category: Low Power-High Performance

category: IoT, Security & Automotive

Power/Performance Bits: Oct. 19
By Jesse Allen - 19 Oct, 2021 - Comments: 0

Post-quantum crypto chip Researchers at the Technical University of Munich (TUM) designed and had fabricated an ASIC to run new encryption algorithms that can stand up to quantum computing. “Ours is the first chip for post-quantum cryptography to be based entirely on a hardware/software co-design approach,” said Georg Sigl, Professor of Security in Information Technology at TUM. “As a... » read more

Get Ready For The Next Generation Of Wearable Tech
By Brian Bailey - 18 Oct, 2021 - Comments: 0

Wearables have attracted a lot of attention recently, due to both their successes as well as failures. They bring together requirements for packaging, new substrates, power scavenging, low-power, novel connectivity, flexibility, durability, as well as fashion. While some of the challenges remain formidable, the long-term potential is driving the industry to look at what is possible. They are... » read more

Leveraging Symbolic Simulations For IO Verification
By Moninder Singh - 14 Oct, 2021 - Comments: 0

IO libraries and interface IPs are an important part of any integrated circuit design that needs to communicate with the outside world or other integrated circuits. Interface IPs are the literal gatekeepers to the flow of logical and electrical information from one IC to another to form today’s complex computer systems, influencing almost every aspect of our lives these days. Interface IPs (e... » read more

Six Things We Might Need For Pervasive Computing
By Remy Pottier - 14 Oct, 2021 - Comments: 1

There is little doubt that digital technology will become more pervasive than it is even now in the coming decades. Organizations like the Exponential Group argue that digital should be the first step in sustainability, estimating that hardware and software could help reduce emissions by 15% by 2030 and beyond by helping fine-tune buildings, factories, and other environments. Cars—already ... » read more

HBM3: Big Impact On Chip Design
By Ann Mutschler - 14 Oct, 2021 - Comments: 0

An insatiable demand for bandwidth in everything from high-performance computing to AI training, gaming, and automotive applications is fueling the development of the next generation of high-bandwidth memory. HBM3 will bring a 2X bump in bandwidth and capacity per stack, as well as some other benefits. What was once considered a "slow and wide" memory technology to reduce signal traffic dela... » read more

Challenges In RF Design
By Roland Jancke - 14 Oct, 2021 - Comments: 0

Designing highly integrated components for radio frequency applications poses special challenges for system engineers, designers and the commissioning engineers. The boundary between chip, package and board is increasingly vanishing on modern components. It is growing more common for parts of the functionality to be moved to the package or even the board. In some cases, the requirements have be... » read more

Architecting Interposers
By Brian Bailey - 14 Oct, 2021 - Comments: 0

An interposer performs a similar function as a printed circuit board (PCB), but when the interposer is moved inside a package the impact is significant. Neither legacy PCB nor IC design tools can fully perform the necessary design and analysis tasks. But perhaps even more important, adding an interposer to a design may require organizational changes. Today, leading-edge companies have shown ... » read more

How To Identify Common Electronic Failures
By Tyler Ferris - 14 Oct, 2021 - Comments: 0

Failure analysis is the process of identifying, and typically attempting to mitigate, the root cause of a failure. In the electronics industry, failure analysis involves isolating the failure to a location on a printed circuit board assembly (PCBA) before collecting more detailed data to investigate which component or board location is functioning improperly. A member of the Ansys Reliabil... » read more

Will Co-Packaged Optics Replace Pluggables?
By Bryon Moyer - 14 Oct, 2021 - Comments: 0

As optical connections work their way deeper into the data center, a debate is underway. Is it better to use pluggable optical modules or to embed lasers deep into advanced packages? There are issues of convenience, power, and reliability driving the discussion, and an eventual winner isn’t clear yet. “The industry is definitely embracing co-packaged optics,” said James Pond, principal... » read more

Choosing A Gate Driver For Silicon Carbide MOSFETs
By Olaf Bendix - 14 Oct, 2021 - Comments: 0

If you are going to use a silicon carbide (SiC) MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor) in your next development, you will ask yourself: how do I develop the best gate driver for it? The answer to this question is: identify a suitable gate driver IC based on the peak current and power dissipation requirements of your application and a fitting gate resistor for your SiC... » read more

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