category: Low Power-High Performance

category: IoT, Security & Automotive

Week In Review: Design, Low Power
By SE Staff - 19 May, 2023 - Comments: 0

Design Ansys has signed a definitive agreement to acquire EDA tool company Diakopto. Diakopto specializes in software tools that find the cause of layout parasitics. Its products are ParagonX, for analyzing and debugging IC designs and layout parasitics, and EM/IR analysis/verification tool PrimeX. The deal is expected to close in the second quarter of 2023. SEMI’s FlexTech community issu... » read more

Research Bits: May 16
By Jesse Allen - 16 May, 2023 - Comments: 0

Germanium-tin transistor Scientists at Forschungszentrum Jülich, CEA-Leti, University of Leeds, Leibniz Institute for High Performance Microelectronics, and RWTH Aachen University fabricated a new type of transistor from a germanium-tin alloy. Charge carriers can move faster in the material than in silicon or germanium, which enables lower voltages in operation. “The germanium–tin syst... » read more

GDDR6 Delivers The Performance For AI/ML Inference
By Frank Ferro - 15 May, 2023 - Comments: 0

AI/ML is evolving at a lightning pace. Not a week goes by right now without some new and exciting developments in the field, and applications like ChatGPT have brought generative AI capabilities firmly to the forefront of public attention. AI/ML is really two applications: training and inference. Each relies on memory performance, and each has a unique set of requirements that drive the choi... » read more

Holistic Power Reduction
By Brian Bailey - 11 May, 2023 - Comments: 0

The power consumption of a device is influenced by every stage of the design, development, and implementation process, but identifying opportunities to save power no longer can be just about making hardware more efficient. Tools and methodologies are in place for most of the power-saving opportunities, from RTL down through implementation, and portions of the semiconductor industry already a... » read more

From Known Good Die To Known Good System With UCIe IP
By Manuel Mota - 11 May, 2023 - Comments: 0

Multi-die systems are made up of several specialized functional dies (or chiplets) that are assembled in the same package to create the complete system. Multi-die systems have recently emerged as a solution to overcome the slowing down of Moore’s law by providing a path to scaling functionality in the packaged chip in a way that is manufacturable with good yield. Additionally, multi-die sy... » read more

Making Tradeoffs With AI/ML/DL
By Ann Mutschler - 11 May, 2023 - Comments: 0

Machine learning, deep learning, and AI increasingly are being used in chip design, and they are being used to design chips that are optimized for ML/DL/AI. The challenge is understanding the tradeoffs on both sides, both of which are becoming increasingly complex and intertwined. On the design side, machine learning has been viewed as just another tool in the design team's toolbox. That's s... » read more

Rethinking Engineering Education In The U.S.
By Karen Heyman - 11 May, 2023 - Comments: 8

The CHIPS Act, as well as the ongoing need for talent, is causing both industry and academia in America to rethink engineering education, resulting in new approaches and stronger partnerships. As an example, Arizona State University (ASU) now has a Secure, Trusted, and Assured Microelectronics Center (STAM). The center offers an interdisciplinary approach to learning secure and trusted semic... » read more

Circuit Design For Industry 4.0
By Bjorn Zeugmann - 11 May, 2023 - Comments: 0

By Björn Zeugmann and Olaf Enge-Rosenblatt The digitalization of industry is progressing in leaps and bounds, albeit not at the same speed everywhere. In many industries, processes can be digitalized well to very well — for example, because electronic control systems can be retrofitted from analog to digital relatively easily. In some cases, new industries emerge only because processes ha... » read more

Making It Easier To Build Platforms That Support Confidential Computing
By Mark Knight - 11 May, 2023 - Comments: 0

With the rise of the cloud, computation has become highly distributed. Workloads can be running on many compute nodes and often span multiple data centers. A workload consists of a combination of code and data, and both are often valuable and sensitive. A data center is often managed by a third-party, such as Cloud Service Provider (CSP), and may reside in a different legal jurisdiction to the ... » read more

3D-IC Design: An Innovative Approach To Chip Integration
By Akanksha Soni - 11 May, 2023 - Comments: 0

Advancements in technology have led to the development of increasingly complex and densely integrated circuits (ICs). To keep up with the ever-growing demand for high-performance and power-efficient devices, the industry has shifted toward 3D-IC design. 3D-ICs have many applications in a wide range of industries, including consumer electronics, telecommunications, computing, and automotive. Wh... » read more

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