication, and biometric ch... » read more

Workload Trace Generation


The intended audience for this document is a performance engineer preparing traces for performance prediction on new Arm hardware. It is expected that the reader understands the basic concepts of performance engineering such as: • Workload characterization • Identifying key aspects of a workload • Understanding how Performance Monitor Unit (PMU) events correlate to a workload Click her... » read more

Research Bits: Mar. 11


Ferroelectric nanosheets Engineers from the University of Sydney, RMIT University, University of New South Wales, and University of Technology Sydney created a liquid metal alloy of tin, zirconium, and hafnium. The alloy has a thin oxide layer crust that enables it to be used to harvest ultra-thin tin oxide nanosheets doped with hafnium zirconium oxide, which could then be 2D printed on a subs... » read more

Startup Funding: February 2024


A startup developing AI chips dedicated to low-power AI inferencing captured one of the largest rounds of February. The startup, Recogni, already offers a low-power vision inferencing chip. Several other sizeable rounds were focused on the automotive space, with robotaxis, autonomous delivery, and the sensors that enable them. Another active area, power electronics drew funding for several c... » read more

Research Bits: Mar. 5


Anti-ambipolar transistor Materials scientists from the City University of Hong Kong propose using transistors made of mixed-dimensional nanowires and nanoflakes to create multivalued logic devices. By combining GaAsSb nanowires and MoS2 nanoflakes, the team created a hetero-transistor with anti-ambipolar transfer characteristics, in which positive (holes) and negative (electron) charge car... » read more

Research Bits: Feb. 27


Phonon-magnon reservoir Researchers from TU Dortmund, Loughborough University, V. E. Lashkaryov Institute of Semiconductor Physics, and University of Nottingham were inspired by the human eye to propose an on-chip phonon-magnon reservoir for neuromorphic computing. In reservoir computing, input signals are mapped into a multidimensional space, which is not trained and only expedites recogni... » read more

New Issues In Power Semiconductors


The number of challenges is growing in power semiconductors, just as it is in traditional chips. Thermal dissipation and gradients, new design rules, and layout issues need to be considered, especially in the context of higher voltage and increased performance demands. Roland Jancke, design methodology head in Fraunhofer IIS’ Engineering of Adaptive Systems Division, talks about issues in int... » read more

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