More 2.5D/3D, Fan-Out Packages Ahead


A new wave of 2.5D/3D, fan-out and other advanced IC packages is expected to flood the market over the next year. The new packages are targeted to address many of the same and challenging applications in the market, such as multi-die integration, memory bandwidth issues and even chip scaling. But the new, advanced IC packages face some technical challenges. And cost remains an issue as advan... » read more

The Next Semiconductor Revolution


What will drive the next semiconductor revolution? When you ask people with decades of experience in semiconductor manufacturing and software development, the answers include everything from AI and materials to neuromorphic architectures. Federico Faggin, designer of the world's first microprocessor; Terry Brewer, president and CEO of Brewer Science; Sanjay Natarajan, corporate vice presi... » read more

Manufacturing Bits: Jan. 14


Tracking cell movement Using a technology called cyro-electron microscopy (cryo-EM), Sanford Burnham Prebys Medical Discovery Institute (SBP) and the University of North Carolina at Chapel Hill (UNC-Chapel Hill) have gained a better understanding of how cells move in living organisms. Cells, the basic building blocks of living things, need to move. Moving cells help enable embryonic develop... » read more

Striking the Right Chord for Chiplet Integration


The growing digitalization of our society has made our lives connected and, in many aspects, easier. But the digital revolution also implies that the total amount of data processed in the world is doubling every two years or so. Electronic devices such as mobile phones, laptops, satellites, servers or self-driving vehicles must cope with twice as much data, at higher speeds. Traditional signali... » read more

Vapor-Deposited Octadecanethiol Masking Layer on Copper for Selective Hf3N4 ALD


Full title: Vapor-deposited octadecanethiol masking layer on copper to enable area selective Hf3N4 atomic layer deposition on dielectrics studied by in situ spectroscopic ellipsometry Journal of Vacuum Science & Technology A 36, 031605 (2018); Authors: Laurent Lecordiera, Veeco Instruments Sebastiaan Herregods and Silvia Armini, IMEC Area-selective atomic layer deposition (AS-ALD) h... » read more

Week In Review: Manufacturing, Test


Trade and fab equipment The SEMI Industry Strategy Symposium (ISS) this week opened with the theme “Golden Age of Semiconductor: Enabling the Next Industrial Revolution.” The annual three-day conference gave the year’s first outlook of the global electronics manufacturing industry. Click here for a recap. SEMI and Imec are joining forces to drive innovation and deepen industry align... » read more

Reducing Advanced Packaging Costs


Semiconductor Engineering sat down with Chenglin Liu, director of package engineering at Marvell; John Hunt, senior director of engineering at ASE; Eric Tosaya, senior director of package manufacturing at eSilicon; and Juan Rey, vice president of engineering for Calibre at Mentor, a Siemens Business. What follows are excerpts of that discussion, which was held in front of a live audience at MEP... » read more

Manufacturing Bits: Jan. 8


Atom interferometry NASA and AOSense have demonstrated a prototype quantum sensor that uses a measurement technique called atom interferometry. The technology could one day enable more accurate gravitational measurements, climate-monitoring missions in space and other applications. Originally developed in the 1980s, atom interferometry is like today’s optical interferometry. Used in sc... » read more

Week In Review: Manufacturing, Test


OEMs and chipmakers Apple has reduced its revenue outlook to $84 billion for the quarter, down from $89 billion to $93 billion in its original forecast. The consensus on Wall Street was $91 billion. “The guide down was mostly attributed to weaker-than-expected iPhone demand in emerging markets, predominantly China,” said John Vinh, an analyst with KeyBanc Capital Markets, in a research not... » read more

FD-SOI At The Edge


Semiconductor Engineering sat down to discuss changes in the FD-SOI world and what's behind them, with James Lamb, deputy CTO for advanced semiconductor manufacturing and corporate technical fellow at Brewer Science; Giorgio Cesana, director of technical marketing at STMicroelectronics; Olivier Vatel, senior vice president and CTO at Screen Semiconductor Solutions; and Carlos Mazure, CTO at Soi... » read more

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