Research Bits: March 21


Micropatterning with sugar A scientist at the National Institute of Standards and Technology (NIST) discovered a transfer printing process that can deposit microcircuit patterns on curved and textured surfaces using sugar candy. Transfer printing methods, such as flexible tapes, are often used for surfaces that are difficult to directly print on. But they have difficulty with conforming to ... » read more

Cooling The Data Center


Since British mathematician and entrepreneur Clive Humby coined the rallying cry, “Data is the new oil,” some 20 years ago, it has been an upbeat phrase at data science conferences. But in engineering circles, that increasingly includes a daily grind of hardware challenges, and chief among them is how to cool the places where all that data is processed and stored. An estimated 65 zettaby... » read more

AI Benchmarks Are Broken


Artificial Intelligence (AI) is shaping up to be one of the most revolutionary technologies of our time. By now you’ve probably heard that AI’s impact will transform entire industries, from healthcare to finance to entertainment, delivering us richer products, streamlined experiences, and augment human productivity, creativity, and leisure. Even non-technologists are getting a glimpse of... » read more

Research Bits: March 14


Shift register-in-memory architecture Researchers at the Singapore University of Technology and Design propose a new reconfigurable shift register-in-memory architecture for devices that can work both as a reconfigurable memory component and as a programmable shift register. The device is based on phase-change alloys, which can switch reversibly between the glassy amorphous state and the or... » read more

Self-Heating Issues Spread


With every new node there are additional physical effects that must be considered, but not all of them are of the same level of criticality. One that is being mentioned more frequently is self-heating. All devices consume power and when they do that, it becomes heat. "In essence, all active devices generate heat as carriers move, creating channels for current to pass through the gates," says... » read more

Week In Review: Design, Low Power


Arm is expected to list solely on a U.S. stock exchange when it goes public again later this year, forgoing the London Stock Exchange for now, the BBC reports. Global investment banks expect the offering to value the company between $30 billion and $70 billion, according to Bloomberg. Disaggregating chips into specialized processors, memories, and architectures is becoming necessary for cont... » read more

Enabling New Server Architectures With The CXL Interconnect


The ever-growing demand for higher performance compute is motivating the exploration of new compute offload architectures for the data center. Artificial intelligence and machine learning (AI/ML) are just one example of the increasingly complex and demanding workloads that are pushing data centers to move away from the classic server computing architecture. These more demanding workloads can be... » read more

100G Ethernet IP For Edge Computing


The presence of Ethernet in our lives has paved the way for the emergence of the Internet of Things (IoT). Ethernet has connected everything around us and beyond, from smart homes and businesses, to industries, schools, and governments. This specification is even found in our vehicles, facilitating communication between internal devices. Ethernet has enabled high-performance computing data cent... » read more

Uneven Circuit Aging Becoming A Bigger Problem


Circuit aging is emerging as a first-order design challenge as engineering teams look for new ways to improve reliability and ensure the functionality of chips throughout their expected lifetimes. The need for reliability is obvious in data centers and automobiles, where a chip failure could result in downtime or injury. It also is increasingly important in mobile and consumer electronics, w... » read more

IEDM: Backside Power Delivery


One part of the short course that I attended at IEDM in December was about backside power delivery networks. It was presented by Gaspard Hiblot of imec and titled "Process Architectures Changes to Improve Power Delivery." The presentation is co-credited with Geert Hellings and Julien Ryckaert. I should preface this post with the fact that this presentation was 80 slides long and so I will only... » read more

← Older posts Newer posts →